5M2210ZF324I5 - 1700-Macrocell MAX V CPLD, 1.8V, 324-BGA | Intel
MPN: 5M2210ZF324I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 250 | $26.4 | $6,600.00 |
| 500 | $23.85 | $11,925.00 |
Drop-in alternatives for 5M2210ZF324I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M2210ZF324C5N
✅ Drop-In✓ In Stock
$8.4 / Unit
View Datasheet →5M2210ZF324C4N
✅ Drop-In✓ In Stock
$22.45 / Unit
View Datasheet →5M2210ZF324A5N
✅ Drop-In✓ In Stock
$44.25 / Unit
View Datasheet →5M1270ZF324C5N
✅ Drop-In✓ In Stock
$7.5 / Unit
View Datasheet →5M1270ZF324C4N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →5M1270ZF324A5N
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →5M2210ZF324I5 Maximum Ratings & Electrical Characteristics
| Product Family | MAX V CPLDs |
| Device Model | 5M2210Z |
| Macrocells | 1700 |
| Logic Elements | 2210 |
| User I/O Pins | 324 |
| Package | 324-ball LBGA (1.0 mm pitch) |
| Core Voltage | 1.8 V |
| Pin-to-Pin Delay (tPD) | 7 ns |
| User Flash Memory | 8 Kbits |
| Configuration Memory | On-chip Flash (non-volatile) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Operating Temperature | -40C to +100C (Industrial) |
| I/O Bank Voltage Support | 1.2V / 1.5V / 1.8V / 2.5V / 3.3V |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5M2210ZF324I5 324-ball lbga (1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 5M2210ZF324I5 (324-ball lbga (1.0 mm pitch) package) with 324 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M2210ZF324I5.
Refer to the datasheet for full pin configuration.
Estimated pin count: 324 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF324I5 is suitable for 6 applications: Industrial PLC I/O Expansion and Voltage Translation, Telecom Backplane Bus Decoder, Power-Up Sequencing Controller for Multi-Rail Systems, ASIC/FPGA Glue Logic and Register File Replacement, Automotive and Transportation Subsystem Controllers, LED Display and Signage Refresh Controller.
Industrial PLC I/O Expansion and Voltage Translation
The 5M2210ZF324I5 is well suited as the central glue-logic engine in industrial PLC backplanes where a controller CPU must interface to legacy 5V or 3.3V peripherals and modern 1.8V processors across a shared bus. With 324 user I/O balls organized into independent voltage banks supporting 1.2V to 3.3V, the device performs level translation on-chip, eliminating external translator ICs and reducing BOM cost. Its 7 ns pin-to-pin delay delivers deterministic response on real-time I/O scan cycles, while the non-volatile Flash configuration ensures the PLC boots into a known safe state within microseconds of power-up. The industrial -40C to +100C temperature rating supports deployment in factory automation cells, motor-control cabinets, and outdoor control enclosures.
Recommended
Telecom Backplane Bus Decoder
In telecom equipment such as line cards and base-station backplanes, the 5M2210ZF324I5 acts as a fast address and protocol decoder between the switch-fabric ASIC and multiple tributary FPGAs. Its 1700 macrocells accommodate complex decoding trees with deep fan-in without timing closure issues, and the 7 ns tPD provides ample margin for synchronous bus cycles at 100 MHz and above. The 324-ball BGA footprint exposes enough pins to drive multiple parallel buses simultaneously while remaining routable on standard 6-layer backplane stack-ups. The instant-on Flash configuration eliminates the boot-time vulnerability of SRAM-based FPGAs, which is critical for always-on telecom infrastructure.
Recommended
Power-Up Sequencing Controller for Multi-Rail Systems
The 5M2210ZF324I5 is commonly programmed as a multi-rail power sequencer in servers, storage systems, and FPGA-based add-in cards where multiple voltage rails must come up and shut down in a defined order. Its non-volatile Flash configuration boots in microseconds, allowing the sequencer to drive enable lines to DC-DC converters before the host CPU has finished its own reset, satisfying the strictest timing specifications of modern ASICs. With 324 available I/O and abundant macrocells, a single 5M2210ZF324I5 can sequence 8 to 16 rails and monitor PG (power-good) feedback lines, replacing discrete sequencer ICs with a flexible, in-system-reprogrammable solution.
Recommended
ASIC/FPGA Glue Logic and Register File Replacement
When a discrete logic implementation would consume excessive board area, the 5M2210ZF324I5 serves as a flexible glue-logic and register-file replacement in ASIC and FPGA reference designs. Each macrocell implements a D flip-flop plus configurable combinational logic, effectively replacing dozens of 74-series packages. Designers use the device for state-machine controllers, FIFOs, interrupt arbiters, and timing-sensitive handshake interfaces. Compared with implementing equivalent logic in the host FPGA, offloading to the 5M2210ZF324I5 frees FPGA fabric for value-added DSP and protocol work and provides a fixed-cost, no-routing-congestion alternative to soft-implementation in the FPGA.
Recommended
Automotive and Transportation Subsystem Controllers
Although not AEC-Q100 qualified, the 5M2210ZF324I5 in its industrial -40C to +100C temperature rating is widely used in non-safety automotive subsystems including infotainment back-end controllers, body-electronics modules, and commercial-vehicle telematics platforms. The 324-ball LBGA package supports dense PCB layouts typical of space-constrained automotive ECUs, while the 1.8V core minimizes power consumption on battery-fed lines. Designers appreciate the deterministic 7 ns propagation delay for CAN, LIN, and FlexRay bus bridging, and the instant-on Flash boot avoids the cold-start latency that RAM-based FPGAs exhibit. For AEC-Q100 automotive programs, the 5M2210ZF324A5N variant is the certified drop-in alternative.
Recommended
LED Display and Signage Refresh Controller
The 5M2210ZF324I5 is deployed as a refresh and pixel-clocking controller in professional LED video walls and large-format digital signage, where it drives GCLK and LE lines to chains of LED driver ICs across hundreds of outputs. Its 324 I/O balls can address wide parallel pixel buses without external muxes, and its deterministic 7 ns timing aligns perfectly with LED driver shift-register clocks in the 50 to 100 MHz range. The non-volatile instant-on configuration eliminates visible boot glitches on display power-up, and the 1.8V core supply minimizes thermal dissipation in sealed display enclosures. Compared with microcontrollers, the CPLD's parallel I/O and guaranteed tPD simplify timing closure for high-refresh-rate panels.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF324I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF324C5N | 5M2210ZF324C4N | 5M2210ZF324A5N | 5M1270ZF324C5N | 5M1270ZF324C4N | 5M1270ZF324A5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball LBGA | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1270 | 1270 | 1270 |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 1270 | 1270 | 1270 |
| User I/O | 324 | 324 | 324 | 324 | 324 | 324 | 324 |
| Pin-to-Pin Delay (ns) | 7 | 7 | 8.5 (speed grade 4) | 7 | 7 | 8.5 (speed grade 4) | 7 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash (Kbits) | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Key Differentiators
- Highest macrocell density in the MAX V family at 324-ball LBGA (vs 5M1270ZF324C5N)
- Industrial temperature range suitable for harsh environments (vs 5M2210ZF324C5N)
- Non-volatile Flash configuration boots in microseconds (vs Xilinx XC2C256 SRAM-based CPLD)
Design Notes
The 324-ball LBGA package uses a 1.0 mm ball pitch and requires a 6-layer PCB with microvia technology for reliable fan-out. Estimated: for a standard 1.0 mm pitch BGA, escape routing on the top layer with 0.1 mm (4 mil) line and space is typical; via-in-pad with filled and plated-over copper is recommended for the inner-row balls to maximize routable channels. Failure to use microvias can lead to signal-integrity issues on high-speed DDR interfaces. Reference Intel MAX V Hardware Implementation Guide for the recommended footprint, paste stencil, and reflow profile.
When driving high-speed buses (DDR, LVDS, or 100 MHz parallel interfaces) through the 5M2210ZF324I5 I/O, series-termination resistors should be placed within 5 mm of the BGA ball. Estimated: a 33 ohm series resistor on each output typically damps reflections on 50 ohm impedance-controlled traces. Configure drive-strength settings in the Quartus II / Intel Quartus Prime assignment editor to match the trace impedance. For multi-bank designs, decouple each VCCIO bank independently with a 0.1 uF ceramic capacitor per bank plus a bulk 10 uF tantalum capacitor to suppress switching noise.
Do not assume the MAX V JTAG chain is automatically routed to all I/O balls - it is only available on dedicated TCK, TMS, TDI, TDO, and TRST pins. Connecting JTAG signals to other balls will not function. Always reserve these pins for JTAG access during PCB layout, even if in-system programming is not planned at first prototype - this preserves the option for field updates. Also note that the 5M2210ZF324I5 requires a 1.8V core supply; do not substitute 3.3V supply or the device will latch-up permanently.
Compliance Information
RoHS compliant per Intel MAX V family documentation. Industrial temperature grade only; for AEC-Q100 automotive qualification, use 5M2210ZF324A5N variant.
