EP20K30EFC324-1 - APEX-20K 30KLE FPGA 324-FBGA | Altera
MPN: EP20K30EFC324-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 250 | $108 | $27,000.00 |
| 500 | $99.5 | $49,750.00 |
EP20K30EFC324-1 Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can configure after manufacture. APEX-20K belongs to the PLD -> CPLD/FPGA -> SRAM-based FPGA -> programmable logic IC hierarchy, providing system-on-a-programmable-chip (SOPC) integration. The MultiCore architecture of APEX-20KE combines look-up table (LUT) logic, product-term logic, and embedded memory blocks in one fabric.
Key features of the EP20K30EFC324-1 include 30,000 typical logic elements (LEs), 24,576 total RAM bits, 128 maximum user I/O, and 1.8 V core operation. The device supports LVDS I/O and embeds an enhanced clock management capability with up to four phase-locked loops (PLLs). The 324-FBGA package is a 19 mm x 19 mm FineLine BGA suitable for high-density PCB designs and high-speed signal fan-out.
From an architectural perspective, the APEX-20KE family uses a four-level hierarchy (Logic Array, MegaLAB, Logic Element, Embedded System Block) and embedded array blocks (EABs) for memory and product-term logic. Hot-socketing and JTAG boundary-scan testability are supported. The fabric is configured by an industry-standard serial configuration device.
Typical applications include telecommunications line cards, ASIC prototyping, glue-logic consolidation, DSP co-processing front-ends, and industrial control boards where the 30KLE density is appropriate. The 324-FBGA footprint is appropriate for high-I/O designs (128 user I/O). When designing with this part, confirm the configuration scheme (passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG) and use Altera Quartus II for synthesis and place-and-route.
Drop-in alternatives for EP20K30EFC324-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K30EFC324-1 (same form factor and footprint) — differing in Process Technology, Family, Package, Speed Grade, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K30EFC324-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K30EFC324-1N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K30EFC324-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175 / Unit
View Datasheet →EP20K60EFC324-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$41.75 / Unit
View Datasheet →EP20K100EFC324-1N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$108 / Unit
View Datasheet →EP20K30EFC324-1 Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (now Intel) |
| Series | APEX-20K |
| Family | APEX-20KE (1.8V, LVDS) |
| Logic Elements (typical) | 30,000 (30KLE) |
| Total RAM Bits | 24576 |
| Maximum User I/O | 128 |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Package | 324-FBGA (FineLine BGA, 19x19 mm) |
| Mounting Type | Surface Mount |
| Pin Count | 324 |
| Temperature Grade | Commercial (per Altera family specification) |
| Operating Temperature | 0C to +85C (commercial grade per Altera family spec) |
| Process Technology | SRAM-based, 0.18 um |
| Configuration | Passive serial / passive parallel / JTAG |
| Speed Grade | -1 |
| PLLs | Up to 4 (per APEX-20KE family) |
EP20K30EFC324-1 324-fbga (fineline bga, 19x19 mm) Pin Configuration Guide
Pin configuration for EP20K30EFC324-1 (324-fbga (fineline bga, 19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K30EFC324-1.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K30EFC324-1 is suitable for 7 applications: Legacy Telecom Line Cards, ASIC Prototyping, Industrial Control and Glue Logic Consolidation, DSP Co-Processing Front-Ends, Flat-Panel Display and Video Processing, Test and Measurement Instrumentation, Legacy Networking Backplane Bridges.
Legacy Telecom Line Cards
The EP20K30EFC324-1's 30KLE logic capacity and 128 user I/O make it suitable for legacy telecom line card glue logic, particularly E1/T1 framers, HDLC controllers, and bus-aggregation logic where APEX-20KE boards are already field-deployed. The 1.8 V core, 324-FBGA footprint and embedded array blocks (EABs) allow consolidation of multiple 5V CPLDs into one low-power device. PLLs (up to 4) can recover clock from multiple E1/T1 streams simultaneously. Use Quartus II 9.1sp2 for synthesis because newer Quartus releases dropped APEX-20KE support.
Recommended
ASIC Prototyping
With 30KLE of logic and 24,576 bits of embedded RAM (EABs), the EPEX-20K30EFC324-1 is sized appropriately for ASIC prototyping of small gate-array designs (roughly 30-60K gates). The MultiCore architecture mixing LUT logic, product-term logic, and memory blocks is faithful to common ASIC styles, allowing accurate timing simulation. The 324-FBGA package exposes all I/O for easy logic-analyzer probing on prototype boards. Designers should plan migration to Cyclone IV E or Cyclone V once the ASIC is taped out.
Recommended
Industrial Control and Glue Logic Consolidation
The EP20K30EFC324-1 is widely used in legacy industrial controllers to consolidate multiple 5 V or 3.3 V PLDs and glue-logic ICs into a single 1.8 V device, reducing board area and BOM cost. The 324-FBGA package supports 128 user I/O, sufficient for backplane glue logic, interrupt controllers, and protocol bridges (e.g. UART to SPI). Industrial users should note that the part is obsolete; redesign is recommended for new platforms but the part remains field-supported via Rochester Electronics.
Recommended
DSP Co-Processing Front-Ends
The EP20K30EFC324-1's embedded array blocks (EABs) provide up to 24,576 RAM bits that can be configured as dual-port RAM or ROM look-up tables, suitable for FIR filter coefficients or waveform tables in DSP co-processing designs. Combined with up to 4 PLLs and LVDS I/O, the part can feed data into an external DSP (e.g. a TI TMS320C6000) at high sample rates. For new DSP co-processing designs, however, modern Cyclone V or MAX 10 are recommended.
Recommended
Flat-Panel Display and Video Processing
The EP20K30EFC324-1's LVDS I/O support (a defining APEX-20KE feature) and 128 user I/O permit driving multiple LVDS data channels for flat-panel display controllers and low-resolution video processing front-ends. The fabric can implement scaling engines, color-space converters, and timing controllers. Legacy LCD TV mainboards and projector engines historically used APEX-20KE parts at this density. Modern video processing uses Cyclone IV/V with hard PCIe and DDR controllers.
Recommended
Test and Measurement Instrumentation
With 128 user I/O, four PLLs, and embedded RAM blocks, the EP20K30EFC324-1 has been used in test and measurement gear for stimulus generation, custom protocol decoding, and timing-critical pattern generation. The 324-FBGA package provides generous I/O access for parallel logic-analyzer probes. Maintenance of legacy T&M equipment (e.g. ATE loadboards, protocol testers) remains a stable use case for this part because the bitstreams are already deployed and validated.
Recommended
Legacy Networking Backplane Bridges
Legacy networking hardware - in particular PCI/PCI-X bridges, SPI/I2C aggregators, and switch fabric controllers - was designed around APEX-20KE devices like the EP20K30EFC324-1. The 324-FBGA package and 128 I/O support multi-port bridging on compact line cards. Although new networking designs use modern Cyclone V/10 and Stratix families, the EP20K30EFC324-1 remains in service for legacy switch and router platforms via Rochester Electronics' stocking program.
Recommended
Recommended Products Summary
Engineering reference data for EP20K30EFC324-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K30EFC324-2 | EP20K30EFC324-1N | EP20K30EFC324-3 | EP20K60EFC324-2 | EP20K100EFC324-1 |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm) | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 30,000 (30KLE) | 30,000 | 30,000 | 30,000 | 60,000 (60KLE) | 100,000 (100KLE) |
| Speed Grade | -1 (fastest) | -2 (slower) | -1 (same, lead-free) | -3 (slowest) | -2 | -1 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatibility | Reference | Compatible (same IDCODE/density) | Compatible (same IDCODE/density) | Compatible (same IDCODE/density) | NOT compatible - different IDCODE/density | NOT compatible - different IDCODE/density |
Key Differentiators
- Fastest speed grade in APEX-20KE 30KLE 324-FBGA family (vs EP20K30EFC324-3)
- Lead-free (-1N) variant preserves identical timing for reflow compatibility (vs EP20K30EFC324-1 (lead version))
- Lowest-density / smallest-bitstream 324-FBGA APEX-20KE option (vs EP20K100EFC324-1)
Design Notes
Do not assume 324-FBGA across different APEX-20KE logic densities share bitstreams. EP20K30EFC324-1, EP20K60EFC324, and EP20K100EFC324 all share the same 324-FBGA ballmap, but each has a unique IDCODE and bitstream. Programming an EP20K30EFC324-1 bitstream into a larger-density device does NOT work - Quartus II will detect the IDCODE mismatch and refuse to configure. For migration, re-synthesize the design at the new density before programming.
The 324-FBGA 19 mm x 19 mm package requires a 1.27 mm ball pitch and at least 6 PCB layers to route 128 user I/O with controlled impedance. Use microvia or via-in-pad technology if the PCB stackup is 8 layers or fewer; otherwise dog-bone fan-out is acceptable but consumes more board area. BGA landing pads must be NSMD (non-solder-mask defined) for reliable joint formation - MSMD pads are prone to cracking under thermal cycling.
Estimate: at typical 1.8 V core, 30KLE utilization around 70%, and 50 MHz clock, ICCINT is approximately 0.3-0.5 A (estimate based on APEX-20KE family typical current). VCCIO banks consume additional current proportional to switching I/O; a fully-loaded 16-bit LVDS bank can draw an additional 0.05-0.1 A. Decouple each VCCINT pin with 0.1 uF + 10 uF, and each VCCIO bank with 0.1 uF per pin. A bulk 47-100 uF tantalum at the regulator output is recommended.
Keep all configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL, DCLK, DATA0) routed away from switching I/O to avoid noise coupling during configuration. The JTAG chain (TCK, TMS, TDI, TDO) should be series-terminated with 33 ohm if the chain exceeds 4 inches. Place the configuration EPROM/CPLD within 2 inches of the FPGA to minimize DCLK skew during passive-serial configuration.
Compliance Information
RoHS and lead-free status not specified in the verified web data; EP20K30EFC324-1N variant is a lead-free / Pb-free variant per APEX-20KE family naming convention. Original -1 (without N suffix) is presumed non-RoHS.
