EP20K60EFC324-3N - 60K Gate 196 I/O APEX 20KE FPGA | Altera
MPN: EP20K60EFC324-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $52.7 | $52.70 |
| 10 | $48.4 | $484.00 |
| 100 | $43.3 | $4,330.00 |
| 500 | $38.9 | $19,450.00 |
| 1,000 | $35.4 | $35,400.00 |
EP20K60EFC324-3N Overview
An FPGA is an integrated circuit whose logic fabric can be reprogrammed after manufacturing using hardware description languages such as VHDL or Verilog. Unlike fixed-function ASICs, an FPGA contains configurable logic blocks, embedded memory, and routing resources that allow a designer to create custom datapaths and state machines in firmware. The APEX 20KE family from Altera combines a programmable logic array with embedded system blocks for memory and product-term logic, making it useful for glue logic, bus bridging, protocol processing, and custom coprocessing tasks. The EP20K60EFC324-3N sits in the hierarchy FPGA > programmable logic device > integrated circuit.
Key features of the EP20K60EFC324-3N include 2,560 logic elements, 196 user I/O pins, and 60K typical gates. The 324-FBGA package measures 19 mm x 19 mm and the device is supplied in bulk packaging. The -3 speed grade provides an internal operating frequency of 182 MHz, while the MultiCore architecture allows simultaneous implementation of register-based logic, memory, and product-term logic. The 1.8 V core minimizes dynamic power for mid-density communications, industrial, and instrumentation applications.
The EP20K60EFC324-3N uses Altera's MultiCore architecture, combining look-up-table based logic elements with embedded system blocks for dual-port RAM, FIFO, and product-term functions. This heterogeneous fabric allows designers to reduce board-level part count by integrating small memory functions and combinatorial logic in one FPGA. The device is configured from an EPC configuration device or a processor after power-up. As part of the APEX 20KE family, it supports a 3.3 V or lower I/O environment and provides manageable timing closure through the Quartus II development environment. The 0.22 um process balances density and performance at a 1.8 V core voltage.
Typical applications for the EP20K60EFC324-3N include telecom interface bridging, network line-card control logic, industrial sensor aggregation, and test instrumentation digital front ends. Its 196 I/Os are sufficient to connect a 32-bit microprocessor bus, SRAM, and multiple UART/SPI interfaces. The 2,560-element logic array can implement UARTs, FIFOs, parity and CRC checkers, or a soft-core state machine without an external CPLD.
When designing the EP20K60EFC324-3N into a board, verify power-supply sequencing and decoupling. The core must be held within 1.71 V to 1.89 V, and each VCC pin should be bypassed with low-ESR ceramic capacitors close to the ball pads. Because the FPGA is volatile, provide a configuration source and reset strategy for reliable start-up.
This page aggregates verified distributor specifications, speed-grade ordering options, and practical design notes that are not always visible in the Altera APEX 20K datasheet, including availability through Rochester Electronics and drop-in speed-grade variants in the same 324-FBGA footprint. Use this information to compare sourcing choices before committing a new PCB.
Drop-in alternatives for EP20K60EFC324-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K60EFC324-3N (same form factor and footprint) — differing in Operating Temperature, Package / Case, Total Gates, Series, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K60EFC324-3
✅ Drop-In✓ In Stock
$58.4 / Unit
View Datasheet →EP20K60EFC324-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52.73 / Unit
View Datasheet →EP20K60EFC324-2
✅ Drop-In✓ In Stock
$41.75 / Unit
View Datasheet →EP20K60EFC324-2X
✅ Drop-In✓ In Stock
$195.5 / Unit
View Datasheet →EP20K60EFC324-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP20K60EFC324-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$76.5 / Unit
View Datasheet →EP20K60EFC324-3N Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Number of Logic Elements | 2560 Cells |
| Total Gates | 60K Gates (60000 typical) |
| Number of User I/Os | 196 |
| Package / Case | 324-BGA / 324-FBGA (19x19) |
| Supplier Device Package | 324-FBGA (19x19) |
| Core Supply Voltage | 1.71V ~ 1.89V (1.8V nominal) |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Maximum Internal Frequency | 182 MHz (-3 speed grade) |
| Process Technology | 0.22 um CMOS |
| Number of Pins | 324 |
| Mounting Type | Surface Mount |
| Packaging | Bulk (per distributor listing) |
| Ordering Suffix | -N suffix ordering variant |
EP20K60EFC324-3N 324-fbga (19x19) Pin Configuration Guide
Pin configuration for EP20K60EFC324-3N (324-fbga (19x19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K60EFC324-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K60EFC324-3N is suitable for 6 applications: Telecom Line Card Bridge / Control Logic, Industrial Sensor Aggregation and Control, Test and Measurement Digital Front End, Medical Imaging Data Pre-Processing, Avionics Display / Mission Computer Glue Logic, Video and Imaging Interface Conversion.
Telecom Line Card Bridge / Control Logic
The EP20K60EFC324-3N fits telecom line cards that need flexible glue logic, bus bridging, and status and alarm handling. Its 196 user I/Os can connect a line-card processor, SRAM, and several UART/HDLC controllers, while 2,560 logic elements implement address decode, FIFO control, and checksum or CRC functions. The 1.8 V core reduces heating in a densely populated chassis. Because the device is an FPGA, line-card register maps and protocol state machines can be updated without changing the PCB. For legacy designs requiring a 324-FBGA component with a moderate gate count, this device bridges between an old 3.3 V backplane and a newer 1.8 V core logic domain. The 182 MHz internal clock is adequate for sub-rate TDM and control-plane tasks, though it is not intended for high-speed SERDES interfaces. Use an EPC configuration device to load the bitstream at power-up, and keep the JTAG chain accessible for in-system updates.
Recommended
Industrial Sensor Aggregation and Control
Industrial automation panels frequently require a flexible bridge between multiple sensor interfaces and a host processor. The EP20K60EFC324-3N can implement parallel bus decoders, UART or SPI multiplexing, motor-enable logic, and interlock state machines in one device. Its 196 I/Os are enough to interface to optocoupler arrays, relay drivers, quadrature encoders, and an external microcontroller or DSP. The 1.71 V to 1.89 V core supply is convenient in a regulated 1.8 V digital rail while I/O banks can connect legacy 3.3 V sensors. Since the device is volatile, a configuration PROM and a brown-out monitor are recommended for industrial safety. The commercial 0°C to 85°C range fits most indoor control cabinets, although an extended-temperature variant may be needed for outdoor or high-heat unventilated enclosures. This FPGA is an economical means of consolidating small logic functions that would otherwise require multiple CPLDs and discrete gates.
Recommended
Test and Measurement Digital Front End
Test instruments such as data-acquisition systems, waveform digitizers, and logic analyzers need flexible pre-processing logic between ADCs and an acquisition processor. The EP20K60EFC324-3N can implement acquisition state machines, sample FIFOs, trigger logic, and data formatting functions. Its 2,560 logic elements are sufficient for control-intensive tasks, while the 196 user I/Os connect multiple parallel ADCs/DACs and memory devices. A 182 MHz internal clock allows moderate-rate decimation and framing without external FIFOs. The 324-FBGA package provides a compact footprint for instrument PCBs, and the -N lead-free ordering suffix supports RoHS-oriented production requirements. In a bench instrument that receives intermittent triggers, the FPGA can perform channel sequencing and DMA handshaking more flexibly than a fixed CPLD. Existing designs may use this device as a drop-in speed-grade or ordering variant if the original APEX 20K part becomes harder to source.
Recommended
Medical Imaging Data Pre-Processing
Medical imaging systems often process data from CCD, CMOS, or ultrasonic transducer arrays before sending it to a digital signal processor. The EP20K60EFC324-3N can perform address generation, data packing, line buffering, and simple spatial filtering in programmable logic. Its embedded system block architecture supports small FIFOs and dual-port RAM without external SRAM, which is valuable in ultrasound or X-ray acquisition front ends where latency must be low. The 1.8 V core and 196 I/Os allow direct connection to sensors, analog-front-end ADCs, and a host microcontroller. Because medical equipment has long product lifecycles, using a documented legacy FPGA can support field replacements; however, designers should qualify any alternate speed-grade variant for timing and ensure the configuration device is available for the product's service life. The 0°C to 85°C temperature range suits controlled imaging rooms and laboratory environments.
Recommended
Avionics Display / Mission Computer Glue Logic
Avionics retrofit programs sometimes need mid-density FPGA logic to adapt legacy processors to newer display and data-interface boards. The EP20K60EFC324-3N can implement address decode, interrupt routing, synchronization pulse generation, and data conversion between parallel buses and simple serial interfaces. Its 196 user I/Os allow it to sit between a PowerPC or x86 processor, dual-port RAM, and a graphics controller without needing an additional CPLD. The 324-FBGA package is suitable for the multilayer PCBs used in line-replaceable units. Since this part is not automotive qualified and has a 0°C to 85°C commercial temperature range, its use in avionics should be limited to controlled cockpit or equipment-bay environments and must comply with program-specific derating and traceability requirements. For legacy avionics repairs, use the same N-suffix finish and keep a verified programmed configuration file in revision control.
Recommended
Video and Imaging Interface Conversion
The EP20K60EFC324-3N can serve as a small video timing and interface converter for industrial or medical displays. It can generate pixel clocks, blanking signals, and address pointers; synchronize parallel video data; and repack image data between RGB and digital video buses. With 196 I/Os, the FPGA can receive 24-bit RGB plus control signals and drive a dual-port video RAM or bus interface. The internal logic is sufficient for line buffers and simple color-space conversion state machines, while external SDRAM is used for full-frame storage. The 182 MHz clock is adequate for VGA-to-XGA-class pixel rates, especially when the data path is kept parallel. Designers should pay close attention to pin assignment to minimize skew and should follow the datasheet's clock-region guidelines. This FPGA is a practical choice for eco-system boards that must support multiple display resolutions without changing hardware.
Recommended
Recommended Products Summary
Engineering reference data for EP20K60EFC324-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K60EFC324-3 | EP20K60EFC324-2N | EP20K60EFC324-2 | EP20K60EFC324-2X |
|---|---|---|---|---|---|
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Number of Logic Elements | 2560 | 2560 | 2560 | 2560 | 2560 |
| User I/O Count | 196 | 196 | 196 | 196 | 196 |
| Core Supply Voltage | 1.71V ~ 1.89V | 1.71V ~ 1.89V | 1.71V ~ 1.89V | 1.71V ~ 1.89V | 1.71V ~ 1.89V |
| Speed Grade / Ordering Suffix | -3N | -3 | -2N | -2 | -2X |
Key Differentiators
- N-suffix lead-free ordering option differentiates this part from legacy non-N variants (vs EP20K60EFC324-3)
- Commercially specified -3 speed grade balances cost and timing for legacy 196-I/O designs (vs EP20K60EFC324-1X)
- Available through Rochester Electronics marketplace in addition to Mouser and Octopart listings (vs Brand-new Intel Cyclone or comparable modern FPGA)
Design Notes
The EP20K60EFC324-3N requires a 1.8 V core rail held between 1.71 V and 1.89 V. Because the device is a 324-ball BGA, place a low-ESR 0.1 uF ceramic capacitor on every VCC ball, and add bulk tantalum or ceramic capacitance around the perimeter of the BGA. The APEX 20K board design guidelines recommend short low-inductance traces between the capacitor and via to the ball. The core supply should have its own copper plane to minimize power-supply noise, especially if the FPGA clock is running near 182 MHz. A supervisory circuit or sequencer can hold the device in configuration reset until the 1.8 V rail is stable.
A common pitfall with legacy FPGAs is assuming that every pin in the BGA is a user I/O. Of the 324 balls, only 196 are user I/Os; the remaining balls include VCC, ground, dedicated clock inputs, configuration pins, and JTAG pins. Obtain the official APEX 20KE pin table before layout and assign I/O to avoid shared clock or configuration balls. Also confirm that your chosen EP20K60EFC324-3N alternative actually has the same ball map; within the EP20K60EFC324 family this is expected, but a different package code, such as EBC356, will not be drop-in.
The 196 user I/Os of the EP20K60EFC324-3N can be used for buses running at tens of MHz in a 19x19 mm BGA. To avoid simultaneous switching noise, spread outputs across different I/O banks when possible and avoid grouping all bus outputs on one side of the package. Use series termination resistors close to the FPGA for point-to-point lines. Follow the datasheet board design guidelines for trace length matching on clock and data buses, and place the FPGA near the memories or ASICs it connects to so that trace stubs are short. This is especially important when a faster -2 or -1 variant is used as a drop-in replacement.
Although the 1.8 V core of the EP20K60EFC324-3N reduces power compared to earlier 5 V FPGAs, power dissipation can still be significant with high toggle rates and all I/O bank loads connected. Estimated: for 150 mA core current at 1.8 V, core power is about 0.27 W; output drive power can add another 0.1-0.3 W depending on load capacitance and switching frequency. The 324-FBGA has a moderate thermal path through the solder balls to the PCB, so provide at least one thermal ground plane and populate a few thermal vias under the center pad if the datasheet center pad is used. The commercial 0-85°C junction temperature range must be respected in sealed enclosures.
Compliance Information
The -N suffix in Altera ordering codes commonly corresponds to a lead-free finish, but the fetched distributor snippets did not provide an explicit RoHS, REACH, halogen-free, or conflict-minerals statement for EP20K60EFC324-3N. Verify compliance against the official Intel/Altera datasheet or ask the distributor for the current certificate of compliance.
