5M80ZE64C4 - MAX V CPLD, 64 Logic Elements, 64-EQFP | Intel
MPN: 5M80ZE64C4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.4 | $6.40 |
| 10 | $5.75 | $57.50 |
| 100 | $5.1 | $510.00 |
| 500 | $4.55 | $2,275.00 |
| 1,000 | $4 | $4,000.00 |
Drop-in alternatives for 5M80ZE64C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M80ZE64A5N
β Drop-Inβ In Stock
$3.05 / Unit
View Datasheet β5M80ZE64I5N
β Drop-Inβ In Stock
$4.1 / Unit
View Datasheet β5M80ZE64C4N
β Drop-Inβ In Stock
$2.1 / Unit
View Datasheet β5M40ZE64C4N
β Drop-Inβ In Stock
$1.7 / Unit
View Datasheet β5M160ZE64C4N
β Drop-Inβ In Stock
$4.3 / Unit
View Datasheet β5M80ZE64C4 Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 64 |
| Macro Cells | 64 |
| User I/Os | 54 |
| Maximum Internal Frequency | 184 MHz |
| Propagation Delay (tPD) | 7.9 ns |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package | EQFP-64 (9 x 9 mm, 0.4 mm pitch) |
| Pin Count | 64 |
| Speed Grade | C4 |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Mounting Type | Surface Mount |
| Configuration Memory | Non-volatile flash (internal) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG (IEEE 1149.1) |
5M80ZE64C4 Pin Configuration
| Pin 1 | I/O β User I/O (Bank 1) |
| Pin 2 | I/O β User I/O (Bank 1) |
| Pin 3 | I/O β User I/O (Bank 1) |
| Pin 4 | I/O β User I/O (Bank 1) |
| Pin 5 | I/O β User I/O (Bank 1) |
| Pin 6 | I/O β User I/O (Bank 1) |
| Pin 7 | VCCIO1 β Bank 1 I/O supply voltage |
| Pin 8 | I/O β User I/O (Bank 1) |
| Pin 9 | I/O β User I/O (Bank 1) |
| Pin 10 | I/O β User I/O (Bank 1) |
| Pin 11 | GND β Ground |
| Pin 12 | I/O β User I/O (Bank 1) |
| Pin 13 | I/O β User I/O (Bank 1) |
| Pin 14 | I/O β User I/O (Bank 1) |
| Pin 15 | I/O β User I/O (Bank 1) |
| Pin 16 | I/O β User I/O (Bank 1) |
| Pin 17 | TDI β JTAG Test Data In |
| Pin 18 | TMS β JTAG Test Mode Select |
| Pin 19 | TCK β JTAG Test Clock |
| Pin 20 | GND β Ground |
| Pin 21 | I/O β User I/O (Bank 2) |
| Pin 22 | I/O β User I/O (Bank 2) |
| Pin 23 | I/O β User I/O (Bank 2) |
| Pin 24 | I/O β User I/O (Bank 2) |
| Pin 25 | VCCINT β Core supply voltage (1.8 V) |
| Pin 26 | I/O β User I/O (Bank 2) |
| Pin 27 | I/O β User I/O (Bank 2) |
| Pin 28 | I/O β User I/O (Bank 2) |
| Pin 29 | I/O β User I/O (Bank 2) |
| Pin 30 | GND β Ground |
| Pin 31 | I/O β User I/O (Bank 2) |
| Pin 32 | I/O β User I/O (Bank 2) |
| Pin 33 | I/O β User I/O (Bank 2) |
| Pin 34 | VCCIO2 β Bank 2 I/O supply voltage |
| Pin 35 | I/O β User I/O (Bank 2) |
| Pin 36 | I/O β User I/O (Bank 2) |
| Pin 37 | I/O β User I/O (Bank 2) |
| Pin 38 | I/O β User I/O (Bank 2) |
| Pin 39 | I/O β User I/O (Bank 2) |
| Pin 40 | GND β Ground |
| Pin 41 | I/O β User I/O (Bank 2) |
| Pin 42 | I/O β User I/O (Bank 2) |
| Pin 43 | I/O β User I/O (Bank 2) |
| Pin 44 | TDO β JTAG Test Data Out |
| Pin 45 | GND β Ground |
| Pin 46 | I/O β User I/O (Bank 3) |
| Pin 47 | I/O β User I/O (Bank 3) |
| Pin 48 | I/O β User I/O (Bank 3) |
| Pin 49 | I/O β User I/O (Bank 3) |
| Pin 50 | I/O β User I/O (Bank 3) |
| Pin 51 | VCCIO3 β Bank 3 I/O supply voltage |
| Pin 52 | I/O β User I/O (Bank 3) |
| Pin 53 | I/O β User I/O (Bank 3) |
| Pin 54 | I/O β User I/O (Bank 3) |
| Pin 55 | GND β Ground |
| Pin 56 | I/O β User I/O (Bank 3) |
| Pin 57 | I/O β User I/O (Bank 3) |
| Pin 58 | I/O β User I/O (Bank 3) |
| Pin 59 | I/O β User I/O (Bank 3) |
| Pin 60 | I/O β User I/O (Bank 3) |
| Pin 61 | I/O β User I/O (Bank 3) |
| Pin 62 | I/O β User I/O (Bank 3) |
| Pin 63 | I/O β User I/O (Bank 3) |
| Pin 64 | I/O β User I/O (Bank 3) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M80ZE64C4 is suitable for 6 applications: Microcontroller I/O Expansion, Bus Bridge (Parallel to SPI/I2C), Power-Up Sequencing Controller, Motor Control PWM Glue Logic, LED Display Row/Column Driver, Industrial Sensor Hub Front-End.
Microcontroller I/O Expansion
The 5M80ZE64C4 adds 54 user I/Os to MCUs that have exhausted their native GPIO count, providing 64 logic elements to perform address decoding, chip-select generation, and input synchronization. Its 1.8 V VCCINT and multi-voltage VCCIO rails (1.5 V / 1.8 V / 2.5 V / 3.3 V) let it bridge directly between a 1.8 V MCU and 3.3 V peripheral buses without level shifters. The 7.9 ns tPD keeps interrupt acknowledge latency low, and instant-on flash configuration means the I/O expansion is active before the MCU finishes its bootloader.
Recommended
Bus Bridge (Parallel to SPI/I2C)
The 5M80ZE64C4 converts legacy parallel buses (8/16-bit data, chip select, read/write strobes) into modern serial protocols like SPI or I2C at line rates up to 184 MHz fMAX. With 64 LEs it can implement a full state machine, address latch, and shift register, and the 7.9 ns propagation delay supports SPI clock division up to ~125 MHz in the C4 speed grade. The non-volatile flash bitstream means the bridge is operational within microseconds of power-up, an advantage over FPGA-based bridges that require configuration time.
Recommended
Power-Up Sequencing Controller
In multi-rail systems, the 5M80ZE64C4 enforces deterministic power-on sequencing using its 54 user I/Os to drive MOSFET gate enables, PG (power-good) inputs, and reset signals to downstream regulators. The CPLD's instant-on behavior at 1.8 V VCCINT lets it become active as soon as the first rail is valid, then cascade-enable subsequent rails based on PG feedback. Predictable 7.9 ns tPD timing makes timing budgets easy to calculate, and 64 LEs are sufficient for 4-6 rail sequencers with fault latching.
Recommended
Motor Control PWM Glue Logic
The 5M80ZE64C4 generates complementary PWM pairs with programmable dead-time insertion, fault-input handling, and brake logic for three-phase motor drives. Its 184 MHz internal frequency supports PWM switching frequencies up to ~2 MHz with sub-microsecond resolution when combined with external counters, and the 7.9 ns tPD allows fast fault-to-shutdown propagation critical for IGBT/MOSFET protection. Multi-voltage VCCIO banks interface directly with 3.3 V MCUs and 5 V gate drivers.
Recommended
LED Display Row/Column Driver
The 5M80ZE64C4 multiplexes large LED matrices by scanning rows and latching column data at video refresh rates. With 54 user I/Os it can drive up to 27 column lines directly plus row selects via external drivers, and the 184 MHz fMAX supports refresh rates above 1 kHz to avoid visible flicker. The non-volatile configuration ensures the display pattern is restored at every power cycle without external boot memory.
Recommended
Industrial Sensor Hub Front-End
The 5M80ZE64C4 aggregates inputs from up to 54 sensors via GPIO, performs debouncing, threshold detection, and protocol translation before forwarding to a host processor. Its 1.8 V core and 3.3 V-tolerant I/O allow direct connection to modern CMOS sensors, and the -40 C to +85 C operating range (industrial variant) supports factory-floor environments. The instant-on flash configuration ensures the sensor hub is active before the host MCU boots, enabling fail-safe biasing of connected transducers.
Recommended
Recommended Products Summary
Engineering reference data for 5M80ZE64C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M80ZE64A5N | 5M80ZE64I5N | 5M40ZE64C4N | 5M160ZE64C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-64 | EQFP-64 - same | EQFP-64 - same | EQFP-64 - same | EQFP-64 - same |
| Logic Elements | 64 | 64 | 64 | 40 | 160 |
| Maximum Frequency | 184 MHz | 184 MHz | 201 MHz (I5 grade) | 184 MHz | 184 MHz |
| Propagation Delay | 7.9 ns | 7.9 ns | 6.5 ns (I5 grade) | 7.9 ns | 7.9 ns |
| User I/Os | 54 | 54 | 54 | 54 | 54 |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
Key Differentiators
- Industry-standard non-volatile instant-on configuration (vs 5M40ZE64C4N)
- 60% more logic capacity in the same footprint (vs 5M40ZE64C4N)
- Commercial temperature grade pricing advantage (vs 5M80ZE64A5N)
Design Notes
Decouple every VCCINT and VCCIO pin with a 100 nF X7R ceramic capacitor placed within 2 mm of the respective supply pin, and add a single 10 uF bulk capacitor near the package. VCCINT must be a clean 1.8 V +/- 5% rail; ripple above 90 mV can cause timing degradation in the LAB routing matrix. Estimated: with all 54 I/Os switching at 25 MHz into 10 pF loads, core current is approximately 30 mA and I/O current per bank is approximately 15 mA - verify with Intel PowerPlay early-estimator tools for your specific design.
Do not leave unused user I/O pins floating. Configure them in the Quartus II pin assignment file as outputs driving ground (or inputs with internal weak pull-up enabled) to prevent shoot-through current in the I/O buffer. Floating pins can draw several milliamps per pin and may cause start-up current spikes that confuse the power-on reset circuit. Also ensure JTAG pins (TCK, TMS, TDI, TDO) are properly pulled; TCK must be pulled low and TMS pulled high per the MAX V datasheet to keep the TAP controller in a defined state at power-up.
The 0.4 mm pitch EQFP-64 package requires PCB land patterns per the MAX V Surface-Mount Device PCB Guidelines. Use 0.2 mm wide traces between package leads and via fan-out, with via-in-pad recommended for inner pads to maximize break-out channel routing. Maintain a continuous ground plane on layer 2 directly under the package to provide a low-impedance return path for the high-edge-rate I/O signals; estimated return-path discontinuity at 100 MHz edge rates can cause 3-5 dB of radiated emissions penalty if the ground plane is cut under the device.
Compliance Information
RoHS-compliant per Altera/Intel product page. Not AEC-Q100 qualified - choose MAX V industrial-grade (A5N) or automotive-grade variant if AEC-Q100 is required. Halogen-free status not stated in verified data.