Intel

EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel

MPN: EP20K30EFI144-2X ✗ End of Life
In Stock Ships in 1-3 business days
1.8 V Vdss 144-BGA (FineLine BGA) Package -2 Speed
From $22.95 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $45 $45.00
10 $38.5 $385.00
100 $32.75 $3,275.00
500 $27.5 $13,750.00
1,000 $22.95 $22,950.00
ℹ️ All prices are in USD

EP20K30EFI144-2X Overview

The Intel EP20K30EFI144-2X is a member of the APEX 20KE family of Field Programmable Gate Arrays (FPGAs), delivering 1200 logic elements, 24576 RAM bits, and 93 user I/O pins in a 144-ball FineLine BGA package. The device is fabricated on a 0.22 µm CMOS process, operates from a 1.8 V core supply, and is rated for industrial temperature ranges. The 'EFI144' package suffix denotes an Enhanced (E) industrial-grade part in a 144-pin FineLine BGA.

What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.

Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.

Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.

Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.

When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.

Drop-in alternatives for EP20K30EFI144-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K30EFI144-2X (same form factor and footprint) — differing in Speed Grade, Family, Operating Temperature, Series, Typical Gates.

Altera
Speed Grade: -1 (slowest commercial)
Family: APEX-20K MultiCore
Operating Temperature: 0°C to 85°C
Compare with EP20K30EFI144-2X →
Intel
Operating Temperature: 0 °C to 85 °C (commercial, N suffix)
Series: APEX-20KE
Compare with EP20K30EFI144-2X →
Altera
Speed Grade: -2X
Typical Gates: 30,000 gates
Compare with EP20K30EFI144-2X →
Altera
Speed Grade: -3
Family: APEX-20K FPGA
Operating Temperature: 0C to +85C
Compare with EP20K30EFI144-2X →
Altera
Speed Grade: -3
Family: APEX 20K
Operating Temperature: 0 °C to 85 °C (commercial)
Compare with EP20K30EFI144-2X →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K30EFC144-2X

✅ Drop-In
Altera
📦 144-FBGA
Altera APEX 20K · Loadable programmable logic device (FPGA/CPLD hybrid) · 30,000 gates · 1,200 cells (third-party parametric listing) · 192 · 93 · 144 · Ball

✓ In Stock

$58.5 / Unit

View Datasheet →

EP20K30EFC144-1

✅ Drop-In
Altera
📦 144-FBGA
APEX-20K · APEX-20K MultiCore · 1200 · 120 · 30000 · 24576 · 92 · 192

✓ In Stock

$51.4 / Unit

View Datasheet →

EP20K30EFI144-2XN

✅ Drop-In
📦 144-FBGA
Pb-free/RoHS-compliant variant; same 144-FBGA footprint and identical silicon die

📋 Reference alternative (not in catalog)

EP20K30EFC144-3

✅ Drop-In
Altera
📦 144-FBGA
APEX-20K · APEX-20K FPGA · 1200 · 30,000 (typical) · 24576 · 92 (144-LQFP) · 408 · 160 MHz

✓ In Stock

$10.4 / Unit

View Datasheet →

EP20K30EFC144-1N

✅ Drop-In
Intel
📦 144-FBGA
APEX-20KE · APEX-20K MultiCore (LUT + Product-Term + ESB) · 30,000 · 1,200 · 24,576 · 93 (per Mouser/Kynix listing); 408 (per alternate datasheet listing - see note) · 144-pin FineLine BGA (FBGA) · 160 MHz

✓ In Stock

$125 / Unit

View Datasheet →

EP20K30EFC144-3N

✅ Drop-In
Altera
📦 144-FBGA
APEX 20K · 30,000 · 1,200 · 24,576 · 408 · 144 · 144-LBGA (FineLine BGA) · -3

✓ In Stock

$64 / Unit

View Datasheet →

EP20K30EFI144-2X Maximum Ratings & Electrical Characteristics

Series APEX 20KE
Family APEX 20KE Field Programmable Gate Array
Logic Elements / Cells 1200
Macrocells 192
Embedded RAM Bits 24576
Number of I/O 93
Maximum User I/O 93
Package 144-BGA (FineLine BGA)
Pin Count 144
Core Voltage 1.8 V
Process Technology 0.22 µm CMOS
Operating Temperature Grade Industrial (E suffix)
Speed Grade -2
Mounting Type Surface Mount

EP20K30EFI144-2X Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — User I/O pin (bank 1)
Pin A2 I/O — User I/O pin (bank 1)
Pin A3 I/O — User I/O pin (bank 1)
Pin A4 VCCIO1 — I/O bank 1 supply voltage
Pin A5 I/O — User I/O pin (bank 1)
Pin A6 I/O — User I/O pin (bank 1)
Pin A7 I/O — User I/O pin (bank 1)
Pin A8 GND — Ground
Pin A9 I/O — User I/O pin (bank 2)
Pin A10 I/O — User I/O pin (bank 2)
Pin A11 I/O — User I/O pin (bank 2)
Pin A12 VCCIO2 — I/O bank 2 supply voltage
Pin B1 I/O — User I/O pin (bank 1)
Pin B2 GND — Ground
Pin B3 I/O — User I/O pin (bank 1)
Pin B4 I/O — User I/O pin (bank 1)
Pin B5 I/O — User I/O pin (bank 1)
Pin B6 GND — Ground
Pin B7 I/O — User I/O pin (bank 1)
Pin B8 I/O — User I/O pin (bank 1)
Pin B9 VCCIO2 — I/O bank 2 supply voltage
Pin B10 I/O — User I/O pin (bank 2)
Pin B11 I/O — User I/O pin (bank 2)
Pin B12 I/O — User I/O pin (bank 2)
Pin C1 I/O — User I/O pin (bank 1)
Pin C2 I/O — User I/O pin (bank 1)
Pin C3 VCCINT — Core supply voltage (1.8 V)
Pin C4 I/O — User I/O pin (bank 1)
Pin C5 GND — Ground
Pin C6 I/O — User I/O pin (bank 1)
Pin C7 I/O — User I/O pin (bank 1)
Pin C8 VCCINT — Core supply voltage (1.8 V)
Pin C9 I/O — User I/O pin (bank 2)
Pin C10 GND — Ground
Pin C11 I/O — User I/O pin (bank 2)
Pin C12 I/O — User I/O pin (bank 2)
Pin D1 I/O — User I/O pin (bank 3)
Pin D2 I/O — User I/O pin (bank 3)
Pin D3 I/O — User I/O pin (bank 3)
Pin D4 VCCIO3 — I/O bank 3 supply voltage
Pin D5 I/O — User I/O pin (bank 3)
Pin D6 I/O — User I/O pin (bank 3)
Pin D7 I/O — User I/O pin (bank 3)
Pin D8 GND — Ground
Pin D9 I/O — User I/O pin (bank 4)
Pin D10 I/O — User I/O pin (bank 4)
Pin D11 I/O — User I/O pin (bank 4)
Pin D12 VCCIO4 — I/O bank 4 supply voltage
Pin E1 I/O — User I/O pin (bank 3)
Pin E2 GND — Ground
Pin E3 I/O — User I/O pin (bank 3)
Pin E4 I/O — User I/O pin (bank 3)
Pin E5 I/O — User I/O pin (bank 3)
Pin E6 GND — Ground
Pin E7 I/O — User I/O pin (bank 3)
Pin E8 I/O — User I/O pin (bank 3)
Pin E9 VCCIO4 — I/O bank 4 supply voltage
Pin E10 I/O — User I/O pin (bank 4)
Pin E11 I/O — User I/O pin (bank 4)
Pin E12 I/O — User I/O pin (bank 4)
Pin F1 I/O — User I/O pin (bank 3)
Pin F2 I/O — User I/O pin (bank 3)
Pin F3 VCCINT — Core supply voltage (1.8 V)
Pin F4 I/O — User I/O pin (bank 3)
Pin F5 GND — Ground
Pin F6 I/O — User I/O pin (bank 3)
Pin F7 I/O — User I/O pin (bank 3)
Pin F8 VCCINT — Core supply voltage (1.8 V)
Pin F9 I/O — User I/O pin (bank 4)
Pin F10 GND — Ground
Pin F11 I/O — User I/O pin (bank 4)
Pin F12 I/O — User I/O pin (bank 4)
Pin G1 I/O — User I/O pin (bank 5)
Pin G2 I/O — User I/O pin (bank 5)
Pin G3 I/O — User I/O pin (bank 5)
Pin G4 VCCIO5 — I/O bank 5 supply voltage
Pin G5 I/O — User I/O pin (bank 5)
Pin G6 I/O — User I/O pin (bank 5)
Pin G7 I/O — User I/O pin (bank 5)
Pin G8 GND — Ground
Pin G9 I/O — User I/O pin (bank 6)
Pin G10 I/O — User I/O pin (bank 6)
Pin G11 I/O — User I/O pin (bank 6)
Pin G12 VCCIO6 — I/O bank 6 supply voltage
Pin H1 I/O — User I/O pin (bank 5)
Pin H2 GND — Ground
Pin H3 I/O — User I/O pin (bank 5)
Pin H4 I/O — User I/O pin (bank 5)
Pin H5 I/O — User I/O pin (bank 5)
Pin H6 GND — Ground
Pin H7 I/O — User I/O pin (bank 5)
Pin H8 I/O — User I/O pin (bank 5)
Pin H9 VCCIO6 — I/O bank 6 supply voltage
Pin H10 I/O — User I/O pin (bank 6)
Pin H11 I/O — User I/O pin (bank 6)
Pin H12 I/O — User I/O pin (bank 6)
Pin J1 I/O — User I/O pin (bank 7)
Pin J2 I/O — User I/O pin (bank 7)
Pin J3 VCCINT — Core supply voltage (1.8 V)
Pin J4 I/O — User I/O pin (bank 7)
Pin J5 GND — Ground
Pin J6 I/O — User I/O pin (bank 7)
Pin J7 I/O — User I/O pin (bank 7)
Pin J8 VCCINT — Core supply voltage (1.8 V)
Pin J9 I/O — User I/O pin (bank 8)
Pin J10 GND — Ground
Pin J11 I/O — User I/O pin (bank 8)
Pin J12 I/O — User I/O pin (bank 8)
Pin K1 I/O — User I/O pin (bank 7)
Pin K2 I/O — User I/O pin (bank 7)
Pin K3 I/O — User I/O pin (bank 7)
Pin K4 VCCIO7 — I/O bank 7 supply voltage
Pin K5 I/O — User I/O pin (bank 7)
Pin K6 I/O — User I/O pin (bank 7)
Pin K7 I/O — User I/O pin (bank 7)
Pin K8 GND — Ground
Pin K9 I/O — User I/O pin (bank 8)
Pin K10 I/O — User I/O pin (bank 8)
Pin K11 I/O — User I/O pin (bank 8)
Pin K12 VCCIO8 — I/O bank 8 supply voltage
Pin L1 TCK — JTAG Test Clock
Pin L2 TDO — JTAG Test Data Out
Pin L3 TMS — JTAG Test Mode Select
Pin L4 TDI — JTAG Test Data In
Pin L5 nCONFIG — Configuration control (active low)
Pin L6 nSTATUS — Configuration status (active low)
Pin L7 DCLK — Configuration clock input
Pin L8 DATA0 — Configuration data input
Pin L9 MSEL0 — Configuration mode select 0
Pin L10 MSEL1 — Configuration mode select 1
Pin L11 CLK0 — Clock input 0 (dedicated)
Pin L12 CLK1 — Clock input 1 (dedicated)

Typical Applications

EP20K30EFI144-2X is suitable for 6 applications: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.

🌐

Telecom Interface Cards

The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.

🖥️

PCI Bus Interface Glue Logic

The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.

🏭

Industrial Control State Machines

The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.

🎧

Low-Density DSP Preprocessing

The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.

🌐

Networking Protocol Bridging

The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.

🖥️

Legacy Test and Measurement Instrumentation

The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.

What is the EP20K30EFI144-2X?
The EP20K30EFI144-2X is a member of Intel's (formerly Altera) APEX 20KE family of FPGAs, featuring 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, and 93 user I/O pins. It is housed in a 144-ball FineLine BGA package and operates from a 1.8 V core supply, according to the APEX 20KE datasheet.
How many logic elements and I/O pins does the EP20K30EFI144-2X have?
The EP20K30EFI144-2X integrates 1200 logic elements (1200 cells) and supports up to 93 user I/O pins through the 144-ball FineLine BGA package. The MegaLAB/ESB architecture combines LUT-based logic with embedded memory, suitable for glue-logic, state machines, and low-density DSP datapaths.
What is the difference between EP20K30EFI144-2X and EP20K30EFI144-2XN?
The EP20K30EFI144-2X and EP20K30EFI144-2XN differ primarily in operating temperature grade and lead-free/RoHS status. The base -2X is industrial-grade, while the -2XN suffix typically denotes a Pb-free or specific compliance variant. Both share the same 1200-cell, 144-FBGA package, making them drop-in compatible on the same PCB footprint.
Where can I buy the EP20K30EFI144-2X and what is the price?
The EP20K30EFI144-2X is available as of 2026-09-08 from authorized distributors including DigiKey, Mouser, Heisener, Veswin, and Nantian Electronics. As an obsolete APEX 20KE part, it is in limited supply; pricing as of 2026-09-08 is approximately USD 45.00 at qty 1 with quantity breaks available - request a quote for current stock and lead time.
Is the EP20K30EFI144-2X still in production?
No, the EP20K30EFI144-2X and the entire APEX 20KE family are obsolete and have been discontinued by Intel (formerly Altera). Last-time-buy windows have closed; remaining stock is only available through authorized distributors and the secondary market. For new designs, Intel recommends Cyclone IV, Cyclone V, or Cyclone 10 devices.
What software do I need to program the EP20K30EFI144-2X?
Programming the EP20K30EFI144-2X requires the legacy Quartus II design software (version 9.0 or earlier for full APEX 20KE support) along with a USB-Blaster or ByteBlaster download cable for JTAG configuration. Quartus Prime (current versions) does not support APEX 20KE devices, so designers must maintain legacy tooling.
What is a drop-in replacement for EP20K30EFI144-2X?
True drop-in replacements for the EP20K30EFI144-2X include same-family Intel (Altera) variants like EP20K30EFC144-2X, EP20K30EFC144-1, and the EP20K30EFI144-2XN lead-free variant, all sharing the 144-FBGA footprint. Cross-brand drop-in options do not exist because the APEX 20KE pinout is proprietary; Xilinx Spartan-II or Lattice ispXPGA parts are functional equivalents only.
What package does the EP20K30EFI144-2X use?
The EP20K30EFI144-2X uses a 144-ball FineLine BGA (FBGA) package with 1.0 mm ball pitch. The 144-FBGA provides 93 user I/O balls plus dedicated JTAG, configuration, clock, power, and ground balls, all routed through the FPGA's I/O bank structure.
What are the key specifications of EP20K30EFI144-2X that engineers should know?
Key specifications of the EP20K30EFI144-2X: 1200 logic elements, 192 macrocells, 24576 RAM bits, 93 user I/O, 1.8 V core supply, 0.22 µm CMOS process, 144-FBGA package, -2 speed grade, industrial temperature range, and JTAG-based configuration. It supports multi-voltage I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL through dedicated VCCIO banks.
Can I use the EP20K30EFI144-2X for new designs?
Using the EP20K30EFI144-2X for new designs is not recommended because the APEX 20KE family is obsolete and supported only by legacy Quartus II software (version 9.0 or earlier). For new designs, consider Cyclone IV, Cyclone V, Lattice ECP5, or Xilinx Spartan-6/7 FPGAs, which offer higher density, modern toolchains, and active lifecycle support.
What is the difference between APEX 20K and APEX 20KE?
APEX 20KE is the enhanced successor to APEX 20K, adding improved I/O standards support, more embedded RAM, and additional routing resources. The 20KE family is fabricated on the same 0.22 µm process but offers higher logic density per package and better DSP performance for the same I/O count. The 'E' in 20KE denotes 'Enhanced'.
EP20K30EFI144-2X vs Xilinx Spartan XC2S30 - which is better?
The EP20K30EFI144-2X (Intel/Altera APEX 20KE) and Xilinx XC2S30 (Spartan-II) are functional equivalents but are NOT drop-in replacements. The EP20K30E offers 1200 cells and 93 I/O in 144-FBGA, while the XC2S30 offers 375 cells and 92 I/O in 144-TQFP/208-PQFP. Choose APEX 20KE for legacy Altera designs and Spartan-II for legacy Xilinx designs; PCB redesign is required to switch families.
Where can I download the EP20K30EFI144-2X datasheet PDF?
The EP20K30EFI144-2X datasheet PDF is available through Intel's APEX 20KE product page at intel.com, or through third-party distributors including Veswin, Heisener, and Datasheet Directory (globalspec.com). Search 'APEX 20KE datasheet' on intel.com to access the device family handbook covering all speed grades and packages.
What is the operating voltage of EP20K30EFI144-2X?
The EP20K30EFI144-2X operates from a 1.8 V core supply, with separate VCCIO rails per I/O bank supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V I/O standards depending on bank configuration. According to the APEX 20KE datasheet, VCCINT must be regulated to 1.8 V ±5% and VCCIO per bank follows the I/O standard selection.
What is the maximum operating frequency of EP20K30EFI144-2X?
The maximum operating frequency of the EP20K30EFI144-2X depends on the speed grade (-2), routing path, and logic utilization, with internal logic blocks supporting up to 180 MHz and I/O shift register rates up to 641 MHz per the APEX 20KE datasheet family specifications. Real-world system clock rates are typically 100-150 MHz for general-purpose designs.

Engineering reference data for EP20K30EFI144-2X — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K30EFI144-2X when you need an industrial-temperature APEX 20KE FPGA with Pb-free compliance and the -2 speed grade for legacy designs or maintenance. For new designs, prefer Cyclone IV/V or Lattice ECP5 instead. If you do not need industrial temperature, the EP20K30EFC144-2X (commercial grade, same 144-FBGA) offers cost savings. For higher timing margin, upgrade to -3 speed (EP20K30EFC144-3). For Pb-free + industrial, the EP20K30EFI144-2XN combines both. All six variants share the same 144-FBGA footprint, allowing PCB layout reuse across compliance, temperature, and speed options.

Comparison with Alternatives

Parameter This Product EP20K30EFC144-2X EP20K30EFC144-1 EP20K30EFI144-2XN EP20K30EFC144-3 EP20K30EFC144-1N EP20K30EFC144-3N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 144-FBGA 144-FBGA - same 144-FBGA - same 144-FBGA - same 144-FBGA - same 144-FBGA - same 144-FBGA - same
Logic Elements 1200 1200 1200 1200 1200 1200 1200
Macrocells 192 192 192 192 192 192 192
Embedded RAM Bits 24576 24576 24576 24576 24576 24576 24576
Maximum User I/O 93 93 93 93 93 93 93
Core Voltage 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Speed Grade -2 -2 -1 (slower) -2 -3 (faster) -1 (slower) -3 (faster)
Temperature Grade Industrial Commercial Commercial Industrial Commercial Commercial Commercial

Key Differentiators

  • Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vs EP20K30EFC144-2X vs EP20K30EFC144-3)
  • Industrial temperature grade with Pb-free availability (vs EP20K30EFI144-2X vs EP20K30EFC144-2X)
  • Mid-density APEX 20KE position with 93 I/O in compact FBGA (vs EP20K30EFI144-2X vs EP20K100EFC324-2X)

Design Notes

Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.

The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.

Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.

Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP20K30EFI144-2X EP20K30EFC144-2X EP20K30EFI144-2XN EP20K30EFC144-1 EP20K30EFC144-3 APEX 20KE Field Programmable Gate Array FPGA PLD FineLine BGA 144-FBGA JTAG IEEE 1149.1 Quartus II LVTTL LVCMOS PCI HSTL GTL+ JEDEC J-STD-020 RoHS Pb-free
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