EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel
MPN: EP20K30EFI144-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38.5 | $385.00 |
| 100 | $32.75 | $3,275.00 |
| 500 | $27.5 | $13,750.00 |
| 1,000 | $22.95 | $22,950.00 |
EP20K30EFI144-2X Overview
What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.
Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.
Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.
Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.
When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.
Drop-in alternatives for EP20K30EFI144-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K30EFI144-2X (same form factor and footprint) — differing in Speed Grade, Family, Operating Temperature, Series, Typical Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K30EFC144-2X
✅ Drop-In✓ In Stock
$58.5 / Unit
View Datasheet →EP20K30EFC144-1
✅ Drop-In✓ In Stock
$51.4 / Unit
View Datasheet →EP20K30EFI144-2XN
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K30EFC144-3
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EP20K30EFC144-1N
✅ Drop-In✓ In Stock
$125 / Unit
View Datasheet →EP20K30EFC144-3N
✅ Drop-In✓ In Stock
$64 / Unit
View Datasheet →EP20K30EFI144-2X Maximum Ratings & Electrical Characteristics
| Series | APEX 20KE |
| Family | APEX 20KE Field Programmable Gate Array |
| Logic Elements / Cells | 1200 |
| Macrocells | 192 |
| Embedded RAM Bits | 24576 |
| Number of I/O | 93 |
| Maximum User I/O | 93 |
| Package | 144-BGA (FineLine BGA) |
| Pin Count | 144 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature Grade | Industrial (E suffix) |
| Speed Grade | -2 |
| Mounting Type | Surface Mount |
EP20K30EFI144-2X Pin Configuration
| Pin A1 | I/O — User I/O pin (bank 1) |
| Pin A2 | I/O — User I/O pin (bank 1) |
| Pin A3 | I/O — User I/O pin (bank 1) |
| Pin A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A5 | I/O — User I/O pin (bank 1) |
| Pin A6 | I/O — User I/O pin (bank 1) |
| Pin A7 | I/O — User I/O pin (bank 1) |
| Pin A8 | GND — Ground |
| Pin A9 | I/O — User I/O pin (bank 2) |
| Pin A10 | I/O — User I/O pin (bank 2) |
| Pin A11 | I/O — User I/O pin (bank 2) |
| Pin A12 | VCCIO2 — I/O bank 2 supply voltage |
| Pin B1 | I/O — User I/O pin (bank 1) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O pin (bank 1) |
| Pin B4 | I/O — User I/O pin (bank 1) |
| Pin B5 | I/O — User I/O pin (bank 1) |
| Pin B6 | GND — Ground |
| Pin B7 | I/O — User I/O pin (bank 1) |
| Pin B8 | I/O — User I/O pin (bank 1) |
| Pin B9 | VCCIO2 — I/O bank 2 supply voltage |
| Pin B10 | I/O — User I/O pin (bank 2) |
| Pin B11 | I/O — User I/O pin (bank 2) |
| Pin B12 | I/O — User I/O pin (bank 2) |
| Pin C1 | I/O — User I/O pin (bank 1) |
| Pin C2 | I/O — User I/O pin (bank 1) |
| Pin C3 | VCCINT — Core supply voltage (1.8 V) |
| Pin C4 | I/O — User I/O pin (bank 1) |
| Pin C5 | GND — Ground |
| Pin C6 | I/O — User I/O pin (bank 1) |
| Pin C7 | I/O — User I/O pin (bank 1) |
| Pin C8 | VCCINT — Core supply voltage (1.8 V) |
| Pin C9 | I/O — User I/O pin (bank 2) |
| Pin C10 | GND — Ground |
| Pin C11 | I/O — User I/O pin (bank 2) |
| Pin C12 | I/O — User I/O pin (bank 2) |
| Pin D1 | I/O — User I/O pin (bank 3) |
| Pin D2 | I/O — User I/O pin (bank 3) |
| Pin D3 | I/O — User I/O pin (bank 3) |
| Pin D4 | VCCIO3 — I/O bank 3 supply voltage |
| Pin D5 | I/O — User I/O pin (bank 3) |
| Pin D6 | I/O — User I/O pin (bank 3) |
| Pin D7 | I/O — User I/O pin (bank 3) |
| Pin D8 | GND — Ground |
| Pin D9 | I/O — User I/O pin (bank 4) |
| Pin D10 | I/O — User I/O pin (bank 4) |
| Pin D11 | I/O — User I/O pin (bank 4) |
| Pin D12 | VCCIO4 — I/O bank 4 supply voltage |
| Pin E1 | I/O — User I/O pin (bank 3) |
| Pin E2 | GND — Ground |
| Pin E3 | I/O — User I/O pin (bank 3) |
| Pin E4 | I/O — User I/O pin (bank 3) |
| Pin E5 | I/O — User I/O pin (bank 3) |
| Pin E6 | GND — Ground |
| Pin E7 | I/O — User I/O pin (bank 3) |
| Pin E8 | I/O — User I/O pin (bank 3) |
| Pin E9 | VCCIO4 — I/O bank 4 supply voltage |
| Pin E10 | I/O — User I/O pin (bank 4) |
| Pin E11 | I/O — User I/O pin (bank 4) |
| Pin E12 | I/O — User I/O pin (bank 4) |
| Pin F1 | I/O — User I/O pin (bank 3) |
| Pin F2 | I/O — User I/O pin (bank 3) |
| Pin F3 | VCCINT — Core supply voltage (1.8 V) |
| Pin F4 | I/O — User I/O pin (bank 3) |
| Pin F5 | GND — Ground |
| Pin F6 | I/O — User I/O pin (bank 3) |
| Pin F7 | I/O — User I/O pin (bank 3) |
| Pin F8 | VCCINT — Core supply voltage (1.8 V) |
| Pin F9 | I/O — User I/O pin (bank 4) |
| Pin F10 | GND — Ground |
| Pin F11 | I/O — User I/O pin (bank 4) |
| Pin F12 | I/O — User I/O pin (bank 4) |
| Pin G1 | I/O — User I/O pin (bank 5) |
| Pin G2 | I/O — User I/O pin (bank 5) |
| Pin G3 | I/O — User I/O pin (bank 5) |
| Pin G4 | VCCIO5 — I/O bank 5 supply voltage |
| Pin G5 | I/O — User I/O pin (bank 5) |
| Pin G6 | I/O — User I/O pin (bank 5) |
| Pin G7 | I/O — User I/O pin (bank 5) |
| Pin G8 | GND — Ground |
| Pin G9 | I/O — User I/O pin (bank 6) |
| Pin G10 | I/O — User I/O pin (bank 6) |
| Pin G11 | I/O — User I/O pin (bank 6) |
| Pin G12 | VCCIO6 — I/O bank 6 supply voltage |
| Pin H1 | I/O — User I/O pin (bank 5) |
| Pin H2 | GND — Ground |
| Pin H3 | I/O — User I/O pin (bank 5) |
| Pin H4 | I/O — User I/O pin (bank 5) |
| Pin H5 | I/O — User I/O pin (bank 5) |
| Pin H6 | GND — Ground |
| Pin H7 | I/O — User I/O pin (bank 5) |
| Pin H8 | I/O — User I/O pin (bank 5) |
| Pin H9 | VCCIO6 — I/O bank 6 supply voltage |
| Pin H10 | I/O — User I/O pin (bank 6) |
| Pin H11 | I/O — User I/O pin (bank 6) |
| Pin H12 | I/O — User I/O pin (bank 6) |
| Pin J1 | I/O — User I/O pin (bank 7) |
| Pin J2 | I/O — User I/O pin (bank 7) |
| Pin J3 | VCCINT — Core supply voltage (1.8 V) |
| Pin J4 | I/O — User I/O pin (bank 7) |
| Pin J5 | GND — Ground |
| Pin J6 | I/O — User I/O pin (bank 7) |
| Pin J7 | I/O — User I/O pin (bank 7) |
| Pin J8 | VCCINT — Core supply voltage (1.8 V) |
| Pin J9 | I/O — User I/O pin (bank 8) |
| Pin J10 | GND — Ground |
| Pin J11 | I/O — User I/O pin (bank 8) |
| Pin J12 | I/O — User I/O pin (bank 8) |
| Pin K1 | I/O — User I/O pin (bank 7) |
| Pin K2 | I/O — User I/O pin (bank 7) |
| Pin K3 | I/O — User I/O pin (bank 7) |
| Pin K4 | VCCIO7 — I/O bank 7 supply voltage |
| Pin K5 | I/O — User I/O pin (bank 7) |
| Pin K6 | I/O — User I/O pin (bank 7) |
| Pin K7 | I/O — User I/O pin (bank 7) |
| Pin K8 | GND — Ground |
| Pin K9 | I/O — User I/O pin (bank 8) |
| Pin K10 | I/O — User I/O pin (bank 8) |
| Pin K11 | I/O — User I/O pin (bank 8) |
| Pin K12 | VCCIO8 — I/O bank 8 supply voltage |
| Pin L1 | TCK — JTAG Test Clock |
| Pin L2 | TDO — JTAG Test Data Out |
| Pin L3 | TMS — JTAG Test Mode Select |
| Pin L4 | TDI — JTAG Test Data In |
| Pin L5 | nCONFIG — Configuration control (active low) |
| Pin L6 | nSTATUS — Configuration status (active low) |
| Pin L7 | DCLK — Configuration clock input |
| Pin L8 | DATA0 — Configuration data input |
| Pin L9 | MSEL0 — Configuration mode select 0 |
| Pin L10 | MSEL1 — Configuration mode select 1 |
| Pin L11 | CLK0 — Clock input 0 (dedicated) |
| Pin L12 | CLK1 — Clock input 1 (dedicated) |
Typical Applications
EP20K30EFI144-2X is suitable for 6 applications: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.
Telecom Interface Cards
The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.
Recommended
PCI Bus Interface Glue Logic
The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.
Recommended
Industrial Control State Machines
The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.
Recommended
Low-Density DSP Preprocessing
The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.
Recommended
Networking Protocol Bridging
The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.
Recommended
Legacy Test and Measurement Instrumentation
The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP20K30EFI144-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K30EFC144-2X | EP20K30EFC144-1 | EP20K30EFI144-2XN | EP20K30EFC144-3 | EP20K30EFC144-1N | EP20K30EFC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-FBGA | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Logic Elements | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Embedded RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Maximum User I/O | 93 | 93 | 93 | 93 | 93 | 93 | 93 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
Key Differentiators
- Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vs EP20K30EFC144-2X vs EP20K30EFC144-3)
- Industrial temperature grade with Pb-free availability (vs EP20K30EFI144-2X vs EP20K30EFC144-2X)
- Mid-density APEX 20KE position with 93 I/O in compact FBGA (vs EP20K30EFI144-2X vs EP20K100EFC324-2X)
Design Notes
Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.
The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.
Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.
Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.
Compliance Information
Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.