EP4CGX110DF27C8N - Cyclone IV GX FPGA 110K LE FBGA-672 | Intel
MPN: EP4CGX110DF27C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $287.5 | $287.50 |
| 10 | $259 | $2,590.00 |
| 100 | $215.4 | $21,540.00 |
| 500 | $178.9 | $89,450.00 |
| 1,000 | $152.3 | $152,300.00 |
EP4CGX110DF27C8N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, multipliers, and memory controllers. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> digital logic IC -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field via SRAM-based configuration memory, enabling rapid prototyping, hardware-in-the-loop verification, and post-deployment design updates. The Cyclone IV GX family targets cost-sensitive applications that still require high-speed serial I/O.
Key features of the EP4CGX110DF27C8N include 3.125 Gbps transceiver capability per channel, 56 18x18 hardware multipliers for DSP functions, 5,621,760 bits of embedded SRAM distributed across M9K blocks, four general-purpose PLLs plus two transceiver PLLs for clock management, and 8 input clock networks. The C8 commercial speed grade provides a balance of performance and power for non-automotive applications, while the device supports configuration via passive serial, fast passive parallel, active serial, and JTAG modes.
Architecturally, the EP4CGX110DF27C8N leverages the proven Cyclone IV fabric with dedicated transceiver Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) blocks. The transceiver channels support PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI standards, allowing designers to implement multi-gigabit serial interfaces without external PHY chips. The 672-pin FineLine BGA package exposes the full logic and I/O capacity of the silicon die.
Typical applications include industrial video and image processing pipelines, low-cost wireline telecommunications line cards, motor control and industrial automation, military and avionics prototypes, and PCIe Gen1 endpoint cards for industrial computing. Designers often pair the device with external DDR2/DDR3 SDRAM and flash memory for configuration storage.
When designing with the EP4CGX110DF27C8N, attention to PCB layout is critical - the FBGA-672 package requires controlled-impedance routing for the transceiver channels and a continuous GND reference plane beneath the BGA field. Quartus II software is required for design entry, synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, parametric alternatives, and practical board-level design guidance not found in a single location on the Intel Cyclone IV GX datasheet.
Drop-in alternatives for EP4CGX110DF27C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF27C8N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Technology, Transceiver Data Rate.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX110DF27C7N
β Drop-Inβ In Stock
$204.2 / Unit
View Datasheet βEP4CGX110DF27C7
β Drop-Inβ In Stock
$272.5 / Unit
View Datasheet βEP4CGX110DF27C6N
β Drop-Inβ In Stock
$119.9 / Unit
View Datasheet βEP4CGX110DF27C8
β Drop-Inβ In Stock
$225.4 / Unit
View Datasheet βEP4CGX110DF31I7N
β Drop-Inβ In Stock
$192.4 / Unit
View Datasheet βEP4CGX110DF27C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Family | Cyclone IV |
| Logic Elements | 109,424 |
| Number of Logic Blocks / Cells | 5621760 |
| Number of I/O | 393 |
| Total RAM Bits | 5,621,760 |
| Number of Multipliers | 56 (18x18) |
| Transceiver Channels | 8 |
| Transceiver Data Rate | 3.125 Gbps |
| Speed Grade | C8 (commercial) |
| Core Supply Voltage | 1.2 V |
| Number of PLLs | 4 general-purpose + 2 transceiver |
| Package Type | 672-ball FineLine BGA (FBGA-672) |
| Process Technology | 60 nm |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
EP4CGX110DF27C8N 672-ball fineline bga (fbga-672) Pin Configuration Guide
Pin configuration for EP4CGX110DF27C8N (672-ball fineline bga (fbga-672) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF27C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF27C8N is suitable for 7 applications: Industrial Video and Image Processing, PCI Express Gen1 Endpoint Card, Industrial Motor Control (FOC), Low-Cost Wireline Telecom Line Card, Military and Avionics Prototype, Multi-Channel Data Acquisition Front-End, Software-Defined Radio Baseband.
Industrial Video and Image Processing
The EP4CGX110DF27C8N fits industrial vision pipelines because its 56 18x18 hardware multipliers deliver 100+ GMAC of DSP throughput, while the 5.6 Mbits of embedded M9K memory buffer intermediate pixel rows without external SRAM hand-off. The 393 user I/O pins accept parallel Camera Link or LVDS sensor inputs, and the eight 3.125 Gbps transceivers stream compressed MJPEG/H.264 output to GigE Vision uplinks. Unlike smaller Cyclone IV devices, the 109,424 logic elements allow full pipeline implementation of Bayer demosaicing, edge detection, and machine-learning inference in a single FPGA.
Recommended
PCI Express Gen1 Endpoint Card
The EP4CGX110DF27C8N's eight 3.125 Gbps transceiver channels provide native PCIe Gen1 hard IP, allowing direct connection to a 1x or 4x PCIe edge connector without external PHY. The hard IP block handles PCIe transaction layer and data link layer in silicon, freeing logic for application-level DMA engines, scatter-gather controllers, or NVMe host interfaces. The 56 18x18 multipliers accelerate forward-error-correction or on-the-fly encryption, while the 1.2 V core plus on-chip PLLs minimize total card power consumption below 4 W in typical workloads.
Recommended
Industrial Motor Control (FOC)
Field-Oriented Control of three-phase AC motors requires sub-microsecond execution of Park/Clarke transforms, SVM modulators, and PI loops - all of which the EP4CGX110DF27C8N handles in its 56 hardware 18x18 multipliers at 32-bit fixed-point precision. The 393 user I/O accommodate three-phase PWM generators, quadrature encoder interfaces, and SPI-connected gate drivers, while the four general-purpose PLLs synthesize jitter-free clocks from a single 50 MHz crystal. The 1.2 V core supply plus the C8 commercial speed grade suit sealed industrial enclosures up to 85C ambient without throttling.
Recommended
Low-Cost Wireline Telecom Line Card
Telecom line cards using the EP4CGX110DF27C8N can aggregate multiple E1/T1/J1 framers, implement HDLC controllers, and bridge to 1G Ethernet uplinks via the on-chip transceivers. The 109,424 logic elements absorb multi-channel frame processing without external NPUs, while the embedded M9K memory holds per-channel buffers and statistics counters. Hardware multiply-accumulate units accelerate Reed-Solomon and CRC calculations for line-protocol overhead, and the four PLLs derive jitter-compliant clocks from backplane references.
Recommended
Military and Avionics Prototype
The EP4CGX110DF27C8N's SRAM-based configuration memory enables in-field firmware updates, critical for defense and avionics systems that require post-deployment cryptography upgrades. Hardware multipliers implement radar pulse compression, digital beamforming, and IFF interrogator algorithms in real time. Designers pair the FPGA with MIL-STD-1553 transceivers via LVDS I/O or with optical interfaces via the 3.125 Gbps transceivers for ARINC 818 links. The 672-ball BGA supports extended-temperature screening with I7-grade timing variants.
Recommended
Multi-Channel Data Acquisition Front-End
The EP4CGX110DF27C8N digitizes up to 16 simultaneous 16-bit ADC channels through its LVDS I/O banks, with the 56 multipliers performing real-time FIR filtering, decimation, and FFT analysis at sample rates exceeding 200 MSPS per channel. The 5.6 Mbits of embedded memory buffer post-FFT magnitude spectra, and the 3.125 Gbps transceivers stream time-stamped samples to a host processor over Aurora or Serial RapidIO. The four general-purpose PLLs provide independent sample clocks for multi-board synchronization.
Recommended
Software-Defined Radio Baseband
The EP4CGX110DF27C8N's 56 hardware multipliers perform the multiply-accumulate operations required for channelization, polyphase filter banks, and digital down-conversion in a software-defined radio baseband. The 3.125 Gbps transceivers accept digitized IF inputs from RF front-ends or interface to CPRI links to remote radio heads (RRH). The 109,424 logic elements support 8x8 MIMO processing chains, while the embedded M9K blocks store constellation LUTs and pre-computed twiddle factors. The C8 speed grade meets timing at 250 MHz DSP clock for LTE 20 MHz channels.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF27C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF27C7N | EP4CGX110DF27C7 | EP4CGX110DF27C6N | EP4CGX110DF27C8 | EP4CGX110DF31I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA (FBGA-672) | 672-ball FBGA (FBGA-672) - same | 672-ball FBGA (FBGA-672) - same | 672-ball FBGA (FBGA-672) - same | 672-ball FBGA (FBGA-672) - same | 672-ball FBGA (F31 ball-out, same body) - same |
| Speed Grade | C8 (commercial) | C7 | C7 | C6 | C8 | I7 (industrial) |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Total RAM Bits | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 | 5,621,760 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 56 | 56 |
| Transceiver Channels | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) | 8 (3.125 Gbps) |
| User I/O Pins | 393 | 393 | 393 | 393 | 393 | 393 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C |
| Core Supply | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- C8 commercial speed grade - highest Fmax in this OPN family (vs EP4CGX110DF27C7N)
- Industrial temperature grade option in same FBGA-672 footprint (vs EP4CGX110DF31I7N)
- Highest I/O density in 1.0 mm pitch FBGA (vs EP4CGX110CF23C8N)
Design Notes
The 672-ball FineLine BGA package has a 1.0 mm ball pitch requiring via-in-pad or dog-bone fanout on at least 6 PCB layers. According to Intel Cyclone IV GX hardware guidelines, stack the BGA field with continuous GND planes on layers 2 and N-1 to provide return paths for the high-speed transceivers. Estimated: at 393 I/O with 1.0 mm pitch, the minimum BGA breakout area is approximately 27 mm x 27 mm; reserve a 4-layer fanout with 0.5 oz copper to keep DC drop under 5 mV at 100 mA per I/O bank.
The eight 3.125 Gbps transceiver channels require 100-ohm differential routing with intra-pair skew under 0.5 ps per cm and continuous GND reference plane beneath the traces. Use length-matched striplines (not microstrip) for any lane exceeding 5 cm, and place AC-coupling capacitors within 25 mm of the transmitter P/N pads. The reference clock input needs a clean 100 MHz or 156.25 MHz source with phase noise below -110 dBc/Hz at 10 kHz offset - a common SDR reference clock is acceptable; budget 1.0 mm symmetric jog length matching for the MGT clock pair.
Estimated: the EP4CGX110DF27C8N draws approximately 1.5-2.0 A from the 1.2 V VCCINT rail under typical use (8 transceivers active, 50% logic utilization, 200 MHz logic clock). Use a buck regulator with at least 3 A rating and 20x 0.1 uF X7R decoupling capacitors distributed across the BGA core balls, plus 4x 47 uF bulk capacitors. The VCCIO banks must each be powered with their own LDO since mixed-voltage banks (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V) cannot be tied together.
Estimated: with all 8 transceivers at 3.125 Gbps and 60% logic toggle rate, the EP4CGX110DF27C8N dissipates approximately 3.5 W in still air. The FBGA-672 package has a theta_JA of approximately 11 C/W with a 16-layer JEDEC test board, allowing operation up to 85C ambient without forced air; above 60C ambient, derate by 0.5 C/W per layer removed. For sealed enclosures, add a 1 mm copper heat-spreader lid or thermally-pad-attached heatsink on top of the package.
Common pitfalls: (1) Forgetting to strap CONFIG_DONE pin to VCCIO with 5 kohm - missing pull-up prevents configuration. (2) Driving JTAG TCK faster than 33 MHz - Quartus supports only up to 33 MHz legacy JTAG. (3) Routing MGTREFCLK without 50 ohm termination at the receiver - causes clock jitter above the 3.125 Gbps CDR lock range. (4) Neglecting POR delay: the Standard POR time is 50-200 ms per Cyclone IV datasheet; budget for this in system boot sequencing.
Compliance Information
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable - FPGAs are not typically qualified for automotive safety. Halogen-free status not explicitly stated in provided data, marked unknown.
