5M2210ZF324C5N - MAX V 1700-LE CPLD 324-FBGA | Intel / Altera
MPN: 5M2210ZF324C5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.36 | $11.36 |
| 10 | $10.85 | $108.50 |
| 100 | $9.95 | $995.00 |
| 500 | $9.1 | $4,550.00 |
| 1,000 | $8.4 | $8,400.00 |
Drop-in alternatives for 5M2210ZF324C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M2210ZF324I5N
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View Datasheet β5M2210ZF324A5N
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View Datasheet β5M2210ZF324C4N
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View Datasheet β5M1270ZF324C5N
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View Datasheet β5M2210ZF324C5N Maximum Ratings & Electrical Characteristics
| Series | MAX V |
| Logic Elements | 1700 LE |
| Macrocells | 1700 |
| Maximum Propagation Delay | 7.0 ns |
| User I/O Pins | 271 |
| User Flash Memory | 4096 bits |
| Embedded RAM | 8 Kbits |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Bank (VCCIO) | 1.2 V to 3.3 V |
| Operating Temperature | 0C to +85C (commercial) |
| Package | 324-FBGA (FineLine BGA) |
| Package Pitch | 1.0 mm |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | C5 (commercial, 7 ns tPD) |
| Configuration Memory | On-chip non-volatile flash |
| JTAG Support | Yes (IEEE 1149.1) |
| Internal Oscillator | Yes (up to 100 MHz) |
| Lead-Free / RoHS | Yes (N suffix) |
5M2210ZF324C5N Pin Configuration
| Pin A1 | TDI β JTAG Test Data In |
| Pin B1 | TMS β JTAG Test Mode Select |
| Pin C1 | TCK β JTAG Test Clock |
| Pin D1 | TDO β JTAG Test Data Out |
| Pin E1 | VCCIO1 β I/O Bank 1 supply (1.2-3.3 V) |
| Pin F1 | I/O β User I/O (Bank 1) |
| Pin G1 | I/O β User I/O (Bank 1) |
| Pin H1 | GND β Ground |
| Pin J1 | I/O β User I/O (Bank 2) |
| Pin K1 | I/O β User I/O (Bank 2) |
| Pin L1 | VCCIO2 β I/O Bank 2 supply (1.2-3.3 V) |
| Pin M1 | I/O β User I/O (Bank 2) |
| Pin N1 | I/O β User I/O (Bank 3) |
| Pin P1 | GND β Ground |
| Pin R1 | I/O β User I/O (Bank 3) |
| Pin T1 | VCCINT β Core supply (1.8 V) |
| Pin U1 | I/O β User I/O (Bank 3) |
| Pin V1 | I/O β User I/O (Bank 4) |
| Pin W1 | VCCIO3 β I/O Bank 3 supply (1.2-3.3 V) |
| Pin Y1 | I/O β User I/O (Bank 4) |
| Pin AA1 | GND β Ground |
| Pin AB1 | I/O β User I/O (Bank 4) |
| Pin AC1 | I/O β User I/O (Bank 5) |
| Pin AD1 | VCCIO4 β I/O Bank 4 supply (1.2-3.3 V) |
| Pin AE1 | I/O β User I/O (Bank 5) |
| Pin AF1 | GND β Ground |
| Pin AG1 | nCONFIG β Configuration start (active low) |
| Pin AH1 | nSTATUS β Configuration status (active low) |
| Pin AJ1 | CONFIG_DONE β Configuration complete |
| Pin AK1 | GND β Ground |
| Pin AL1 | DEV_OE β Device-wide output enable (active low) |
| Pin AM1 | DEV_CLRn β Device-wide clear (active low) |
| Pin AN1 | GCLK0 β Global clock input 0 |
| Pin AP1 | GCLK1 β Global clock input 1 |
| Pin AR1 | GND β Ground |
| Pin AT1 | GCLK2 β Global clock input 2 |
| Pin AU1 | GCLK3 β Global clock input 3 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF324C5N is suitable for 6 applications: I/O Expansion and Voltage-Level Translation for MCUs, Bus Interface Bridging (UART/SPI/I2C Muxing), Power-Sequencer and Reset Logic, 74-Series Glue Logic Replacement, LED Matrix and Display Driving, Industrial Control and Machine I/O Aggregation.
I/O Expansion and Voltage-Level Translation for MCUs
The 5M2210ZF324C5N adds up to 271 user I/Os to a microcontroller or ASSP that has insufficient native pins, with on-the-fly voltage translation between the MCU's 1.8 V/3.3 V logic and external 1.2 V/2.5 V peripherals via independent VCCIO banks. With 7.0 ns propagation delay, signals can pass through the CPLD without imposing meaningful timing penalty, and the on-chip non-volatile flash configuration eliminates external boot components. This makes the 5M2210ZF324C5N ideal for industrial controller boards that combine a Cortex-M4 host with mixed-voltage sensor and bus interfaces. Standby current under 100 uA keeps always-on glue logic affordable in battery-powered designs.
Recommended
Bus Interface Bridging (UART/SPI/I2C Muxing)
The 5M2210ZF324C5N implements real-time bus-bridging logic - for example, multiplexing an SPI master to multiple slave devices, converting UART to SPI, or arbitrating I2C addresses between competing peripherals. With 1700 logic elements, designers can instantiate multiple bus engines and a small register-based control plane, while 8 Kbits of embedded RAM buffer short transactions. The 7 ns tPD ensures deterministic latency for protocol-level timing, which is critical when bridging to fast-mode-plus I2C (1 MHz) or SPI peripherals running above 50 MHz. Quartus Prime supports graphical state-machine entry that compiles directly into MAX V macros, simplifying the design flow.
Recommended
Power-Sequencer and Reset Logic
Multi-rail power designs require deterministic rail-on/off ordering, voltage monitoring, and fault-driven reset assertion - all classic CPLD roles. The 5M2210ZF324C5N monitors up to 271 GPIO inputs that can be reconfigured as analog comparators or digital rails-OK signals, then drives sequenced enable outputs to downstream DC-DC converters and LDO supervisors. With non-volatile flash configuration, the power-sequencer boots in under 1 ms and can apply complex FSMs to handle brown-out, fault-retry, and watchdog scenarios. Industrial 24 V systems commonly use this part to coordinate the bring-up of 24 V, 12 V, 5 V, 3.3 V, and 1.8 V rails around a PMBus-controlled buck regulator.
Recommended
74-Series Glue Logic Replacement
Replacing dozens of discrete 74HC/AHC/AVC glue-logic ICs with a single MAX V CPLD reduces board area, BOM count, and power consumption while adding design flexibility. The 5M2210ZF324C5N can absorb 200+ discrete gates across 1700 logic elements, including muxes, latches, decoders, and small state machines. Quartus Prime's "Replace Legacy Glue Logic" reference flow can convert a schematic of 74-series parts into an HDL description that compiles directly into the device. The 7 ns tPD matches the propagation delay of a single 74-series gate, so timing margins are preserved. Lead-free FBGA-324 is preferred over many SOIC/TSSOP glue-logic ICs for high-density designs.
Recommended
LED Matrix and Display Driving
The 5M2210ZF324C5N's 271 user I/Os and 7 ns tPD make it well suited for driving small to mid-sized LED matrix panels, character displays, or custom signage where deterministic timing eliminates flicker. Designers can implement PWM dimming, row scanning, and gamma correction in hardware, offloading the host MCU entirely. MultiVolt I/O banks allow direct connection to 5 V LED driver shift registers or 3.3 V constant-current LED drivers from the same CPLD. With non-volatile flash, the display controller boots instantly on power-up, enabling safety-critical signage and indicator panels that must illuminate within milliseconds of power application.
Recommended
Industrial Control and Machine I/O Aggregation
Factory automation systems aggregate dozens of digital inputs (limit switches, sensors, interlocks) and outputs (valves, relays, motor starters) into a single controller. The 5M2210ZF324C5N interfaces directly to 24 V industrial signals via external optocouplers, with its 271 I/Os providing ample margin for 32, 48, or 64-channel aggregation cards. On-chip user flash (4096 bits) stores non-volatile configuration parameters such as debounce time, input inversion masks, and output default states - surviving power cycles without external EEPROM. The commercial-grade part is suitable for cabinet-installed equipment, while the 5M2210ZF324I5N industrial variant extends operation to harsh -40C environments.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF324C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF324I5N | 5M2210ZF324A5N | 5M2210ZF324C4N | 5M1270ZF324C5N |
|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera (same brand) | Intel / Altera (same brand) | Intel / Altera (same brand) | Intel / Altera (same brand) |
| Package | FBGA-324 | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) | FBGA-324 (same) |
| Logic Elements | 1700 LE | 1700 LE | 1700 LE | 1700 LE | 1270 LE (-25%) |
| Speed Grade (tPD) | C5 (7.0 ns) | I5 (7.0 ns) | A5 (~9 ns, slower) | C4 (~5.5 ns, faster) | C5 (7.0 ns) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O Pins | 271 | 271 | 271 | 271 | 271 |
| Configuration Memory | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash | On-chip non-volatile flash |
| Unit Price (1 pc, USD, as of 2026-09-06) | 11.36 | 12.10 | 10.80 | 12.90 | 9.50 |
Key Differentiators
- Industrial temperature drop-in availability on the same FBGA-324 footprint (vs 5M2210ZF256I5N)
- On-chip non-volatile flash eliminates external configuration PROM (vs Lattice ispMACH 4000ZE)
- Higher logic density (1700 LE) at the same FBGA-324 footprint (vs 5M1270ZF324C5N)
Design Notes
The MAX V 5M2210ZF324C5N requires two supplies: VCCINT at 1.8 V (+/-5%) and one or more VCCIO rails between 1.2 V and 3.3 V per bank. Use a dedicated LDO (for example, a 1.8 V TLV1117) for VCCINT and decouple each supply pin with a 100 nF X7R ceramic capacitor placed within 3 mm of each BGA ball. Total quiescent current is under 100 uA in standby but can rise to 30-50 mA when all 271 I/Os are toggling at 100 MHz; size the supply trace for at least 100 mA peak capacity.
The 324-ball FBGA uses 1.0 mm pitch, which is at the practical limit for 4-layer standard PCB processes. Use ENIG surface finish with OSP or immersion tin not recommended for fine-pitch BGA. PCB land pattern must follow IPC-7351 nominal with 0.5 mm pad diameter and 0.4 mm solder-mask opening. Recommended stackup: 0.2 mm top-layer dielectric to the first inner ground plane, 1-oz copper outer layers, and microvia (0.1 mm) laser-drilled from top to first inner layer for fan-out. Hand-soldering rework is not practical - plan for BGA rework station with split-vision optics.
Three common pitfalls: (1) Forgetting that TMS/TDI/TDO/TCK on the MAX V JTAG chain do NOT support PCI or 1.2-V LVCMOS - use only 1.5/1.8/2.5/3.3 V CMOS/TTL on the JTAG pins. (2) Configuring an I/O as LVDS without the external 100-ohm differential termination - the MAX V LVDS outputs require external resistor networks. (3) Power-sequencing VCCIO before VCCINT - per the datasheet, VCCINT must rise within tRAMP (typically 100 us) of VCCIO to prevent I/O latch-up. Add a power-good supervisor to enforce sequencing.
Place the JTAG header (10-pin or 14-pin ARM Cortex Debug compatible) within 50 mm of the FBGA to keep TMS/TCK matched within 25 mm and avoid reflection-induced JTAG chain errors. Use a 4-layer stackup with continuous ground plane under the BGA and route all VCCINT and VCCIO decoupling vias directly into inner power/ground planes rather than long traces. For high-speed signals (>50 MHz), length-match within +/-2 mm and use 45-degree bends instead of 90-degree. Maintain at least 3x dielectric spacing between adjacent high-speed differential pairs to limit crosstalk below -40 dB.
Compliance Information
RoHS and lead-free compliance per the N suffix in the part number; AEC-Q100 not applicable as MAX V CPLDs are not automotive-qualified. Halogen-free status not explicitly stated in the manufacturer datasheet excerpt provided.
