EP2A25F672I6 - APEX II 25K LUT FPGA 672-BGA | Intel (Altera)
MPN: EP2A25F672I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $225 | $22,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $178 | $178,000.00 |
EP2A25F672I6 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (LUTs), embedded memory, DSP blocks, and programmable interconnect into a single semiconductor die. Within the broader taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) inside the programmable logic family, which itself belongs to the digital integrated circuit / semiconductor category. APEX II extends this hierarchy by combining LUT-based logic with dedicated MultiCore multipliers and embedded system blocks, bridging the gap between traditional FPGA glue logic and early platform-level integration.
Key features of the EP2A25F672I6 include approximately 25,000 typical gates (manufacturer-published logic element metric), embedded MultiCore multipliers for DSP acceleration, embedded system blocks (ESBs) for on-chip dual-port RAM and CAM, JTAG (IEEE 1149.1) boundary-scan support, and dedicated clock management circuitry. The device is offered in the industrial temperature grade (suffix "I") and a speed grade of 6, denoted by the trailing "6" in the part number.
The APEX II architecture combines fine-grained LUTs with coarse-grained embedded memory, allowing a single device to implement wide datapaths, FIFO buffers, and DSP pipelines without external memories. MultiCore multipliers deliver dedicated hardware multiplication, freeing general-purpose logic from arithmetic bottlenecks. This combination makes APEX II particularly suited to mixed datapath-and-control designs where engineers want to keep everything inside one programmable fabric.
Typical applications include telecom line-card glue logic, parallel DSP pipelines for video and imaging, industrial control and instrumentation front-ends, and high-density bus-interface consolidation. The 672-ball FineLine BGA package supports up to 16 user I/O banks with single-ended and differential signalling options per device documentation.
When designing with this part, note that SRAM-based FPGAs require a configuration device (EPC or compatible) at every power-up. The industrial temperature grade ("I6") supports -40 °C to +100 °C ambient operation, but the device is an older generation now considered NRND (Not Recommended for New Designs) by Intel/Altera. Engineers evaluating this part for new projects should review the latest Intel product change notifications.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the APEX II family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2A25F672I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F672I6 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25F672I-7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2A25F672I-9
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672C9N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672C9
✅ Drop-In✓ In Stock
$700 / Unit
View Datasheet →EP2A25F672C8N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP2A25F672C8
✅ Drop-In✓ In Stock
$951.18 / Unit
View Datasheet →EP2A25F672C7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672C7
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP2A25F672I6 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements (typical gates) | 25,000 |
| Fabric Architecture | SRAM-based LUT |
| Process Technology | 0.18 µm CMOS |
| Package | 672-ball FineLine BGA (FBGA-672) |
| Core Voltage | 1.5 V |
| Configuration Method | External SRAM configuration device (EPC series) |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) |
| Speed Grade | 6 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM |
| DSP Blocks | MultiCore dedicated multipliers |
| Boundary Scan | JTAG (IEEE 1149.1) compliant |
| Clock Management | Dedicated PLL / clock tree circuitry |
| Mounting Type | Surface Mount (BGA) |
EP2A25F672I6 672-ball fineline bga (fbga-672) Pin Configuration Guide
Pin configuration for EP2A25F672I6 (672-ball fineline bga (fbga-672) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A25F672I6.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A25F672I6 is suitable for 6 applications: Telecom Line-Card Glue Logic, Parallel DSP / Video Imaging Pipeline, Industrial Control and Instrumentation Front-End, High-Density Bus-Interface Consolidation, Legacy ASIC Replacement and Long-Life Production, Prototyping and Emulation Platform.
Telecom Line-Card Glue Logic
The EP2A25F672I6 fits telecom line-card glue-logic applications because its 25,000-logic-element APEX II fabric consolidates bus bridges, framers, and custom backplane interfaces that previously required multiple CPLDs. The 672-ball FineLine BGA exposes enough user I/O to drive 32-bit datapaths plus redundant control, and the industrial temperature grade (-40 to +100 C) survives the airflow-restricted ambient inside a central-office shelf. Dedicated MultiCore multipliers also accelerate channel-coding DSP without forcing an external DSP chip onto the BOM. In a typical design the FPGA sits between the network processor and the line interface, translating between SPI, UTOPIA, or proprietary SERDES framing and presenting a clean register interface upstream. Designers benefit from a single programmable device replacing three or four discrete glue-logic packages, which simplifies re-spin when the silicon host changes.
Recommended
Parallel DSP / Video Imaging Pipeline
The EP2A25F672I6 is well suited to parallel DSP and video-imaging pipelines because the APEX II MultiCore embedded multipliers deliver hardware multiplication at full fabric clock rate, sustaining FIR, IIR, and motion-estimation kernels without an external DSP. The 672-ball BGA exposes enough LVDS pairs to interface directly to CMOS image sensors or DVI receivers, while embedded system blocks (ESBs) provide dual-port RAM line buffers on-chip. Designers typically build a 3x3 convolution or color-space converter with the multipliers and back the line buffers with ESB RAM, hitting 100-150 MHz on a -6 speed grade industrial part. The trade-off versus a modern Cyclone V is static power and cost per LE, but for legacy systems still in production this part remains a known quantity with stable tooling support in Quartus II 13.0 and earlier.
Recommended
Industrial Control and Instrumentation Front-End
The EP2A25F672I6 fits industrial control and instrumentation front-ends because its industrial temperature range (-40 to +100 C) survives factory-floor ambient and the 672-ball BGA exposes enough user I/O to scan hundreds of discrete sensors, drive actuator bridges, and run a soft-CPU for supervisory logic. APEX II ESBs hold calibration tables and run-length-encoded histograms without consuming external SRAM, while the MultiCore multipliers compute RMS and FFT readings at line rate. Engineers typically instantiate a Nios-equivalent soft-core inside the fabric to consolidate what was previously a microcontroller plus a CPLD plus a DSP. The trade-off is power: APEX II on 0.18 um draws more quiescent current than a modern Cyclone V on 60 nm, so designers must budget heatsinking for sealed enclosures. For long-life industrial platforms with 10-15 year support commitments the part remains attractive.
Recommended
High-Density Bus-Interface Consolidation
The EP2A25F672I6 is a strong match for high-density bus-interface consolidation because 25,000 logic elements plus 672 balls of user I/O let a single device absorb legacy PCI, VME, and proprietary backplane bridges that previously required three or four CPLDs. APEX II supports 3.3 V and 5 V tolerant I/O standards via bank-by-bank VCCIO rails, so the same die bridges a 5 V VME bus to a 3.3 V local processor without external level shifters. Embedded system blocks back the bridge FIFOs and reduce external SRAM count on the BOM, which simplifies the bill of materials and improves MTBF. Designers benefit from a single JTAG chain for boundary-scan test across all bridge functions, replacing several discrete CPLD scan chains with one cohesive test infrastructure.
Recommended
Legacy ASIC Replacement and Long-Life Production
The EP2A25F672I6 is frequently used to replace end-of-life ASICs in long-life production programs because APEX II is a programmable drop-in for many fixed-function ASICs in telecom, defense, and industrial automation. A customer with a 20-year field-deployment commitment can re-host the original RTL into APEX II logic, prototype in days rather than waiting for a new ASIC tape-out, and ship against the same system-level specification. The 672-ball FineLine BGA preserves the original ASIC footprint in many migration designs, avoiding PCB rework. The trade-off is per-unit cost versus a high-volume ASIC, so this application fits low-to-medium volume legacy programs rather than consumer-grade high volume. APEX II NRND status means engineers should qualify a second source such as a smaller-footprint EP2A15 variant for risk mitigation.
Recommended
Prototyping and Emulation Platform
The EP2A25F672I6 suits ASIC and ASSP prototyping platforms because the 25,000-logic-element fabric holds a meaningful slice of pre-silicon RTL, and the 672-ball BGA exposes enough I/O to map a representative subset of the target die's external interfaces. Quartus II 13.0 and earlier toolchains support APEX II with mature simulation and timing-analysis flows, which lowers engineering risk versus untested newer families. Embedded system blocks act as scratch-pad memory for emulated register files, and MultiCore multipliers preview DSP block behaviour before committing to a silicon vendor. Designers benefit from re-using legacy APEX II prototype boards already in their lab rather than re-investing in a new prototyping platform for each project refresh.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F672I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25F672I-7 | EP2A25F672I-9 | EP2A25F672C9N | EP2A25F672C9 | EP2A25F672C8N | EP2A25F672C8 | EP2A25F672C7N | EP2A25F672C7 |
|---|---|---|---|---|---|---|---|---|---|
| Package | FBGA-672 (F672) | FBGA-672 (F672) - same | FBGA-672 (F672) - same | FBGA-672 (F672) - same | FBGA-672 (F672) - same | FBGA-672 (F672) - same | FBGA-672 (F672) - same | FBGA-672 (F672) - same | FBGA-672 (F672) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| Speed Grade | 6 | 7 (faster) | 9 (fastest) | 9 | 9 | 8 | 8 | 7 | 7 |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
Key Differentiators
- Industrial temperature grade with NRND-stable die (vs EP2A25F672C9N)
- Balanced speed-grade position for cost-down production (vs EP2A25F672I-9)
- Pin-compatible speed-grade upgrade path (vs EP2A25F672I-7)
Design Notes
Because the EP2A25F672I6 is SRAM-based, the device has no on-chip non-volatile configuration memory; the bitstream must be loaded by an external EPC-series configuration device (such as EPC16 or EPC8) on every power-up. Forgetting this in a design review is the most common cause of an apparently-dead APEX II board. Always include the configuration device, the 3.3 V pull-ups on nCONFIG and nSTATUS, and the proper JTAG chain in the schematic from day one. Estimate: configuration time for a fully populated APEX II bitstream at 33 MHz Passive Fast mode is on the order of tens of milliseconds; budget POR delays accordingly.
APEX II is built on a 0.18 µm process and dissipates noticeably more quiescent and dynamic power than modern Intel Cyclone or MAX families. At 100 % utilization of 25,000 logic elements running at 100 MHz, junction temperature can rise 15-25 °C above ambient with the recommended thermal pad and a 4-layer PCB. In sealed enclosures with limited airflow, derate the clock frequency or reduce toggle rate, or add a small heatsink on the BGA package. Estimated: theta_JA on a JEDEC 4-layer test board with thermal vias is approximately 12-15 °C/W for a 672-ball BGA; the precise figure requires the manufacturer heat-spreader design guide.
The 672-ball FineLine BGA is a 1.0 mm pitch package, which is at the edge of what most contract manufacturers comfortably assemble with paste-and-reflow. Use NSMD (non-solder-mask defined) pads, plane-balanced ball escape routing, and at least 4 PCB layers with continuous ground planes under the BGA. Place decoupling capacitors on the bottom side of the BGA with vias within 1 mm of each supply ball, and tie VCCINT (1.5 V) and VCCIO bank rails separately so the I/O voltage can be set per bank. APEX II supports 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V tolerant I/O standards via VCCIO selection, but mixing 5 V and 1.5 V in the same bank is forbidden.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not explicitly stated in the Verified Web Data; the 'N' suffix in similar APEX II part numbers typically indicates lead-free finish, but the EP2A25F672I6 datasheet excerpt did not confirm this. Engineers should request the latest material declaration from Intel/Altera before placing the part in a RoHS- or REACH-controlled build.
