EP1K100FI256-3 - 100K-Gate ACEX 1K FPGA, 186 I/O, FBGA-256 | Intel
MPN: EP1K100FI256-3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $64.1 | $6,410.00 |
| 500 | $57.4 | $28,700.00 |
| 1,000 | $52.9 | $52,900.00 |
EP1K100FI256-3 Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit whose logic function is defined after manufacture by a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) > complex PLDs (CPLDs) > FPGAs > SRAM-based LUT FPGAs > ACEX 1K. They are used when designers need high logic density, parallel I/O, and reconfigurability that microcontrollers and ASICs cannot match. The ACEX 1K family was Altera's first SRAM-based family to integrate embedded array blocks for true system-on-chip integration.
Key features of the EP1K100FI256-3 include 100,000 typical gates, 4,992 logic elements, 49,152 RAM bits distributed across EABs, 186 user I/O pins, JTAG-compliant IEEE 1149.1 boundary-scan support, and a dedicated configuration interface. The device is built on a 0.22 micron CMOS process and supports in-system programmability through its SRAM configuration cells, allowing unlimited reconfiguration during development and in-field updates.
The -3 speed grade places this part in the mid-performance tier of the ACEX 1K family, with the family datasheet quoting Fmax in the 180-200 MHz range depending on the speed grade selected. The FineLine BGA-256 (FBGA-256) package provides a compact footprint while supporting high pin counts for parallel buses and high-density I/O expansion. This combination makes the EP1K100FI256-3 suitable for legacy designs, prototyping, and industrial glue logic where form factor and I/O density matter.
Typical applications include industrial control glue logic, communication interface bridging, legacy peripheral expansion, ASIC prototyping emulation, and parallel data acquisition front-ends. The 186 available I/O pins accommodate wide parallel buses and multi-protocol bridging without external muxing.
When designing with this part, plan configuration scheme (JTAG, PS, or AS) early because the configuration interface dictates board layout for the EPC or serial configuration device. Because ACEX 1K is a multi-decade mature family, expect long lead times and verify second-source availability before committing to a new design.
This page synthesizes distributor pricing, drop-in compatible ACEX 1K variants, and practical sourcing notes not consolidated in a single datasheet, helping engineers and buyers evaluate form-fit-function compatibility for legacy and new designs.
Drop-in alternatives for EP1K100FI256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K100FI256-3 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Family, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100FI256-2
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP1K100FI256-2N
✅ Drop-In✓ In Stock
$55.8 / Unit
View Datasheet →EP1K100FC256-3
✅ Drop-In✓ In Stock
$30.22 / Unit
View Datasheet →EP1K100FC256-3N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1K100FC256-2
✅ Drop-In✓ In Stock
$27.6 / Unit
View Datasheet →EP1K100FI256-3 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Device Logic Elements | 4,992 |
| Typical Gate Count | 100,000 gates |
| Maximum RAM Bits | 49,152 bits |
| User I/O Pins | 186 |
| Dedicated Inputs | 6 |
| Speed Grade | -3 |
| Nominal Core Voltage | 2.5 V |
| Core Voltage Range | 2.375 V to 2.625 V |
| Process Technology | 0.22 micron CMOS |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM-based, JTAG / PS / AS supported |
| AEC-Q100 Qualification | Not qualified |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
EP1K100FI256-3 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank assignment per datasheet) |
| Pin A2 | I/O — User I/O pin |
| Pin A3 | I/O — User I/O pin |
| Pin A4 | VCCINT — Core supply voltage 2.5 V |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | I/O — User I/O pin |
| Pin B3 | GND — Ground reference |
| Pin B4 | I/O — User I/O pin |
| Pin C1 | I/O — User I/O pin |
| Pin C2 | I/O — User I/O pin |
| Pin C3 | I/O — User I/O pin |
| Pin C4 | VCCIO — I/O bank supply voltage |
| Pin D1 | I/O — User I/O pin |
| Pin D2 | nSTATUS — Configuration status (open-drain) |
| Pin D3 | nCONFIG — Configuration start (active-low) |
| Pin D4 | I/O — User I/O pin |
| Pin E1 | I/O — User I/O pin |
| Pin E2 | DCLK — Configuration clock input |
| Pin E3 | CONF_DONE — Configuration complete (open-drain) |
| Pin E4 | I/O — User I/O pin |
| Pin F1 | I/O — User I/O pin |
| Pin F2 | DATA0 — Configuration data input |
| Pin F3 | MSEL0 — Configuration mode select |
| Pin F4 | I/O — User I/O pin |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | MSEL1 — Configuration mode select |
| Pin G3 | nCE — Chip enable (active-low) |
| Pin G4 | I/O — User I/O pin |
| Pin H1 | I/O — User I/O pin |
| Pin H2 | TDI — JTAG test data in |
| Pin H3 | TCK — JTAG test clock |
| Pin H4 | I/O — User I/O pin |
| Pin J1 | I/O — User I/O pin |
| Pin J2 | TDO — JTAG test data out |
| Pin J3 | TMS — JTAG test mode select |
| Pin J4 | I/O — User I/O pin |
| Pin K1 | I/O — User I/O pin |
| Pin K2 | VCCINT — Core supply voltage 2.5 V |
| Pin K3 | GND — Ground reference |
| Pin K4 | I/O — User I/O pin |
| Pin L1 | I/O — User I/O pin |
| Pin L2 | I/O — User I/O pin |
| Pin L3 | I/O — User I/O pin |
| Pin L4 | VCCIO — I/O bank supply voltage |
| Pin M1 | I/O — User I/O pin |
| Pin M2 | I/O — User I/O pin |
| Pin M3 | GND — Ground reference |
| Pin M4 | I/O — User I/O pin |
| Pin N1 | I/O — User I/O pin |
| Pin N2 | I/O — User I/O pin |
| Pin N3 | I/O — User I/O pin |
| Pin N4 | I/O — User I/O pin |
Typical Applications
EP1K100FI256-3 is suitable for 7 applications: Industrial Glue Logic and Bus Bridging, Communication Interface Expansion, ASIC Prototyping and Emulation, Parallel Data Acquisition Front-End, Legacy Peripheral Expansion, Aerospace and Avionics Interface Bridging, Test and Measurement Instrumentation.
Industrial Glue Logic and Bus Bridging
The EP1K100FI256-3 is well suited to industrial glue logic and bus-bridging applications because its 4,992 logic elements, 49,152 bits of distributed RAM, and 186 user I/O pins let designers replace multiple 74-series logic devices and discrete bus switches with a single programmable device. In a typical application the FPGA sits between a legacy parallel bus (e.g. ISA or a custom 32-bit interface) and a modern MCU, performing protocol translation, address decoding, and timing adjustment on the fly. The 2.5 V core voltage is friendly to mixed 2.5 V / 3.3 V I/O rails when the bank voltage is set appropriately, and the industrial -40 C to +85 C rating supports factory-floor enclosures without additional thermal conditioning.
Recommended
Communication Interface Expansion
The EP1K100FI256-3 is widely used to add legacy communication interfaces to modern processors that no longer expose them. With 186 I/O pins and 49,152 bits of block RAM, the device can implement UARTs (16550 cores), SPI masters/slaves, I2C controllers, and even custom LVDS links concurrently on the same die. The 256-ball FineLine BGA gives generous signal fan-out for parallel data paths, and the SRAM-based configuration means the same FPGA can be reconfigured in the field to add new protocol support. Industrial-temperature operation enables deployment in outdoor telecom cabinets and industrial Ethernet gateways.
Recommended
ASIC Prototyping and Emulation
Designers use the EP1K100FI256-3 as an ASIC prototyping vehicle because the ACEX 1K architecture maps cleanly onto RTL synthesized for ASIC flows, with 4,992 LEs accommodating tens of thousands of ASIC gates at typical 4-to-1 utilization. The 49,152 bits of distributed RAM emulate SRAM blocks, FIFOs, and register files at near-real-time speeds, while the 186 I/O pins break out wide data buses for connection to the real ASIC pads. The -3 speed grade yields Fmax values in the 180-200 MHz range (family datasheet), enough to validate RTL timing before tape-out. Industrial temperature rating supports bring-up and validation in thermally aggressive test fixtures.
Recommended
Parallel Data Acquisition Front-End
In parallel data acquisition systems the EP1K100FI256-3 acts as a programmable front-end that interfaces parallel ADCs, deserializers, or image sensors to a host processor. The 186 available user I/O pins accommodate wide LVCMOS or LVTTL buses from multi-channel ADCs, and the 49,152 bits of distributed RAM implement per-channel FIFOs that absorb sample bursts without host intervention. The ACEX 1K EABs can host small coefficient tables for run-time gain calibration, and the 0.22 micron CMOS process gives predictable timing for deterministic sampling windows at the -3 speed grade.
Recommended
Legacy Peripheral Expansion
The EP1K100FI256-3 is commonly used to add legacy peripherals (parallel ports, IDE interfaces, ISA-style cards, custom keypad/display controllers) to modern SoCs that no longer expose them. Designers instantiate soft-core peripherals in HDL, compile them into the 4,992 logic elements, and map them onto the 186 I/O pins of the FineLine BGA. The SRAM-based configuration lets a single board ship with multiple personality bitstreams, switchable in the field through JTAG or active-serial configuration. The industrial -40 C to +85 C window supports factory automation and military-grade COTS applications.
Recommended
Aerospace and Avionics Interface Bridging
Although not AEC-Q100 qualified, the industrial-temperature EP1K100FI256-3 is widely used in commercial aerospace and avionics interface bridging, where it converts between ARINC 429, MIL-STD-1553, and modern Ethernet or PCIe-based avionics buses. The 186 user I/O pins and 4,992 LEs support multiple ARINC 429 channels simultaneously, while the 49,152 bits of RAM stage messages for protocol conversion. Designers appreciate the SRAM-based configuration for in-field updates as DO-178C certification artifacts evolve. The -40 C to +85 C industrial range is sufficient for cockpit and cabin electronics, though not for engine bay applications.
Recommended
Test and Measurement Instrumentation
The EP1K100FI256-3 finds use in custom test and measurement instruments because its 186 I/O pins can be routed to DUT pins, pattern generators, and comparators in parallel, while the 4,992 LEs run mixed-signal test sequencers. The 49,152 bits of distributed RAM store captured waveforms and pattern vectors, and the SRAM-based configuration means the same hardware can be re-purposed for different DUT families simply by loading a new bitstream. The 0.22 micron CMOS process contributes predictable timing that simplifies timing-budget verification at the -3 speed grade.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FI256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FI256-2 | EP1K100FI256-2N | EP1K100FC256-3 | EP1K100FC256-3N | EP1K100FC256-2 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (FineLine BGA) | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K |
| Speed Grade | -3 | -2 (slower Fmax) | -2 (slower Fmax) | -3 (same Fmax) | -3 (same Fmax) | -2 (slower Fmax) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/O Pins | 186 | 186 | 186 | 186 | 186 | 186 |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
Key Differentiators
- Highest Fmax speed grade in the EP1K100 industrial FBGA-256 lineup (vs EP1K100FI256-2)
- Industrial temperature grade covers factory and outdoor deployments (vs EP1K100FC256-3)
- FineLine BGA-256 packs 186 I/O in a compact footprint versus QFP options (vs EP1K100FC484-3)
- SRAM-based configuration enables in-field reconfiguration (vs Antifuse-based competitors)
Design Notes
The EP1K100FI256-3 requires a clean 2.5 V core supply in the 2.375 V to 2.625 V window and a separate VCCIO bank supply (typically 2.5 V, 3.0 V, or 3.3 V depending on bank assignment). Decouple each supply pin with a 0.1 uF ceramic plus a bulk 10-47 uF tantalum or polymer cap. Because ACEX 1K is SRAM-based, it must complete configuration before I/O become valid; a slow-rising VCCINT can leave the device in undefined states, so follow the power-on reset timing in the family datasheet and hold nCONFIG low until the supply rails are stable. Estimated: assuming 186 I/O switching at 20 MHz with 20 pF loads, dynamic current draw is on the order of 200-400 mA in addition to the static IDD.
The FineLine BGA-256 package exposes a thermal pad or thermal balls; reflow that pad to an internal copper pour with a via array to spread heat into inner PCB layers. Without a thermal pad, the junction-to-ambient thermal resistance of the FBGA-256 is high (often 30-40 C/W), so for high-utilization designs (>70% LE toggle) at industrial temperature, include a heatsink or forced-air cooling. Estimated: at 1 W total power dissipation the junction rises 30-40 C above ambient at a typical 30 C/W theta_JA, leaving ~45-55 C of margin to the 85 C industrial ceiling.
FBGA-256 routing demands 0.8 mm ball pitch, which requires microvia (laser-drilled) stack-ups on the PCB. Use a 4-6 layer board with the top layer dedicated to escape routing from the BGA fan-out, a continuous ground plane on layer 2 for return-path integrity, and a power plane on layer 3. Keep all 100 ohm differential pairs length-matched within 150 mil and length-match clock-to-DATA within 100 mil to preserve setup/hold margins during PS/AS configuration. Avoid placing the configuration memory more than 4 inches from DCLK/DATA to keep the configuration clock clean.
Do not confuse ACEX 1K (2.5 V core, SRAM) with APEX or FLEX families that have different voltage and configuration requirements. Confirm MSEL[1:0] strapping for PS (parallel-synchronous) versus AS (active-serial) configuration before laying out the board. A common pitfall is using an EPC2 configuration memory intended for APEX 20K with ACEX 1K - the programming files are not compatible. Use Quartus II 13.0 or earlier for ACEX 1K synthesis; newer Quartus releases dropped support. Finally, watch the I/O bank supply - mixing 3.3 V and 2.5 V on the same bank damages the I/O cells.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not stated in the verified distributor snippets; consult franchised distributor documentation. The 'N' suffix variants (EP1K100FI256-2N, EP1K100FC256-3N) are explicitly lead-free per Altera part-number convention.
