5M2210ZF324C4N - MAX V CPLD, 1700 Macrocells, FBGA-324 | Intel / Altera
MPN: 5M2210ZF324C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.1 | $13,050.00 |
| 1,000 | $22.45 | $22,450.00 |
Drop-in alternatives for 5M2210ZF324C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M2210ZF324C5N
✅ Drop-In✓ In Stock
$8.4 / Unit
View Datasheet →5M2210ZF324I5N
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$5.95 / Unit
View Datasheet →5M2210ZF324A5N
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$44.25 / Unit
View Datasheet →5M1270ZF324C4N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →5M2210ZF324C4N-Q
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
5M2210ZF324C4N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 1700 |
| Logic Array Blocks (LABs) | 221 |
| User I/Os | 271 |
| Operating Frequency (max) | 304 MHz |
| Propagation Delay (tPD) | 7.0 ns |
| Core Supply Voltage | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (MultiVolt) |
| Configuration Memory | Non-volatile flash |
| Package | FBGA-324 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C4 |
| JTAG / IEEE 1149.1 | Yes |
| RoHS Status | Compliant |
5M2210ZF324C4N fbga-324 Pin Configuration Guide
Complete pinout information for 5M2210ZF324C4N (fbga-324 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M2210ZF324C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M2210ZF324C4N is suitable for 6 applications: Bus Bridging and Protocol Translation, I/O Expansion and Voltage Translation, Power-Up Sequencing Logic, Industrial Control and Factory Automation, LED Display and Signage Control, Board-Level Glue Logic Replacement.
Bus Bridging and Protocol Translation
The 5M2210ZF324C4N is well-suited for bus-bridging applications such as PCI-to-Local-Bus, I2C-to-SPI, or UART-to-Parallel conversion thanks to its 1700 macrocells and 7.0 ns deterministic propagation delay (C4 speed grade). With 271 user I/Os in FBGA-324, the device can simultaneously handle wide data buses plus control signals without external glue logic. The instant-on, non-volatile flash configuration eliminates boot latency, which is critical when bridging between processors that power up at different times. MultiVolt I/O banks (1.2 V to 3.3 V) allow direct connection to legacy 5 V-tolerant logic via external resistors while interfacing natively to modern 1.8 V processors.
Recommended
I/O Expansion and Voltage Translation
The 5M2210ZF324C4N adds 271 user I/Os to processors or ASICs that lack sufficient native GPIO, while MultiVolt I/O banks allow direct level shifting between 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V domains without external level shifters. This dramatically simplifies board design where mixed-voltage logic must coexist. The 7.0 ns C4-grade propagation delay preserves timing margin for high-speed control signals such as memory clocks or reset distribution, and 1700 macrocells provide ample headroom for custom glue logic that maps interrupts, captures keystrokes, or drives displays.
Recommended
Power-Up Sequencing Logic
The 5M2210ZF324C4N's non-volatile flash configuration makes it the ideal choice for deterministic power-up sequencing in multi-rail systems such as base stations, servers, and industrial controllers. Unlike SRAM FPGAs that require configuration time, MAX V devices are operational at first clock edge with no boot delay, allowing them to drive enable signals to DC-DC converters, reset supervisors, and motor drivers in the correct order. With 1700 macrocells, designers can implement cascaded sequencers for 8-16 rails while still having headroom for fault monitoring logic that asserts PGOOD flags.
Recommended
Industrial Control and Factory Automation
In industrial control cabinets and PLCs, the 5M2210ZF324C4N can replace dozens of discrete 74-series logic gates while consuming a small PCB footprint. The 271 user I/Os are sufficient to scan 16-32 digital inputs, drive 16-32 outputs, and provide dedicated interfaces for encoders, sensors, and HMI panels. The 1.8 V core with MultiVolt I/O allows direct interface to 3.3 V MCU buses and 24 V opto-isolated field I/O. For harsh environments, the industrial-grade 5M2210ZF324I5N variant should be specified, as the commercial C4N is rated only to +85C.
Recommended
LED Display and Signage Control
The 5M2210ZF324C4N's 271 user I/Os and 304 MHz internal frequency make it well-suited to LED display refresh, multiplexing, and PWM dimming in signage and stage-lighting controllers. Each LAB can drive 16 PWM channels, and 221 LABs provide enough logic to support large dot-matrix displays with grayscale. The non-volatile flash configuration means the display controller is ready within microseconds of power-on, eliminating visible boot sequences. MultiVolt I/O allows direct connection to 5 V LED drivers via level-shifted outputs.
Recommended
Board-Level Glue Logic Replacement
Designers frequently choose the 5M2210ZF324C4N to replace scattered 74HC/74LVC/74AVC discrete logic gates, latches, muxes, and small state machines with a single integrated device that is reconfigurable during development. With 1700 macrocells and JTAG-based in-system programmability, the design can be revised in-circuit without respinning the PCB. The 7.0 ns C4 speed grade provides timing margin comparable to 74AVC logic, while the FBGA-324 package consolidates what would otherwise be dozens of SOIC-14/SSOP-20 packages into one BGA.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF324C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF324C5N | 5M2210ZF324I5N | 5M2210ZF324A5N | 5M1270ZF324C4N | 5M2210ZF324C4N-Q |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-324 | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1270 | 1700 |
| User I/Os | 271 | 271 | 271 | 271 | [DATA_NEEDED] | 271 |
| Speed Grade | C4 (7.0 ns tPD) | C5 (8.5 ns tPD) | I5 (industrial, ~9 ns tPD) | A5 (automotive temp) | C4 (7.0 ns tPD) | C4 (7.0 ns tPD) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C | 0C to +85C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Key Differentiators
- Highest macrocell density in MAX V family (vs 5M1270ZF324C4N)
- Fastest speed grade in commercial temperature (vs 5M2210ZF324C5N)
- Non-volatile flash configuration for instant-on (vs Cyclone V FPGAs (e.g., 5CEBA2F17I7N))
Design Notes
The 5M2210ZF324C4N requires a clean 1.8 V core supply with at least 100 nF + 10 uF decoupling per VCC pin group, plus separate VCCIO pins per I/O bank (1.2 V to 3.3 V, MultiVolt). Each bank can operate at a different voltage, allowing direct interface to mixed-voltage logic without external level shifters. Estimated: total quiescent current is approximately 30-50 mA for a fully utilized device; verify with Quartus PowerPlay early in the design cycle.
The FBGA-324 (1.0 mm pitch) package requires a 4-layer PCB minimum, with continuous ground and power planes under the BGA and microvia-in-pad recommended for inner rows. Follow Intel/Altera MAX V Hardware Reference Manual fanout rules: escape vias on 1.0 mm grid, with antipad diameter of 0.4 mm. Signal traces on outer layers should be matched to 50 ohm impedance if running at >100 MHz, and a solid ground pour stitched with GND vias every 200 mil adjacent to high-speed signals.
Multi Volt I/O banks should be partitioned by voltage domain so that 3.3 V, 2.5 V, 1.8 V, and 1.5 V interfaces are not mixed within a single bank. Each bank has its own VCCIO pin; leave 0.1 uF + 10 uF decoupling adjacent to each VCCIO. JTAG signals (TMS, TDI, TDO, TCK, optional TRST) should be routed with 4-5 mil traces, length-matched if part of a multi-device JTAG chain, and pulled up to VCCIO with 10 kohm resistors per IEEE 1149.1.
Do not assume 5M2210ZF324C4N variants are interchangeable without checking the speed-grade and temperature-grade suffixes: C4 (7 ns commercial), C5 (8.5 ns commercial), I5 (industrial), A5 (automotive). A pinout-compatible FBGA-324 sibling with the wrong speed grade may fail timing closure. Also avoid leaving JTAG pins floating; unused JTAG inputs should be tied high (TMS, TCK) or pulled per datasheet to prevent spurious configuration writes.
Compliance Information
C4 speed grade is commercial temperature only; for AEC-Q100 automotive use choose the A5 variant (5M2210ZF324A5N). RoHS/lead-free status confirmed by distributor listings.
