EP20K60EFC324-2N - APEX-20KE FPGA, 60K Gates, 324-BGA | Altera
MPN: EP20K60EFC324-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.88 | $87.88 |
| 10 | $79.09 | $790.90 |
| 100 | $70.3 | $7,030.00 |
| 500 | $61.52 | $30,760.00 |
| 1,000 | $52.73 | $52,730.00 |
EP20K60EFC324-2N Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the designer configures after manufacturing. FPGAs sit in the broader hierarchy: programmable logic device (PLD) -> FPGA -> SOPC integration platform. The APEX-20KE family pioneered MultiCore architecture, integrating look-up tables (LUTs), embedded system blocks (ESBs) for memory, and product-term blocks into one fabric.
Key features of the EP20K60EFC324-2N include 32,768 total RAM bits distributed across embedded system blocks, 196 maximum user I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL), and 32,768 system gates for high-density logic integration. The device supports in-system programmability via IEEE 1149.1 JTAG and Altera's passive serial configuration scheme, allowing rapid design iteration without removing the device from the board.
The EP20K60EFC324-2N uses a fine-grain MultiCore architecture where each logic element (LE) combines a 4-input LUT, a programmable register, and carry/chain logic. The 32 Kbits of embedded memory can be configured as RAM, ROM, or FIFO, eliminating external memory in many glue-logic applications. The 1.8 V core reduces dynamic power compared with older 5 V and 3.3 V APEX predecessors, while 3.3 V tolerant I/O banks allow direct interface to legacy buses.
Typical applications for this part include telecommunications line cards, industrial control and factory automation, military and aerospace prototyping, ASIC prototyping, glue-logic replacement, and high-speed parallel DSP pre/post-processing. The wide I/O count (196) and ample memory (32 Kbits) make it suitable for data-path bridging and protocol conversion designs. The 324-BGA package supports high-density board layouts with controlled-impedance signal routing.
Designers should plan power sequencing for the 1.8 V core (use a low-dropout regulator with 3 A headroom), provide bulk decoupling on each VCCINT/VCCIO pin, and follow Altera's application note AN116 (configuration hardware) for JTAG chain and passive serial mode. The device operates commercially from 0 °C to 85 °C TJ, so thermal management is typically passive with copper pours.
This page synthesizes distributor pricing, drop-in same-package alternatives from the APEX-20K and APEX-20KE families, and practical design notes not found in the standalone datasheet, helping engineers shorten the part-selection and BOM-qualification cycle for legacy Altera FPGA designs.
Drop-in alternatives for EP20K60EFC324-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K60EFC324-2N (same form factor and footprint) — differing in Operating Temperature, Package / Case, Series, Supplier Device Package, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K60EFC324-2
✅ Drop-In✓ In Stock
$41.75 / Unit
View Datasheet →EP20K60EFC324-2X
✅ Drop-In✓ In Stock
$195.5 / Unit
View Datasheet →EP20K60EFC324-1X
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP20K60EFC324-1
✅ Drop-In✓ In Stock
$76.5 / Unit
View Datasheet →EP20K100FC324-1V
✅ Drop-In✓ In Stock
$118.4 / Unit
View Datasheet →EP20K100FC324-3V
✅ Drop-In✓ In Stock
$53 / Unit
View Datasheet →EP20K60EFC324-2N Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Family | APEX 20K |
| Number of Logic Elements/Cells | 2,560 |
| Total System Gates | 60,000 |
| Number of Logic Array Blocks (LABs/CLBs) | 2,560 |
| Total RAM Bits | 32,768 |
| Number of I/O | 196 |
| Core Voltage Supply | 1.71 V to 1.89 V (1.8 V typ.) |
| Internal Frequency (max) | 200 MHz |
| Propagation Delay | 1.72 ns |
| Operating Temperature Range (TJ) | 0 °C to 85 °C (commercial) |
| Package / Case | 324-BGA (FineLine BGA, 19x19 mm) |
| Supplier Device Package | 324-FBGA (19x19) |
| Mounting Type | Surface Mount |
| Process Technology | 0.22 µm CMOS |
| Architecture | MultiCore (LUT + ESB memory + product-term) |
| Configuration Method | Passive Serial / JTAG (IEEE 1149.1) |
| RoHS Status | unknown |
EP20K60EFC324-2N 324-fbga (19x19) Pin Configuration Guide
Pin configuration for EP20K60EFC324-2N (324-fbga (19x19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K60EFC324-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K60EFC324-2N is suitable for 6 applications: Telecommunications Line Card Glue Logic, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Military and Aerospace Legacy Avionics, High-Speed Parallel DSP Pre/Post-Processing, Legacy Medical Imaging Interface Boards.
Telecommunications Line Card Glue Logic
The EP20K60EFC324-2N is well suited for telecom line-card glue logic bridging parallel backplanes, TDM framers, and network processors. Its 60K system gates plus 32 Kbits of embedded RAM in 196 I/O allow designers to consolidate multiple 74-series bus bridges, FIFOs, and protocol converters into one device, reducing board area and BOM cost. The 1.8 V core plus 3.3 V-tolerant I/O banks mate cleanly to legacy 3.3 V telecom ASICs while reducing dynamic power versus older 5 V PLDs.
Recommended
ASIC Prototyping and Emulation
The EP20K60EFC324-2N provides a cost-effective prototyping platform for ASIC RTL bring-up, offering 60K gates and 32 Kbits of distributed memory for small to mid-complexity ASIC designs. MultiCore architecture with LUTs and embedded system blocks (ESBs) maps efficiently to synthesized ASIC netlists, while JTAG-based passive serial configuration allows rapid bitstream reload during verification cycles. The 324-FBGA footprint supports high-density breakout boards used in FPGA emulation farms.
Recommended
Industrial Control and Factory Automation
Industrial PLC and motion-control backplanes use the EP20K60EFC324-2N for high-speed parallel I/O expansion, encoder interfacing, and deterministic state-machine control. Its 196 user I/Os handle multi-axis encoder inputs plus 24 V-tolerant opto-isolated signals via external level shifters, while 60K gates implement PID loops, commutation logic, and safety interlocks. Commercial 0-85 °C operation fits standard factory-floor enclosures, and the surface-mount 324-BGA supports conformal-coated boards.
Recommended
Military and Aerospace Legacy Avionics
The EP20K60EFC324-2N continues to support legacy military and aerospace platforms that qualified the APEX-20KE family years ago, particularly for retrofit boards and field-replaceable units. Designers benefit from mature Altera Quartus II design flow support and a large library of verified IP cores for MIL-STD-1553, ARINC 429, and discrete signal conditioning. The 0-85 °C commercial grade covers most ground-vehicle and shipboard applications; for airborne, the -2X extended temperature variant is preferred.
Recommended
High-Speed Parallel DSP Pre/Post-Processing
Signal-processing front ends use the EP20K60EFC324-2N for FIR filter coefficient distribution, parallel-to-serial conversion, and data buffering between ADCs and DSP processors. The 32 Kbits of dual-port RAM inside ESBs implement elastic FIFOs that absorb ADC-to-DSP clock-domain crossings without external memory, while 196 I/O pins handle 16+ bit parallel data buses plus handshake signals. The 200 MHz internal performance supports pipelined DSP datapaths at baseband rates.
Recommended
Legacy Medical Imaging Interface Boards
Medical imaging systems originally designed with APEX-20KE devices continue to use the EP20K60EFC324-2N for video timing generation, frame-buffer arbitration, and parallel sensor readout. The 60K gates implement timing controllers for VGA/DVI and LVDS sensor interfaces, while the 32 Kbits of block RAM serve as line buffers for ultrasound or endoscopy front ends. The 324-FBGA package fits standard 6-layer medical-imaging PCBs, and the device's mature qualification status supports long-life medical certification cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP20K60EFC324-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K60EFC324-2 | EP20K60EFC324-2X | EP20K60EFC324-1X | EP20K60EFC324-1 | EP20K100FC324-1V | EP20K100FC324-3V |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 324-FBGA (19x19 mm) | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same |
| System Gates | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | 100,000 | 100,000 |
| Logic Elements | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 | 4,160 | 4,160 |
| Total RAM Bits | 32,768 | 32,768 | 32,768 | 32,768 | 32,768 | 53,248 | 53,248 |
| User I/O | 196 | 196 | 196 | 196 | 196 | 252 | 252 |
| Speed Grade | -2 | -2 | -2 | -1 | -1 | -1 | -3 |
| Operating Temperature (TJ) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | Extended temperature grade | Extended temperature grade | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
Key Differentiators
- Identical die and footprint across -2N and -2 suffix (vs EP20K60EFC324-2)
- Extended temperature option in same footprint (vs EP20K60EFC324-2X)
- Higher logic density in same package (vs EP20K100FC324-1V)
Design Notes
Estimated: The EP20K60EFC324-2N draws approximately 1.5 A to 2.5 A from the 1.8 V VCCINT rail during typical 200 MHz operation, so a low-dropout regulator rated for at least 3 A continuous output is required. Use a sequencer or dual-rail LDO with power-good feedback to ensure VCCINT and VCCIO ramp together within Altera's 100 ms specification; out-of-order power-up can cause I/O latch-up or long-term reliability degradation in CMOS MultiCore fabric.
Place one 0.1 µF X7R ceramic decoupling capacitor on every VCCINT pin and one 0.01 µF capacitor on every VCCIO pin, plus a single 47 µF to 100 µF bulk tantalum or polymer capacitor near the BGA. The 324-FBGA package (19x19 mm, 1.0 mm pitch) requires 4-layer or 6-layer PCB stackup with microvia-in-pad if BGA fanout demands escape routing through inner rows; follow Altera AN114 (package and board layout) for via pattern recommendations.
Do not confuse the EP20K60EFC324-2N (commercial 0-85 °C) with the EP20K60EFC324-2X (extended temperature grade); substituting the wrong grade in avionics or outdoor industrial designs will fail qualification. JTAG chain order matters: place TMS, TCK, TDI, TDO from the Altera device first, then downstream devices, with a 1 kΩ pull-up on TCK and TMS to keep the chain stable during configuration. Finally, ensure the configuration EPC flash is sized for the chosen compression mode (currently compressed bitstreams are ~30% smaller than uncompressed).
Compliance Information
RoHS, REACH, lead-free, and halogen-free compliance not declared in current distributor listings as of 2026-09-08. APEX-20KE family pre-dates RoHS transition; engineers should request compliance documentation from the distributor or qualify an RoHS-marked APEX-20KE variant where available. AEC-Q100 not applicable - this is a commercial-grade programmable logic device, not an automotive-qualified IC.
