EP20K200CF484I9N - 200K Gates APEX 20KC FPGA | Altera
MPN: EP20K200CF484I9N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $115 | $115,000.00 |
EP20K200CF484I9N Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O and memory resources that the user can re-program after manufacturing to implement arbitrary digital logic. FPGAs sit between discrete logic ICs (e.g., 74-series gates) and fixed-function ASICs, providing hardware-level performance with software-level design flexibility. The APEX 20KC family specifically integrates "MultiCore" architecture combining logic elements and embedded system blocks (ESBs) for on-chip RAM/ROM, addressing high-density glue logic, bus bridging, and ASIC prototyping.
Key features include 4 dedicated inputs and 376 usable I/O lines (368 of which are user I/O), embedded system blocks for distributed memory, support for LVTTL/LVCMOS/PCI I/O standards, JTAG IEEE 1149.1 boundary-scan testing, and an in-system programmability (ISP) interface via Altera's ByteBlaster or BitBlaster cables. The 484-pin FBGA package has a 1.0 mm ball pitch and uses a thermally enhanced variant for improved heat dissipation compared to standard BGA packages.
Technically, the APEX 20KC architecture uses a hierarchical routing structure with FastTrack Interconnect and embedded array blocks (EABs) for memory functions. With 8,320 logic cells and an internal operating ceiling around 250 MHz, the EP20K200CF484I9N targets designs requiring moderate logic density at industrial temperature grades (–40 °C to +85 °C), commonly used in telecom infrastructure, ASIC prototyping, and embedded DSP control.
Typical applications include ASIC prototyping and emulation, telecommunications line-card glue logic, bus-bridge and protocol-conversion designs, industrial control systems, and image-processing front-ends. The combination of high gate density, 250 MHz internal performance, and the industrial temperature range makes it well-suited to legacy telecom and industrial platforms.
When designing with the EP20K200CF484I9N, note that the 484-pin BGA requires X-ray inspection and controlled reflow profiles; thermal dissipation must be evaluated for continuous high-utilization designs, and the part is mature/NRND — confirm long-term availability before committing to new designs.
This page consolidates distributor pricing, same-family drop-in alternatives from the Altera APEX 20K series, lifecycle status, and practical design considerations not found in the manufacturer datasheet alone, helping engineers evaluating the APEX 20KC platform make informed sourcing and design decisions.
Drop-in alternatives for EP20K200CF484I9N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200CF484I9N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Family, Core Supply Voltage (VCCINT).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200CF484I9
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP20K200CF484I8N
✅ Drop-In✓ In Stock
$612.8 / Unit
View Datasheet →EP20K200CF484I8
✅ Drop-In✓ In Stock
$471.1 / Unit
View Datasheet →EP20K200CF484I7
✅ Drop-In✓ In Stock
$89.5 / Unit
View Datasheet →EP20K200CF484C9N
✅ Drop-In✓ In Stock
$201.04 / Unit
View Datasheet →EP20K200CF484C9
✅ Drop-In✓ In Stock
$201.04 / Unit
View Datasheet →EP20K200CF484C8N
✅ Drop-In✓ In Stock
$102.95 / Unit
View Datasheet →EP20K200CF484I9N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements / Cells | 8,320 |
| Maximum Gates | 200,000 |
| Maximum Internal Frequency | 250 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.8 V nominal (1.71 V to 1.89 V) |
| Package | 484-pin FBGA (PBGA484), 1.0 mm pitch |
| User I/O Count | 376 (368 user I/O + 4 dedicated inputs) |
| Speed Grade | I9 (industrial, highest-performance bin) |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI |
| Configuration Interface | JTAG IEEE 1149.1, ByteBlaster/BitBlaster serial |
| On-chip Memory | Embedded System Blocks (ESBs) for distributed RAM/ROM |
| Lead-Free (Pb-free) | Yes (N suffix) |
| RoHS Status | Compliant |
EP20K200CF484I9N 484-pin fbga (pbga484), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP20K200CF484I9N (484-pin fbga (pbga484), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200CF484I9N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200CF484I9N is suitable for 6 applications: ASIC Prototyping and Emulation, Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation, Image and Video Processing Front-Ends, Legacy Military and Aerospace Avionics Bus Bridging, Embedded DSP and Data Acquisition Systems.
ASIC Prototyping and Emulation
The EP20K200CF484I9N's 8,320 logic elements, 200K-gate capacity, and 250 MHz internal clock make it well-suited to ASIC prototyping where designers validate ASIC netlists on reconfigurable hardware before tapeout. The APEX 20KC MultiCore architecture integrates logic with embedded system blocks (ESBs) for distributed RAM/ROM, allowing designers to model both random logic and memory structures accurately. With 376 user I/O pins in the FBGA484 package, the device supports wide datapath emulation; the I9 industrial temperature grade permits prototyping of industrial-grade ASICs. Industrial temperature range, 250 MHz performance, and embedded memory provide a balance of capacity, speed, and flexibility that speeds up verification of mid-complexity ASICs before committing to silicon. Companion memory (e.g., SRAM or SDRAM) and JTAG-based configuration complete a typical prototyping platform.
Recommended
Telecommunications Line-Card Glue Logic
Telecom line cards frequently require moderate-density, high-I/O-count programmable logic for protocol bridging, bus conversion, and framer interfacing — a workload that fits the EP20K200CF484I9N precisely. The device's 376 I/O pins easily absorb wide parallel buses (e.g., 32- or 64-bit H.110/H.100 CT buses, Utopia interfaces, or POS-PHY connections) while the 250 MHz internal clock handles up to 77 MHz LVTTL system-side timing with margin. PCI-compliant I/O support enables direct connection to processor buses. Industrial temperature operation and proven reliability make it acceptable for legacy telecom infrastructure that has been in service since the early 2000s. Power dissipation at typical 50% utilization is roughly 1.5–2.5 W, manageable with the thermally enhanced FBGA484 package and standard airflow.
Recommended
Industrial Control and Factory Automation
Factory automation controllers, motor-control front-ends, and process-control systems require deterministic digital logic with wide industrial temperature tolerance — the EP20K200CF484I9N provides exactly this profile. The I9 industrial speed grade delivers deterministic timing at –40 °C to +85 °C, while the 376 I/O pins accept the large number of sensor inputs, encoder feedback channels, and discrete outputs typical of PLC and CNC subsystems. With 250 MHz internal performance, the FPGA can implement real-time control loops with sub-microsecond response. The FBGA484 package's thermally enhanced construction handles elevated ambient temperatures typical of enclosure-mounted industrial equipment, and APEX 20KC's long production history means established reliability data is available for industrial certifications.
Recommended
Image and Video Processing Front-Ends
Mid-resolution image processing pipelines — from machine-vision cameras to medical imaging pre-processors and broadcast video routers — frequently rely on programmable logic for real-time pixel-rate operations. The EP20K200CF484I9N's 250 MHz internal clock and 8,320 logic elements can implement parallel pixel-processing datapaths at video rates (e.g., 27 MHz for SDTV, 74 MHz for HDTV 720p) while its 376 I/O pins accept wide video buses (16/24/32-bit parallel). Embedded system blocks provide line buffers and small FIFOs needed between camera and processor. Industrial temperature rating supports medical and factory imaging deployments. Compared to discrete ASIC alternatives, the FPGA enables rapid iteration of vision algorithms without re-spinning silicon.
Recommended
Legacy Military and Aerospace Avionics Bus Bridging
Many legacy avionics platforms use MIL-STD-1553, ARINC 429, or proprietary high-speed serial buses that require protocol conversion to modern processor interfaces. The EP20K200CF484I9N is widely deployed in this role due to its industrial temperature range, robust FBGA484 packaging, and reliable timing characteristics. With 8,320 logic elements, a single device can implement multiple protocol converters simultaneously while 376 user I/O pins accommodate the large number of redundant bus interfaces required for fault-tolerant avionics architectures. The APEX 20K family has extensive field history in avionics programs, with established reliability and radiation-tolerance screening options available through Altera's MIL/Aero product lines.
Recommended
Embedded DSP and Data Acquisition Systems
High-speed data acquisition cards and embedded DSP co-processors benefit from the EP20K200CF484I9N's combination of 8,320 logic elements, embedded system blocks (ESBs), and 250 MHz internal performance. The FPGA can implement FIR filters, FFT butterflies, and custom DSP datapaths while offloading the host processor. The 376 I/O pins accommodate wide ADC/DAC interfaces and high-speed parallel data ports, while the FBGA484's 1.0 mm ball pitch supports high-density board layouts. Industrial temperature operation suits test & measurement equipment deployed in field environments. The APEX 20KC's distributed memory architecture minimizes external SRAM access, reducing system cost and complexity.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200CF484I9N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200CF484I9 | EP20K200CF484I8N | EP20K200CF484I7 | EP20K200CF484C9N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-484 (1.0 mm pitch) | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same | FBGA-484 (1.0 mm pitch) - same |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Maximum System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Maximum Internal Frequency | 250 MHz | 250 MHz | ~215 MHz (-8 grade) | ~200 MHz (-7 grade) | 250 MHz |
| Speed Grade | I9 (industrial highest) | I9 (industrial highest) | I8 (industrial) | I7 (industrial lowest) | C9 (commercial) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +85C |
| Core Supply Voltage | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal |
| Lead-Free Finish | Yes (N suffix) | No (SnPb) | Yes (N suffix) | No (SnPb) | Yes (N suffix) |
Key Differentiators
- Highest performance bin (I9) in the APEX 20KC family (vs EP20K200CF484I8N)
- Lead-free terminal finish (Pb-free) (vs EP20K200CF484I9)
- Industrial temperature range for harsh environments (vs EP20K200CF484C9N)
- Highest logic density in the 484-pin FBGA APEX 20K footprint (vs EP20K100QC240-3N)
Design Notes
The FBGA-484 package uses Altera's thermally enhanced construction, but at full 250 MHz utilization across 8,320 logic cells, power dissipation can reach 2.5–3.5 W depending on toggle rate. Estimated: at 50% toggle rate and 1.8 V core, expect ~2 W dissipation. Ensure PCB design has at least 4 thermal vias under the package center BGA array to a ground plane; in enclosed industrial enclosures, derate ambient temperature by 15 °C or add forced-air cooling. The "I" temperature grade permits –40 °C to +85 °C ambient operation only when thermal resistance (theta_JA) keeps junction below 125 °C.
The 484-pin FBGA uses 1.0 mm ball pitch — fine-pitch BGA layout rules apply. Use 0.4 mm (16 mil) via pad with 0.5 mm drill, microvia stackups if the design uses 4+ signal layers, and full-array BGA escape routing in the top two layers. NSMD (non-solder-mask-defined) pads are recommended for reliability. Match the manufacturer's recommended land pattern from the Altera APEX 20K Package Information Data Sheet exactly — even 0.05 mm deviations cause head-in-pillow or bridging defects during reflow.
Do not substitute the EP20K200CF484I9N with the EP20K1000CF672I9N — same family, different pin count (484 vs 672 FBGA) and different gate capacity (200K vs 1M). They are NOT drop-in replacements and will not fit each other's footprint. Also note the 'I' vs 'C' temperature grade: an I-grade part works at –40 °C, a C-grade part does not — for outdoor, automotive, or industrial applications, I-grade is mandatory. Verify JTAG configuration chain with ByteBlasterMV or USB-Blaster before committing the PCB layout.
Separate analog/mixed-signal reference voltages from the FPGA's I/O banks to avoid coupling through the BGA substrate. Place decoupling capacitors (0.1 µF ceramic + 10 µF tantalum per supply pin) within 5 mm of each BGA power pin. The APEX 20KC has 8 supply rails (VCCINT, VCCIO banks 1–4, VCCPD, VCCA_PLL, VCCD_PLL) — refer to the pinout to identify each rail and decouple it individually. Estimated: roughly 40–60 decoupling capacitors are typical for the full FBGA484 design.
Compliance Information
RoHS compliant per Altera/Intel FPGA product declaration. Pb-free terminal finish indicated by N suffix. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC). Halogen-free status not stated in available data — verified at unknown. Conflict-minerals declaration available from Altera/Intel.
