EP20K200EBC356-1 - APEX 20K 200K Gates FPGA, BGA-356 | Altera
MPN: EP20K200EBC356-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
EP20K200EBC356-1 Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that lets engineers implement arbitrary digital logic by configuring an array of configurable logic blocks (CLBs) and programmable interconnect. The APEX 20K family further distinguishes itself with MultiCore architecture, which integrates look-up-table (LUT)-based logic, product-term-based logic, and an embedded memory structure (ESB) on a single die. This multi-paradigm approach is designed for system-on-a-programmable-chip (SOPC) integration.
Key features of the EP20K200EBC356-1 include 277 user I/Os, a 2.5 ns propagation delay, and the APEX 20KE enhanced-memory variant with on-chip SRAM-based memory blocks. The device is supported by the Altera Quartus II development system, providing HDL and schematic entry, synthesis, full timing simulation, SignalTap logic analysis, and device configuration. Operating temperature range is 0 °C to 85 °C (commercial grade).
The MultiCore architecture makes the EP20K200EBC356-1 particularly well suited for designs that mix wide datapath logic, control-state product-term logic, and on-chip buffering. Designers can instantiate embedded memory blocks for FIFOs, dual-port RAM, or content-addressable memory without sacrificing logic resources, while LUT-based elements accelerate arithmetic, DSP, and register pipelines.
Typical applications include high-speed telecommunications backplanes, ASIC prototyping, video and image processing pipelines, industrial control systems, and military/aerospace prototyping platforms. The 356-ball BGA package supports the large I/O count required for parallel memory buses, LVDS links, and processor-to-FPGA glue logic on complex boards.
When designing with the EP20K200EBC356-1, ensure proper power sequencing on the 1.8 V core rail and use the Quartus II design software with the correct device pinout file for the BGA-356 package. Decoupling must follow Altera's APEX 20K reference design guidelines, and JTAG configuration via ByteBlaster or MasterBlaster is recommended for production programming.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, including sourcing context for legacy inventory.
Drop-in alternatives for EP20K200EBC356-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K200EBC356-1 (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Family, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K200BC356-1
✅ Drop-In✓ In Stock
$335 / Unit
View Datasheet →EP20K200BC356-1X
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP20K200CB356C8N
✅ Drop-In✓ In Stock
$56.4 / Unit
View Datasheet →EP20K200CB356C7N
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP20K200CB356C9
✅ Drop-In✓ In Stock
$69.95 / Unit
View Datasheet →EP20K200EBC356-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EBC356-1 Maximum Ratings & Electrical Characteristics
| Family | APEX 20K (APEX 20KE) |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Maximum User I/Os | 277 |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) |
| Process Technology | 0.22 µm CMOS |
| Propagation Delay | 2.5 ns |
| Internal Performance | Up to 367 MHz |
| Package | 356-ball LBGA (35 x 35 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| On-chip Memory | Embedded System Blocks (ESB / SRAM) |
| Configuration Method | JTAG (ByteBlaster / MasterBlaster), passive serial |
| Development Software | Altera Quartus II |
| Lifecycle Status | Obsolete / EOL |
EP20K200EBC356-1 356-ball lbga (35 x 35 mm) Pin Configuration Guide
Pin configuration for EP20K200EBC356-1 (356-ball lbga (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K200EBC356-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K200EBC356-1 is suitable for 6 applications: ASIC Prototyping, Telecommunications Backplane Interface, Digital Signal Processing (DSP) Pipelines, Industrial Control and Machine Vision, Legacy Military / Aerospace Avionics, High-Speed Video and Imaging Processing.
ASIC Prototyping
The EP20K200EBC356-1's 200K system gates, 8,320 logic elements, and 277 user I/Os make it ideal for ASIC prototyping where engineers emulate complex system-on-chip designs before tape-out. The MultiCore architecture combines LUT-based logic for datapath and DSP blocks with product-term logic for control state machines, allowing full-chip emulation at up to 367 MHz internal performance. Placed on a dedicated prototype board with JTAG-based configuration via ByteBlaster, the BGA-356 package supports wide parallel buses, multiple clock domains, and abundant probing. Engineers benefit from Quartus II synthesis and timing simulation, while the device's embedded system blocks (ESBs) provide on-chip SRAM for cache, FIFO, and register-file emulation critical to modern ASIC verification flows.
Recommended
Telecommunications Backplane Interface
In telecom backplane designs, the EP20K200EBC356-1 provides the high I/O count (277 pins) and fast propagation delay (2.5 ns) required to bridge multiple line cards, framer ICs, and switch-fabric ASICs. The 1.8 V core and MultiCore architecture let designers implement 8B/10B encoders, ATM/SONET framers, and pseudo-random pattern checkers alongside LVDS and HSTL I/O buffers in a single device. Compared to discrete TTL logic, the BGA-356 FPGA reduces board area and BOM cost while delivering deterministic timing for STS-1/STM-0 traffic shaping. Designers use the embedded system blocks to build elastic stores and small packet buffers directly on-chip, eliminating external FIFOs and improving signal integrity on long backplane traces.
Recommended
Digital Signal Processing (DSP) Pipelines
The EP20K200EBC356-1's MultiCore LUT-based architecture is optimized for DSP datapath designs, supporting FIR filters, FFT engines, and digital downconverters at audio and baseband sample rates. With 8,320 logic elements and on-chip ESB SRAM, designers can implement coefficient tables, delay lines, and circular buffers without external memory, reducing latency and PCB complexity. The 367 MHz internal performance enables high-tap FIR filters and 1024-point FFTs at real-time throughput. Placed between the ADC input and the host processor, the BGA-356 device provides ample I/O for parallel data buses and JTAG-based in-system debugging, making it a strong fit for software-defined radio, sonar, and baseband prototyping pipelines.
Recommended
Industrial Control and Machine Vision
The EP20K200EBC356-1 is widely used in industrial automation and machine vision controllers where 277 user I/Os, embedded memory, and deterministic timing simplify integration of sensors, encoders, and motor drivers. The MultiCore architecture lets designers implement PID loops, motion-control state machines, and image preprocessing pipelines (Sobel, threshold, blob detection) in one device. With 1.8 V core operation and commercial 0-85 °C temperature range, the BGA-356 fits into ruggedized enclosures with proper thermal management. The Quartus II SignalTap feature enables real-time debugging of control loops on the factory floor, reducing commissioning time for high-mix manufacturing systems.
Recommended
Legacy Military / Aerospace Avionics
Although end-of-life, the EP20K200EBC356-1 remains in service in legacy military and aerospace platforms where re-design certification costs are prohibitive. The 356-ball LBGA package is robust under vibration when properly under-filled, and the MultiCore architecture supports MIL-STD-1553, ARINC 429, and discrete avionics bus interfaces in a single FPGA. Engineers maintain fielded systems by sourcing factory-traceable stock from authorized aftermarket suppliers such as Rochester Electronics. For new programs, modern radiation-tolerant FPGAs are recommended, but the EP20K200EBC356-1 continues to provide reliable logic capacity for sustainment programs through the late 2020s.
Recommended
High-Speed Video and Imaging Processing
The EP20K200EBC356-1 supports real-time video processing pipelines including color space conversion, scaling, alpha blending, and overlay generation for broadcast and medical imaging equipment. With 277 user I/Os, designers can interface directly to DVI receivers, video ADCs/DACs, and DDR memory controllers without external glue logic. The on-chip ESB SRAM buffers video lines and performs look-up-table gamma correction at pixel-clock rates. The BGA-356 footprint integrates cleanly onto mid-complexity video capture cards, and Quartus II IP cores accelerate development of standard interfaces (I2C for HDMI control, SPI for EEPROM configuration). Legacy broadcast studios continue to rely on this APEX 20KE part for SDI and component video routing.
Recommended
Recommended Products Summary
Engineering reference data for EP20K200EBC356-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K200BC356-1 | EP20K200BC356-1X | EP20K200CB356C8N | EP20K200CB356C7N | EP20K200CB356C9 | EP20K200EBC356-1X |
|---|---|---|---|---|---|---|---|
| Package | 356-ball LBGA (35x35) | 356-ball LBGA (35x35) - same | 356-ball LBGA (35x35) - same | 356-ball LBGA (35x35) - same | 356-ball LBGA (35x35) - same | 356-ball LBGA (35x35) - same | 356-ball LBGA (35x35) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | APEX 20KE | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20KE |
| Speed Grade | -1 (slowest) | -1 (slowest) | -1 (slowest) | -8 (faster) | -7 (fastest) | -9 (slower) | -1 (same) |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| User I/Os | 277 | 277 | 277 | 277 | 277 | 277 | 277 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Enhanced MultiCore architecture with larger ESB memory (vs EP20K200BC356-1)
- -1 speed grade supports low-power or relaxed timing budgets (vs EP20K200CB356C8N)
- Faster internal performance with same logic capacity (vs EP20K200CB356C9)
Design Notes
The EP20K200EBC356-1 requires a tightly regulated 1.8 V core supply in the range 1.71 V to 1.89 V, plus separate I/O bank supplies for the chosen I/O standards (typically 2.5 V or 3.3 V). According to Altera application notes, designers must sequence the core supply before I/O supplies during power-up to avoid I/O pin drive into unpowered logic. A 100 µF bulk capacitor plus 0.1 µF and 0.01 µF decoupling caps placed adjacent to each power pin is recommended. In-rush current during configuration can exceed 1 A momentarily; size the regulator accordingly.
Estimated: at full toggle rate on 277 I/Os and 1.8 V core with 50% switching activity, the EP20K200EBC356-1 may dissipate up to 2-3 W. The 356-ball LBGA package (35 x 35 mm) has a typical θJA of approximately 18 °C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of 36-54 °C. In enclosed chassis without airflow, derate the maximum ambient to ~50 °C to keep Tj below 125 °C. Always cross-check with the latest Altera thermal model for the specific BGA substrate.
The 356-ball LBGA at 1.27 mm pitch demands a 4-layer or 6-layer PCB with matched-impedance routing for clock and LVDS traces. Per Altera APEX 20K design guidelines, BGA fan-out should use via-in-pad or dog-bone patterns with 0.2 mm micro-vias; escape routing on the top layer requires careful length matching for differential pairs. Use the Quartus II Fitter pin assignments to drive the PCB layout, and avoid routing signals beneath the BGA power/ground balls.
Do not confuse the EP20K200EBC356-1 with the EP20K200BC356-1 or EP20K200CB356C7N: the 'E' suffix indicates the enhanced-memory APEX 20KE variant, while the trailing speed grade changes timing margins significantly. Configuration failures on first prototypes are typically caused by missing or wrong-value pull-ups on nCONFIG and nSTATUS, or by incorrect TCK frequency during JTAG programming (must stay below 16 MHz for APEX 20K). Always confirm the device ID read back matches 0x202000DD before loading the .pof file.
Compliance Information
RoHS/REACH compliance was not stated in the verified web data. APEX 20K family predates widespread lead-free mandates; confirm with the specific date code and manufacturer documentation before using in RoHS-restricted products. AEC-Q100 is not applicable to FPGAs.
