EP2A25F672I8 - APEX II FPGA, 900K Gates, 492 I/O, 672-BGA | Altera
MPN: EP2A25F672I8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $156.15 | $156.15 |
| 10 | $148.34 | $1,483.40 |
| 100 | $140.5 | $14,050.00 |
| 500 | $132.75 | $66,375.00 |
| 1,000 | $125 | $125,000.00 |
EP2A25F672I8 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader taxonomy, FPGAs sit alongside CPLDs and ASICs in the programmable logic family, and underneath the larger category of digital logic ICs. APEX II sits at the high-density end of this hierarchy: it combines look-up-table based logic, embedded SRAM, embedded multipliers, and PLLs in a single fabric, allowing designers to implement microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces on one die. The EP2A25F672I8's 622 Kb of embedded memory and dedicated carry chains make it well suited to data-path designs that previously required a discrete ASIC.
Key features include 24,320 logic elements, 622,592 bits of RAM (~76 Kbytes), 492 user I/Os (the largest I/O count in the APEX II family), four enhanced PLLs, dedicated LVDS I/O support with data rates up to 1 Gbps, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI), and JTAG-based IEEE 1149.1 boundary-scan programming. The 672-ball FineLine BGA package provides controlled-impedance signal paths and ample power/ground balls for noise isolation.
Typical applications include high-speed telecommunications bridging, ATM/packet processing, ASIC prototyping, PCI/PCI-X interface logic, custom DSP datapaths, video/imaging pipelines, and military/aerospace signal processing where industrial temperature grading is mandatory. The 672-BGA package requires multi-layer PCB design with via-in-pad or dog-bone fan-out, controlled-impedance traces, and adequate thermal vias under the central ground/power balls.
Designers should plan for a 1.5 V core supply with bulk decoupling on every power ball pair, and follow Altera's AN 117 application note for APEX II PCB layout. The 'I8' industrial speed grade indicates AC performance that is slower than the 'C9' commercial 0 °C–85 °C speed grade; this trade-off is acceptable when operating temperature, not absolute clock frequency, is the primary constraint.
Drop-in alternatives for EP2A25F672I8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F672I8 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25F672I7
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View Datasheet →EP2A25F672C7
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View Datasheet →EP2A15F672I8
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View Datasheet →EP2A25F672I8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements / Cells | 24,320 |
| Equivalent Gates | 900,000 |
| Embedded Memory (RAM bits) | 622,592 |
| User I/Os | 492 |
| Number of PLLs | 4 |
| Process Technology | 0.15 µm CMOS, up to 8 metal layers |
| Core Supply Voltage | 1.5 V |
| Propagation Delay | 1.69 ns (typical) |
| Internal Performance | 333 MHz (per legacy datasheet) |
| LVDS / High-Speed I/O | Yes, up to 1 Gbps |
| Package | 672-ball FC-FBGA (FineLine BGA), 27 × 27 mm, 1 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | –40 °C to +85 °C (industrial, 'I' grade) |
| Speed Grade | I8 (industrial, 8-speed-grade per APEX II ordering scheme) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI |
| RoHS Status | unknown |
| Lead-Free Status | unknown |
EP2A25F672I8 672-ball fc-fbga (fineline bga), 27 × 27 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP2A25F672I8 (672-ball fc-fbga (fineline bga), 27 × 27 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A25F672I8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A25F672I8 is suitable for 6 applications: Telecommunications Bridging & Protocol Conversion, ASIC Prototyping & Emulation, Custom DSP Datapath & FIR Filter Implementation, PCI / PCI-X Bus Interface Logic, Video & Imaging Pipeline Processing, Military & Aerospace Signal Processing.
Telecommunications Bridging & Protocol Conversion
The EP2A25F672I8's 24,320 logic elements and 622 Kb of embedded SRAM make it well suited to telecommunications bridging between legacy TDM (T1/E1/SONET) and packet-based (ATM, Ethernet, MPLS) domains. Per the APEX II datasheet, the four PLLs derive independent clocks for each interface, while 492 user I/Os provide ample GPIO for backplane glue logic. Designers place the EP2A25F672I8 between line interface units and a network processor, mapping framers, HDLC controllers, and Utopia interfaces into the FPGA fabric. Industrial temperature grading (–40 °C to +85 °C) ensures operation in outdoor DSLAM cabinets and central-office bays without active cooling.
Recommended
ASIC Prototyping & Emulation
Engineers historically used the EP2A25F672I8 to prototype ASICs containing up to ~900K equivalent gates before taping out silicon. The 24,320 LEs and 622 Kb of internal memory closely approximate mid-1990s ASIC densities, while 492 I/Os expose wide bus interfaces (32- or 64-bit) directly to bring-up boards. Per the APEX II datasheet, JTAG IEEE 1149.1 boundary-scan and SRAM-based configuration enable rapid design-iteration cycles. The 672-ball FC-FBGA package's 1 mm pitch supports controlled-impedance traces for signals up to 100 MHz, and the industrial temperature grade lets prototypes be exercised in environmental chambers.
Recommended
Custom DSP Datapath & FIR Filter Implementation
The EP2A25F672I8's embedded multiplier blocks and 622 Kb of distributed RAM let designers build high-throughput FIR filters, FFT engines, and correlators that previously required dedicated DSP processors. Per APEX II family documentation, the MultiCore architecture supports parallel multiplier chains reaching up to several hundred MHz, while the four PLLs generate the multi-phase clocks needed for polyphase filter banks. Industrial temperature grading is critical for vibration-monitoring DSP in factory automation and for radar-signal pre-processing. The 492 I/Os accommodate wide ADC/DAC buses (16-24 bits parallel) and DMA handshakes to external memory.
Recommended
PCI / PCI-X Bus Interface Logic
The EP2A25F672I8 supports the PCI 33/66 MHz and PCI-X 66/100/133 MHz standards natively through its programmable I/O banks (per the APEX II Data Sheet I/O-standards table). Designers implement the PCI protocol engine, configuration-space registers, and 32- or 64-bit transaction layer in the FPGA fabric, while the 622 Kb of embedded memory absorbs posted-write buffers and completion FIFOs. With 492 user I/Os, the part can simultaneously drive the PCI bus, a local CPU bus, and a memory-mapped peripheral bus. Industrial temperature grading makes it appropriate for industrial PCs and embedded instrumentation that must operate in factory environments.
Recommended
Video & Imaging Pipeline Processing
The EP2A25F672I8 was widely deployed in late-1990s video capture and processing cards, where 492 I/Os were used to receive wide digital video buses (16-24 bit parallel RGB or YCbCr) directly from image sensors or video decoders. The 622 Kb of embedded RAM serves as line buffers and frame-store memory, while the 24,320 LEs implement color-space conversion, scaling, and overlay planes. Per the APEX II datasheet, the device's LVDS I/O capability supports up to 1 Gbps per channel, enabling Channel Link and FPD-Link interconnects to flat-panel displays. Industrial temperature grading suits industrial machine-vision and surveillance applications.
Recommended
Military & Aerospace Signal Processing
The EP2A25F672I8's industrial –40 °C to +85 °C operating range (per the 'I' temperature grade) supports many military and aerospace platforms where full MIL-spec –55 °C to +125 °C is not required. Engineers use it for radar pre-processing, electronic-warfare front ends, and flight-control databus bridges where its 24,320 LEs deliver ample logic for parallel channel processing and 622 Kb of embedded RAM stores coefficient tables and ping-pong buffers. The 672-ball FC-FBGA package, despite not being hermetic, has been adopted in many ruggedised enclosures with conformal coating. The obsolete lifecycle status means long-term availability must be planned through last-time-buy inventory.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F672I8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25F672I7 | EP2A25F672I6 | EP2A25F672C9 | EP2A25F672C8N | EP2A25F672C7 | EP2A15F672I8 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch | 672-ball FC-FBGA, 27×27 mm, 1 mm pitch |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | ~15,000 (–38%) |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 492 |
| Operating Temperature | –40 °C to +85 °C (industrial) | –40 °C to +85 °C (industrial) | –40 °C to +85 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | –40 °C to +85 °C (industrial) |
| Speed Grade | I8 (industrial, 8-grade) | I7 (slower AC) | I6 (slowest industrial) | C9 (fastest commercial) | C8 (commercial) | C7 (slower commercial) | I8 (same speed grade) |
| Lead-Free / RoHS | unknown | unknown | unknown | unknown | yes (lead-free NiPdAu per Altera ordering scheme 'N' suffix) | unknown | unknown |
Key Differentiators
- Highest-density industrial-grade APEX II variant in 672-FBGA (vs EP2A15F672I8)
- Industrial temperature range with same die as commercial C9 (vs EP2A25F672C9)
- Drop-in compatibility with the entire EP2A25F672 speed-grade family (vs EP2A25F672I7)
Design Notes
The 672-ball FC-FBGA package with 1 mm ball pitch requires a multi-layer PCB (at least 6 layers, recommended 8 layers) with controlled-impedance routing for high-speed I/O. Per Altera's APEX II PCB-layout guidelines (AN 117), use via-in-pad or dog-bone fan-out, place power and ground balls over a continuous solid plane, and stitch the BGA field with ground vias on a 1.27 mm pitch to provide low-impedance return paths. Trace length matching is critical for LVDS and PCI-X signals; design for ±150 mil (3.81 mm) intra-pair and ±500 mil (12.7 mm) inter-pair skew.
The EP2A25F672I8 requires a 1.5 V core supply with bulk decoupling on every power ball pair. Per the APEX II Data Sheet, each VCCINT ball pair should have a 0.1 µF X7R ceramic capacitor placed within 100 mils, plus a 10 µF tantalum or polymer bulk capacitor per voltage rail (VCCINT, VCCIO banks). Estimated: at 333 MHz internal performance with all 24,320 LEs switching, dynamic current can reach 1.5–2.0 A, so the 1.5 V regulator must deliver at least 3 A with 30 % headroom. Use a low-noise LDO (e.g., LT1764 or TPS7A4701) downstream of a switching pre-regulator if efficiency is critical.
Although the 672-ball FC-FBGA package does not carry an exposed thermal pad, the central ground and power balls serve as the primary thermal path. Per the APEX II mechanical drawing, populate the central power/ground ball grid with full-size vias to inner copper planes for heat extraction. Estimated: at 2 W dissipation (typical for a fully-utilised APEX II device at moderate toggle rates), junction-to-ambient thermal resistance (θJA) for a 672-ball FC-FBGA on a 1 oz 8-layer PCB is roughly 15–20 °C/W, yielding a 30–40 °C rise above ambient. For sealed enclosures, derate clock frequency to keep junction temperature below 100 °C.
For LVDS and 1 Gbps interfaces, follow IEEE-1596 and Altera AN 224 high-speed I/O guidelines: 100 Ω differential impedance, AC-coupling capacitors near the receiver, and pre-emphasis/de-emphasis settings via Quartus. Per the APEX II Data Sheet, the device's True-LVDS transmitters support data rates up to 1 Gbps but require careful board-level SI analysis for inter-symbol jitter. Always simulate the channel with the IBIS model (altera_apexii.ibs) and validate with eye-diagram measurements on first prototypes.
Common pitfalls when designing with EP2A25F672I8: (1) confusing 'I8' speed grade with 'C8' - the I-grade is industrial temp, NOT industrial speed, and AC performance is slower than the equivalent C-grade; (2) failing to provide proper JTAG chain termination (per IEEE 1149.1, TCK must be pulled down and TMS/TDO pulled up); (3) using the wrong configuration scheme - APEX II supports SRAM-based configuration via EPC16/EPC8 configuration devices, and selecting the wrong bitstream format causes the device to hang at startup; (4) ignoring the 'no-connect' ball list in the mechanical drawing, which must remain floating; (5) underestimating configuration time - a full 24,320-LE design bitstream is several megabits and takes >100 ms to load.
Compliance Information
Compliance data not present in the Verified Web Data; APEX II was a late-1990s/early-2000s family that pre-dates widespread RoHS adoption, so most variants are non-RoHS (SnPb ball finish) unless explicitly ordered with the 'N' suffix (e.g., EP2A25F672C8N). AEC-Q100 is not applicable since this is an FPGA, not an automotive-grade IC. Consult the manufacturer's material declaration or lot-traceability documents for specific compliance status.
