5M2210ZF324I5N - 2210 LE MAX V CPLD, 324-ball FBGA | Intel
MPN: 5M2210ZF324I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.71 | $8.71 |
| 10 | $8.2 | $82.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.45 | $3,225.00 |
| 1,000 | $5.95 | $5,950.00 |
Drop-in alternatives for 5M2210ZF324I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5M2210ZF324I5
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View Datasheet →5M2210ZF324A5N
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View Datasheet →5M2210ZF324I5N Maximum Ratings & Electrical Characteristics
| Product Type | CPLD - Complex Programmable Logic Device |
| Series | MAX V |
| Logic Elements (LEs) | 2210 |
| User I/O Pins (max) | 272 |
| Embedded User Flash | 172 Kbits |
| Internal Supply Voltage VCCINT | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltages VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package | 324-ball FBGA (LBGA) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature (Industrial) | -40 C to +100 C (TJ) |
| Programming Interface | JTAG (IEEE 1149.1) + ISP |
| Configuration Method | Non-volatile flash, instant-on |
| Hot Socketing | Supported |
| Typical Standby Current | 25 uA (Iccstndby, data-dependent) |
| Internal Oscillator | Yes |
| RoHS Status | Compliant |
5M2210ZF324I5N 324-ball fbga (lbga) Pin Configuration Guide
Complete pinout information for 5M2210ZF324I5N (324-ball fbga (lbga) package) with 272 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M2210ZF324I5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 272 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF324I5N is suitable for 6 applications: Industrial I/O Expansion and Glue Logic, Telecommunications Backplane Bridging, Automotive Body Electronics and Infotainment, Consumer Electronics Display and Key-Scan Interfaces, Power Sequencing and Supervisory Logic, Motor Control and PWM Generation.
Industrial I/O Expansion and Glue Logic
The 5M2210ZF324I5N is purpose-built for industrial I/O expansion where an MCU's native GPIO is insufficient. With 2210 LEs, 272 user I/Os, and multi-voltage VCCIO support (1.2 V to 3.3 V), the device bridges 3.3 V MCUs to 1.8 V sensors, opto-isolators, and 5 V-tolerant legacy peripherals in a single chip. Its 1.8 V VCCINT core (1.71 V to 1.89 V) draws only 25 uA typical standby current, ideal for always-on industrial controllers. Designers typically pair the CPLD with an STM32 or similar MCU to handle address decoding, PWM fan control, and watchdog logic that would otherwise consume main-processor cycles.
Recommended
Telecommunications Backplane Bridging
The 5M2210ZF324I5N serves as a deterministic, instant-on glue-logic bridge on telecom line cards where sub-millisecond boot is mandatory after power-up or brown-out recovery. The MAX V family's non-volatile flash configuration boots without an external boot PROM, while 172 Kbits of user flash accommodates small lookup tables and revision IDs. The 324-ball FBGA package supports high-pin-count parallel buses typical of TDM/PCM backplane interfaces, and the multi-voltage VCCIO banks interface cleanly to both legacy 3.3 V framers and modern 1.8 V SerDes logic on the same board.
Recommended
Automotive Body Electronics and Infotainment
With an industrial temperature range of -40 C to +100 C junction and hot-socketing tolerance, the 5M2210ZF324I5N suits automotive body controllers, HVAC modules, and infotainment I/O hubs. The 2210 LEs handle CAN/LIN gateway logic, key-scan matrices, and backlight PWM without burdening the main MCU. The non-volatile instant-on behavior is critical for CAN wake-up sequences that must complete within 100 ms of ignition. The 324-ball FBGA footprint supports dense routing on space-constrained instrument-cluster PCBs.
Recommended
Consumer Electronics Display and Key-Scan Interfaces
The 5M2210ZF324I5N's 272 user I/Os and instant-on flash configuration make it ideal for consumer product front-panel interfaces such as dishwasher, washing-machine, and microwave keypads that require 16x8 or larger key-scan matrices. The CPLD decodes the matrix, debounces inputs, drives LED backlight PWM at 200 Hz to 1 kHz, and presents a clean I2C or SPI interface to the main MCU. Standby current of 25 uA typical keeps always-on appliances within Energy Star idle budgets.
Recommended
Power Sequencing and Supervisory Logic
The 5M2210ZF324I5N excels at multi-rail power sequencing in FPGA-based designs, DSP modules, and ASIC prototyping boards where multiple voltage rails (1.0 V, 1.2 V, 1.8 V, 3.3 V) must come up in a specific order. The CPLD's multi-voltage VCCIO banks interface directly to each rail's PG (power-good) signal, and the device drives discrete MOSFET gate signals or EN pins on point-of-load converters. The instant-on flash eliminates the boot-PROM requirement seen with SRAM-based PLDs, while JTAG support enables in-system reprogramming of the sequencing script.
Recommended
Motor Control and PWM Generation
The 5M2210ZF324I5N generates precise, multi-channel PWM waveforms for BLDC motor control, stepper sequencing, and solenoid drivers where dedicated MCUs are overkill. Up to 272 user I/Os and deterministic pin-to-pin propagation delay support complementary PWM pairs with dead-time insertion, while the multi-voltage I/O banks interface directly to 3.3 V gate drivers or 1.8 V DSP controllers. JTAG-based ISP enables field firmware updates for motor-control calibration tables without disassembly.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF324I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF324I5 | 5M2210ZF324C4N | 5M2210ZF324C5N | 5M2210ZF324A5N | 5M1270ZF324I5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 2210 LEs | 1270 LEs |
| User Flash | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 172 Kbits | 8 Kbits |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | Automotive grade | -40 C to +100 C |
| User I/O (max) | 272 | 272 | 272 | 272 | 272 | 272 |
| VCCINT | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| VCCIO Options | 1.2 / 1.5 / 1.8 / 2.5 / 3.3 V | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage | Same multi-voltage |
| Qty-1 Price (USD, 2026-09-06) | 8.71 | Similar | Slightly lower | Slightly higher | Higher (automotive) | Lower (smaller die) |
Key Differentiators
- Highest logic density in the MAX V 324-ball FBGA family (vs 5M1270ZF324I5N)
- Industrial temperature grade for harsh environments (vs 5M2210ZF324C4N)
- Multi-voltage I/O in a single device (vs 5M160ZE64I5N (MAX V E64-package lower-density cousin))
Design Notes
The 5M2210ZF324I5N requires a clean 1.8 V VCCINT rail (1.71 V to 1.89 V) and one or more VCCIO rails (1.2 V to 3.3 V). Place a 0.1 uF X7R ceramic capacitor within 3 mm of each VCCINT pin pair, and a single 10 uF bulk capacitor per VCCIO bank. Use a ferrite bead on the VCCINT feed if the upstream LDO is shared with a noisy switching converter. Power-up sequence is not strictly required (the device is hot-socketing tolerant), but a monotonic 1.8 V ramp avoids I/O tri-state glitches during initialization.
The 324-ball FBGA has a 1.0 mm ball pitch, which requires laser-drilled micro-vias and a 4-layer or 6-layer stack-up for reliable assembly. Escape-route all VCCINT and GND balls to inner ground/power planes with short stubs (less than 0.5 mm). Keep JTAG TDI/TDO/TMS/TCK traces short (under 50 mm) and length-matched to within 5 mm. Use 0.8 mm or 1.0 mm BGA escape vias and follow Intel/Altera's reference layout in the MAX V handbook for fan-out details.
Estimated: at typical commercial use with 50% I/O toggling at 50 MHz, the 5M2210ZF324I5N dissipates roughly 0.3 W to 0.6 W. The 324-ball FBGA has a theta-JA of approximately 25 C/W on a JEDEC 4-layer test board, giving a junction-to-ambient rise of 8 C to 15 C. At the +100 C industrial junction limit, this keeps the design within safe thermal envelopes. For higher I/O toggle rates or extended industrial enclosures, use thermal vias under the package center balls to a dedicated ground plane.
Do not leave unused I/O pins floating - configure them as LVCMOS inputs with internal weak pull-up enabled, or drive them to a defined state in the Quartus pin planner, to avoid in-rush current at power-up. Do not apply VCCIO before VCCINT - while hot-socketing is supported, simultaneous power-up with VCCIO ahead of VCCINT by more than 100 ms can trigger I/O latch-up. Finally, when migrating from MAX II designs, note that MAX V has a different User Flash programming algorithm; recompile the POF file in Quartus Prime.
Compliance Information
RoHS and REACH compliance per Intel/Altera material declaration as of 2026-09-06. Not AEC-Q100 qualified; for automotive-grade screening use 5M2210ZF324A5N variant. Conflict-minerals statement available from Intel supplier portal.
