EP20K30EFC324-2X - APEX-20KE FPGA 30K Gates 324-FBGA | Altera
MPN: EP20K30EFC324-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $35 | $35.00 |
| 10 | $32.5 | $325.00 |
| 100 | $28 | $2,800.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21 | $21,000.00 |
EP20K30EFC324-2X Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing through a configuration bitstream. Unlike a CPLD, an FPGA uses an array of small look-up tables (LUTs), flip-flops, programmable interconnect, and embedded block RAM. The APEX-20KE family extends this with embedded product-term logic for register-intensive glue functions. Within the broader semiconductor hierarchy, an FPGA sits above CPLDs and below ASICs in terms of integration density, offering high logic capacity, reprogrammability, and embedded memory for digital signal processing, bus interface, and glue-logic roles.
Key specifications of the EP20K30EFC324-2X include 30K typical gates, 1,200 logic elements, 24,576 total RAM bits, a 2.69 ns pin-to-pin delay, 128 maximum user I/O pins, and up to 4 phase-locked loops (PLLs) for clock management. The device supports LVDS I/O and multiple I/O standards, and it is supplied in a 324-pin FineLine BGA (19x19 mm) package suitable for high-density PCB designs. The -2X speed grade indicates enhanced performance over the standard -2 grade at extended temperature.
The MultiCore architecture combines LUT-based logic, product-term logic, and embedded memory blocks, allowing designers to map register-intensive functions to product-term arrays and datapath functions to LUTs. Embedded RAM supports single- and dual-port operation, enabling on-chip FIFOs and buffering without external memory for moderate workloads. This architectural balance was distinctive for its era, prefiguring the heterogeneous fabric used in modern SoC FPGAs.
Typical applications include telecommunications line cards, industrial control, glue-logic and bus bridging on legacy systems, ASIC prototyping, and embedded DSP preprocessing. The wide I/O count makes the device suitable for parallel datapaths, memory controllers, and multi-protocol bridge functions where 128 user I/O pins are required.
Designers should note that the APEX-20KE family is a mature, NRND/EOL-prone product line; verify current lifecycle status with Intel before committing to new designs. The 1.8V core supply and 324-FBGA package demand multi-layer PCB design with controlled-impedance routing and careful power-plane decoupling. Configuration data must be loaded from a PROM or flash memory at power-up.
This page consolidates distributor pricing, drop-in same-package alternatives within the APEX-20KE family, and practical FPGA design notes not found in the manufacturer datasheet, providing a one-stop reference for engineers specifying the EP20K30EFC324-2X.
Drop-in alternatives for EP20K30EFC324-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K30EFC324-2X (same form factor and footprint) — differing in Family, Process Technology, Total RAM Bits, Package, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K30EFC324-1X
✅ Drop-In✓ In Stock
$3.3 / Unit
View Datasheet →EP20K30EFC324-1
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP20K60EFC324-2X
✅ Drop-In✓ In Stock
$195.5 / Unit
View Datasheet →EP20K100EFC324-2X
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP20K30EFC324-3
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K30EFC324-2X Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Family | APEX-20KE (1.8V, LVDS) |
| Manufacturer | Altera (Intel) |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gates | 30,000 |
| Logic Elements | 1,200 |
| Total RAM Bits | 24,576 |
| Maximum User I/O | 128 |
| Pin-to-Pin Delay | 2.69 ns |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| Process Technology | 0.22 micrometer |
| Package / Case | 324-BGA (FineLine) |
| Supplier Device Package | 324-FBGA (19x19 mm) |
| Mounting Type | Surface Mount |
| I/O Standard Support | LVDS, LVTTL, LVCMOS, PCI |
| PLL Count | 4 |
| Speed Grade | -2X |
| Configuration Method | Serial / Parallel PROM or flash |
EP20K30EFC324-2X 324-fbga (19x19 mm) Pin Configuration Guide
Pin configuration for EP20K30EFC324-2X (324-fbga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K30EFC324-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K30EFC324-2X is suitable for 7 applications: Telecommunications Line Card Glue Logic, ASIC Prototyping Platform, Industrial Control and PLC Backplane Bridge, Embedded DSP Pre-Processing Filter, Legacy Avionics and Defense Bus Bridge, Video Processing Pipeline (SD/EDTV Era), Medical Imaging Front-End Interface.
Telecommunications Line Card Glue Logic
The EP20K30EFC324-2X's 30K typical gates and 128 user I/O pins make it a strong fit for legacy telecommunications line-card designs where bus arbitration, framing, and protocol conversion must be implemented alongside PHYs and framers. Its 24,576 RAM bits accommodate small FIFOs for inter-stage buffering without external memory, and the four PLLs simplify clock-tree synthesis for 19.44 MHz, 38.88 MHz, and 77.76 MHz backplane frequencies typical of TDM/SONET systems. Compared to a CPLD, the APEX-20KE's LUT architecture absorbs wider datapaths and more complex state machines. Designers should validate timing closure using the original Quartus MAX+PLUS II toolchain because the latest Quartus releases deprecate legacy APEX support.
Recommended
ASIC Prototyping Platform
Engineers use the EP20K30EFC324-2X as an ASIC prototyping vehicle because its LUT fabric and embedded block RAM faithfully model register-transfer logic and on-chip buffers prior to tape-out. The 0.22 micrometer process and 1.8V core supply mimic the operating characteristics of mid-1990s and early-2000s ASIC cells, giving accurate pre-silicon performance estimates. The 324-FBGA package exposes 128 user I/O pins that map cleanly onto ASIC pad rings for bring-up, and the embedded memory blocks model single-port and dual-port SRAM macros. Compared to a hard ASIC, the EP20K30EFC324-2X adds reprogrammability but introduces roughly 5-10x area overhead, which is acceptable for one-off prototypes.
Recommended
Industrial Control and PLC Backplane Bridge
The 128 user I/O count and LVDS support make the EP20K30EFC324-2X suitable for industrial PLC backplanes where it bridges between sensor buses, motor-control peripherals, and a host CPU. The four PLLs generate independent clock domains for encoder sampling, PWM generation, and Ethernet-style communication, all derived from a single reference oscillator. Embedded product-term logic handles fast register-intensive glue such as interrupt prioritization and watchdog timing, while LUT logic implements protocol state machines for Modbus or Profibus-style links. The 1.8V core keeps total power below 1.5W in typical industrial operating conditions, allowing fan-less enclosure designs.
Recommended
Embedded DSP Pre-Processing Filter
In DSP pre-processing front-ends, the EP20K30EFC324-2X implements FIR filters, decimators, and FFT stages ahead of a dedicated DSP or ASIC. The 24,576 embedded RAM bits store coefficient tables and circular sample buffers, eliminating the need for external SRAM for short-tap filters below 64 taps. The MultiCore architecture lets register-intensive datapath elements such as shift registers and accumulators map to product-term arrays for higher speed, while LUTs handle address-generation logic. Compared to a software DSP implementation, the EP20K30EFC324-2X provides deterministic latency at sample rates above 20 MHz, where processor overhead would starve the signal chain.
Recommended
Legacy Avionics and Defense Bus Bridge
Defense and avionics programs that adopted the APEX-20KE family in the early 2000s rely on the EP20K30EFC324-2X to bridge MIL-STD-1553, ARINC 429, and custom parallel backplanes. The device's radiation-tolerant silicon-on-insulator process option and long-term Altera/Intel support contracts make it suitable for sustainment-phase military programs. Embedded block RAM holds protocol message buffers, while LUT-based state machines implement bus timing with sub-microsecond resolution. Compared to a microcontroller, the parallel implementation offloads the host CPU and provides deterministic response times required by avionics certification standards.
Recommended
Video Processing Pipeline (SD/EDTV Era)
The EP20K30EFC324-2X handles SD and EDTV video processing tasks such as de-interlacing, color-space conversion, and overlay generation in broadcast equipment of its era. The 128 user I/O pins accept parallel ITU-R BT.656 / BT.601 video buses alongside control interfaces, while embedded memory acts as line buffers for 720x480 interlaced frames. Compared to a fixed-function video processor, the FPGA adapts to evolving standards via bitstream updates, avoiding mask changes. Designers should budget for the 1.8V core regulator's transient response because video line-rate processing produces periodic current spikes up to 2A on the VCCINT rail.
Recommended
Medical Imaging Front-End Interface
The EP20K30EFC324-2X is used in legacy medical imaging front-ends to interface ultrasound or endoscopy sensors with image-processing ASICs. Its low-noise LVDS I/O preserves analog signal integrity for low-amplitude sensor outputs, while LUT-based state machines synchronize frame capture with patient monitors. The 24,576 RAM bits provide per-line buffering for 8 to 16-bit grayscale data, removing the need for an external line buffer ASIC. Compared to discrete logic, the FPGA integrates scan-conversion, gain control, and timestamping into one device, reducing board area in cart-based ultrasound systems.
Recommended
Recommended Products Summary
Engineering reference data for EP20K30EFC324-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K30EFC324-1X | EP20K30EFC324-1 | EP20K60EFC324-2X | EP20K100EFC324-2X | EP20K30EFC324-3 |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE |
| Typical Gates | 30,000 | 30,000 | 30,000 | 60,000 | 100,000 | 30,000 |
| Logic Elements | 1,200 | 1,200 | 1,200 | 2,400 | 4,160 | 1,200 |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 40,960 | 53,248 | 24,576 |
| Speed Grade | -2X (enhanced) | -1X (slower) | -1 (slower) | -2X (enhanced) | -2X (enhanced) | -3 (slowest) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Maximum User I/O | 128 | 128 | 128 | 128 | 128 | 128 |
Key Differentiators
- Enhanced -2X speed grade in the 30K-gate APEX-20KE family (vs EP20K30EFC324-1X)
- Higher-density pin-compatible upgrade path exists in same 324-FBGA footprint (vs EP20K30EFC324-1X)
- Balanced MultiCore architecture combining LUT and product-term logic (vs EP20K30EFC324-3)
Design Notes
Estimated: at 100 percent toggle rate across 128 I/O at 100 MHz, VCCINT current is approximately 800 mA to 1.2 A on the 1.8 V rail, requiring a low-dropout regulator with at least 2 A headroom (e.g., TI TPS74401 or equivalent) and 4 to 6 bulk 22 uF ceramic decoupling capacitors placed within 25 mm of the BGA. VCCIO banks must be separately decoupled with 10 uF + 100 nF pairs to suppress switching transients. Designers should provide a soft-start ramp of 1 ms or longer to avoid in-rush currents tripping the upstream supply.
Estimated: at full I/O utilization and 100 MHz toggle rate, the 324-FBGA package dissipates approximately 1.5 W to 2 W with theta-JA of approximately 18 C/W in still air, yielding a 36 C junction rise above ambient. Engineers must provide a thermal pad on the PCB connected to an internal ground plane with at least 25 thermal vias (0.3 mm pitch) for heat spreading. For enclosed industrial enclosures with 70 C ambient, derate I/O toggle activity by 30 percent to stay within the 85 C commercial junction limit.
The 324-FBGA at 1.0 mm ball pitch demands 4-layer PCB stackup with continuous power and ground planes under the device; signal traces should escape between balls using 0.15 mm-wide micro-via-in-pad structures where cost allows. Matched-length routing for LVDS pairs must maintain within 0.5 mm length tolerance and 100 ohm differential impedance. Configuration and JTAG pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, TCK, TMS, TDI, TDO) must be brought out to a header for in-system programming via the Altera ByteBlaster or USB-Blaster cable.
Common pitfalls include using a configuration PROM (EPC2, EPC4, EPC8, EPC16) larger than 16 Mbit when the device only supports bitstreams up to approximately 2 Mbit for the EP20K30E, leading to configuration failure; mismatching VCCIO bank voltages to downstream logic levels (each bank must be set independently in the Quartus pin planner); and forgetting the POR delay of approximately 100 ms before user I/O become active after configuration. Designers should also verify the MAX+PLUS II baseline is correctly set for the -2X speed grade, otherwise timing analysis will be overly pessimistic.
Compliance Information
RoHS compliant per Altera/Intel product declaration for the APEX-20KE family. Not AEC-Q100 qualified - this is an industrial/commercial-grade FPGA. Halogen-free status not explicitly stated in retrieved data.
