EP20K200CF484I7 - APEX 20KC 200K Gates FPGA 1.8V FBGA-484 | Altera
MPN: EP20K200CF484I7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $102 | $51,000.00 |
| 1,000 | $89.5 | $89,500.00 |
EP20K200CF484I7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the designer after manufacturing to implement arbitrary digital logic. APEX 20KC sits in the FPGA taxonomy as a high-density SRAM-based device - hierarchically: PLD (programmable logic device) -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA family. The APEX 20KC family combines look-up-table (LUT) based logic elements with embedded array blocks (EABs) used for memory, multipliers, and DSP-like functions, allowing dense implementation of datapath, glue logic, and bus-interface functions on a single die.
Key specifications of the EP20K200CF484I7 include 8,320 logic elements, 8,320 flip-flops, a maximum internal operating frequency around 375 MHz (per Altera device-family data), 376 user I/O pins, and 4 dedicated inputs. It is offered in the -7 speed grade and the industrial temperature range (-40 °C to +85 °C case), as denoted by the I7 suffix. The 1.8 V VCCINT, 1.71 V - 1.89 V tolerance, and 0.15 µm copper interconnect give the part its characteristic balance of integration density, static power, and toggle performance that made it a workhorse for telecom line cards, industrial controllers, and prototyping platforms in the early-to-mid 2000s.
Typical applications include telecommunications infrastructure (bridges, switches, line cards), industrial machine control, test and measurement backplanes, and ASIC prototyping. The MultiVolt I/O makes it especially useful for bridging 5 V legacy peripherals to 3.3 V or 2.5 V processors on the same board, while the embedded array blocks accelerate RAM, ROM, and DSP functions.
A key design consideration when using the EP20K200CF484I7 today is component longevity: APEX 20KC is an older Altera (now Intel PSG) family with limited active support. Designers should verify lifecycle status, long-term supply, and second-source options (Cyclone, MAX, or newer Stratix equivalents) before committing to new production designs. For new designs, modern Cyclone IV/V or Cyclone 10 LP devices are recommended pin-compatible successors with active lifecycles and lower static power.
The I7 suffix denotes the industrial temperature grade and -7 speed grade, while the CF484 package code identifies the 484-ball FineLine BGA. This page synthesizes distributor pricing, lifecycle signals, and drop-in alternatives not consolidated on a single manufacturer datasheet, enabling faster component selection for both legacy maintenance and cost-down redesigns.
Drop-in alternatives for EP20K200CF484I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200CF484I7 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200CF484C7
✅ Drop-In✓ In Stock
$82 / Unit
View Datasheet →EP20K200CF484C8
✅ Drop-In✓ In Stock
$410.75 / Unit
View Datasheet →EP20K200CF484C9
✅ Drop-In✓ In Stock
$201.04 / Unit
View Datasheet →EP20K200CF484C8N
✅ Drop-In✓ In Stock
$102.95 / Unit
View Datasheet →EP20K200CF484C9N
✅ Drop-In✓ In Stock
$201.04 / Unit
View Datasheet →EP20K200CF484I7 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements | 8,320 |
| Typical Gate Count | 200,000 system gates |
| Maximum Operating Frequency | 375.94 MHz (per device-family data) |
| Process Technology | 0.15 µm CMOS with copper interconnect |
| Internal Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt I/O) |
| User I/O Pins | 376 |
| Dedicated Inputs | 4 |
| Package | 484-pin FBGA (FineLine BGA) |
| Package Body Size | 23 mm × 23 mm |
| Ball Pitch | 1.000 mm |
| Speed Grade | -7 |
| Temperature Grade (I7 suffix) | Industrial, -40 °C to +85 °C |
| Configuration Technology | SRAM-based, re-programmable in-system |
EP20K200CF484I7 23 mm × 23 mm Pin Configuration Guide
Pin configuration for EP20K200CF484I7 (23 mm × 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200CF484I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200CF484I7 is suitable for 6 applications: Telecommunications Line Cards, Industrial Machine Controllers, ASIC Prototyping and Emulation, Test and Measurement Backplanes, Mixed-Voltage Legacy Bridging, Legacy Avionics and Defense Systems.
Telecommunications Line Cards
The EP20K200CF484I7's 200K system gates and 376 user I/Os make it well suited for legacy telecom line-card designs requiring high-density glue logic, custom bus interfacing, and protocol adaptation. Its MultiVolt I/O bridges 5 V TDM framers to 3.3 V or 2.5 V network processors without level shifters, while embedded array blocks (EABs) implement small FIFOs and lookup tables common in telecom datapaths. Estimated: at 1.8 V VCCINT with ~50% toggle activity, typical core current is on the order of hundreds of mA; designers should budget for the 1.8 V regulator to supply at least 1 A continuous headroom.
Recommended
Industrial Machine Controllers
The EP20K200CF484I7 in industrial temperature grade (-40 °C to +85 °C) fits PLC-style machine controllers where custom deterministic logic, encoder decoding, and motor-control state machines must coexist on one die. The 8,320 logic elements and EAB-based memory support encoder counters, lookup-table-driven PWM, and safety-logic blocks while keeping all timing on a single device. MultiVolt I/O interfaces both 5 V industrial sensors and 3.3 V processors. Note: the APEX 20KC family is last-time-buy; new industrial designs should evaluate Cyclone IV/V with active lifecycle support instead.
Recommended
ASIC Prototyping and Emulation
The 200K-gate density of the EP20K200CF484I7 makes it a useful vehicle for prototyping and pre-silicon validation of medium-complexity ASICs in the early 2000s era. Designers mapped RTL into 8,320 logic elements and EAB-based RAM/ROM, validated system behavior at near-ASIC clock rates, and refined the design before tape-out. SRAM-based configuration enables rapid design-iteration cycles. For modern ASIC prototyping, larger Stratix or Cyclone devices in similar FineLine BGA packages offer much higher logic densities and faster compile times, but the EP20K200CF484I7 remains a known, documented platform for maintaining legacy emulation flows.
Recommended
Test and Measurement Backplanes
The EP20K200CF484I7 supports custom backplane interfacing in test and measurement systems where 376 user I/Os can be partitioned across multiple VCCIO banks to mix 5 V, 3.3 V, and 2.5 V instruments on one bus. EABs implement small pattern memories and capture buffers, while general LUT logic handles protocol conversion between PXI, VXI, or proprietary test buses. Estimated: at full -7 speed grade the part supports internal clock rates around 375 MHz per device-family data, suitable for high-throughput parallel test patterns. Industrial temperature grade enables deployment in lab and light-industrial environments.
Recommended
Mixed-Voltage Legacy Bridging
The MultiVolt I/O capability of the EP20K200CF484I7 makes it a strong choice for bridging legacy 5 V peripherals to modern 3.3 V or 2.5 V processors on the same PCB, eliminating discrete level-shifter ICs. Bank-by-bank VCCIO selection allows 5 V on one bank and 3.3 V on another, simplifying board layout and reducing BOM cost in industrial and instrumentation designs with mixed-vintage components. The 8,320 logic elements handle protocol conversion and timing adaptation between buses. Note: lead-free / RoHS-compliant variants (N suffix) may be required for new EU production; verify finish before substituting.
Recommended
Legacy Avionics and Defense Systems
Long-lifecycle defense and avionics platforms that adopted APEX 20KC in the early 2000s continue to use the EP20K200CF484I7 for sustainment because re-qualification of a new FPGA family would be prohibitively expensive. The industrial temperature grade covers most cockpit and ground-vehicle environments, while the FBGA-484 footprint and -7 speed grade are documented and stable across manufacturing lots. Long-term support depends on remaining factory and channel inventory plus third-party test services; programs should track DoD Diminishing Manufacturing Sources alerts and consider aftermarket up-screening for high-reliability deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200CF484I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200CF484C7 | EP20K200CF484C8 | EP20K200CF484C9 | EP20K200CF484C8N | EP20K200CF484C9N |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) | Altera (now Intel PSG) |
| Package | FBGA-484 (23x23mm, 1.0mm pitch) | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same | FBGA-484 (23x23mm, 1.0mm pitch) - same |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -7 | -7 (same) | -8 (slower) | -9 (slowest) | -8 (slower) | -9 (slowest) |
| Logic Elements | 8,320 | 8,320 (same) | 8,320 (same) | 8,320 (same) | 8,320 (same) | 8,320 (same) |
| User I/O Pins | 376 | 376 (same) | 376 (same) | 376 (same) | 376 (same) | 376 (same) |
| Internal Supply (VCCINT) | 1.8 V | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) | 1.8 V (same) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Industrial temperature grade in the same FBGA-484 footprint as commercial variants (vs EP20K200CF484C7)
- Faster -7 speed grade versus -8 or -9 alternatives (vs EP20K200CF484C8 / EP20K200CF484C9)
- Highest-density APEX 20KC member in the FBGA-484 package (vs EP20K100CF324C9 (lower-density sibling))
Design Notes
EP20K200CF484I7 requires a clean 1.8 V VCCINT rail (1.71 V to 1.89 V tolerance) plus separate VCCIO rails per bank at 1.8/2.5/3.3/5.0 V. Estimated: at typical industrial operating activity the core current is on the order of several hundred mA, so a low-dropout regulator capable of at least 1 A continuous with adequate bulk decoupling (e.g., 470 µF aluminum polymer + 10 µF + 100 nF ceramic) is recommended. Sequence VCCINT before VCCIO to prevent I/O latch-up during power-up.
Estimated: at 1.8 V core supply with high toggle activity and ~50% I/O switching, total power dissipation can reach 1-2 W; the 23 × 23 mm FBGA has moderate thermal resistance but benefits from a thermal pad or internal PCB copper plane tied to a quiet ground. Use thermal vias under the package center ball grid to spread heat into inner copper layers, and avoid placing the device directly above heat-generating components on the opposite PCB side.
The 484-ball FBGA at 1.000 mm pitch requires 4-6 layer PCB with microvia or laser-drilled stacked-via technology for reliable fanout; standard 8/8 mil trace-and-space rules with 12 mil via pads typically work but require design-for-manufacturing review. Place 100 nF decoupling capacitors as close as possible to every VCCINT and VCCIO ball, with bulk capacitors around the package perimeter; keep configuration / JTAG traces short and impedance-controlled.
Common pitfalls include: (1) ignoring last-time-buy status and designing in EP20K200CF484I7 for new production without planning a Cyclone migration; (2) mixing industrial and commercial temperature grades unintentionally when substituting C7/I7 variants; (3) assuming MultiVolt I/O makes all banks 5 V tolerant - each bank has its own VCCIO and must be configured separately; (4) using N-suffix parts only when RoHS compliance is required and verifying the customer bill-of-materials is consistent.
Compliance Information
RoHS / lead-free status not explicitly stated in the provided verified data; verify with the manufacturer before use in EU production. N-suffix variants (e.g., EP20K200CF484C8N) indicate lead-free finishes. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC in the AEC-Q100 sense.
