EP2A25F724 - Altera APEX II Enhanced Configuration Device | FPGA
MPN: EP2A25F724 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $138 | $1,380.00 |
| 100 | $128 | $12,800.00 |
| 500 | $119 | $59,500.00 |
| 1,000 | $112 | $112,000.00 |
EP2A25F724 Overview
An enhanced configuration device (EPC) is a non-volatile memory IC specialized for storing FPGA configuration bitstreams and presenting them to the target FPGA at power-up via a vendor-specific configuration interface (typically FLEX/APEX passive serial or passive parallel). EPCs sit at the bottom of the boot-memory hierarchy (EPC -> configuration memory -> non-volatile memory -> semiconductor memory) and translate JTAG/serial commands into configuration cycles. By combining flash and controller logic in one die, the EP2A25F724 reduces BOM count, board area, and configuration time relative to discrete flash plus CPLD solutions.
Key features of the EP2A25F724 include support for multi-device configuration chains, built-in JTAG support, in-system programmability (ISP) through the IEEE Std. 1149.1 boundary-scan interface, and on-chip oscillator and control logic. The device supports Altera's passive serial, passive parallel asynchronous, and passive parallel synchronous configuration modes, making it compatible with both APEX II and legacy FLEX devices. It is offered in a 724-pin FineLine BGA package suitable for high-density production designs.
Architecturally, the EP2A25F724 separates the flash array into configuration controller blocks and user-accessible flash regions, allowing engineers to store configuration data and user code in the same physical device. The configuration controller handles bitstream compression, decompression, and error detection during FPGA load, while the flash array retains data across power cycles without a backup battery.
Typical applications include APEX II FPGA boot memory, multi-FPGA configuration in telecom and networking line cards, industrial vision and signal processing platforms, and military/aerospace systems requiring field-upgradable firmware. The 724-ball BGA package also supports high-density designs that may configure multiple FPGAs on the same board.
When designing with the EP2A25F724, ensure correct nCONFIG/nSTATUS handshaking with the target FPGA, adequate decoupling near the BGA power balls, and verification of JTAG chain ordering when multiple devices are cascaded. Note that the APEX II family is mature - confirm long-term availability with your distributor or Intel FPGA support for new designs.
This page synthesizes verified distributor pricing, package details, and a curated set of pin-compatible Altera EPC drop-in alternatives not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2A25F724 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F724 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, RoHS Status, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPC2TC32N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.2 / Unit
View Datasheet →EP2A15F672I8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$680 / Unit
View Datasheet →EP2A25F672I8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$125 / Unit
View Datasheet →EP2A25F672C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$700 / Unit
View Datasheet →EP2A25F672C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$118 / Unit
View Datasheet →EP2A25F6T218
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$62 / Unit
View Datasheet →EP2A25F724 Maximum Ratings & Electrical Characteristics
| Device Type | Enhanced Configuration Device (EPC) |
| Target FPGA Family | Altera APEX II (EP2A-series) |
| Memory Technology | Flash (non-volatile, no battery required) |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync |
| Package | 724-ball FineLine BGA |
| JTAG Support | IEEE Std. 1149.1 (boundary-scan / ISP) |
| Multi-Device Configuration | Yes - supports daisy-chained APEX II FPGAs |
| In-System Programmability | Yes (via JTAG) |
| On-chip Oscillator | Yes (internal configuration clock) |
| User Flash Region | Yes (separate from configuration data) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lifecycle Status | Not Recommended for New Designs (NRND) - Altera acquired by Intel 2015 |
EP2A25F724 Pin Configuration
| Pin B1 | VCC — Core supply voltage |
| Pin B2 | GND — Ground reference |
| Pin C1 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin C2 | TMS — JTAG test mode select |
| Pin D1 | TDI — JTAG test data in |
| Pin D2 | TDO — JTAG test data out |
| Pin E1 | nCONFIG — Configuration control input from FPGA |
| Pin E2 | nSTATUS — Configuration status output to FPGA |
| Pin F1 | CONF_DONE — Configuration complete indicator |
| Pin F2 | DCLK — Configuration clock output to FPGA |
| Pin G1 | DATA0 — Configuration data output (passive serial / parallel) |
Typical Applications
EP2A25F724 is suitable for 6 applications: APEX II FPGA Boot Memory, Multi-FPGA Configuration Chains, Telecom and Networking Line Cards, Industrial Vision and Signal Processing, Military and Aerospace Embedded Systems, Legacy FLEX FPGA Boot Support.
APEX II FPGA Boot Memory
The EP2A25F724 is purpose-built to store configuration bitstreams for the Altera APEX II EP2A25 FPGA, providing single-chip non-volatile boot without a backup battery. Its 25-Mbit-class flash array matches the EP2A25's largest bitstream size, while the integrated configuration controller handles compression, decompression, and error detection during FPGA load. In a typical design the EPC sits on the same PCB as the target FPGA, with DCLK, DATA, nCONFIG, nSTATUS, and CONF_DONE lines wired directly between them. Using the EPC eliminates external PROMs and reduces BOM cost, board area, and configuration time versus discrete flash plus CPLD solutions. Engineers benefit from JTAG-based in-system programmability that allows field firmware upgrades without removing the device, and from Altera's passive serial and passive parallel configuration mode support that enables compatibility with both APEX II and legacy FLEX FPGAs.
Recommended
Multi-FPGA Configuration Chains
The EP2A25F724 supports Altera's passive serial and passive parallel configuration protocols, allowing a single EPC to sequentially configure multiple APEX II FPGAs in a daisy chain. This is essential in telecom line cards, high-channel-count signal processing systems, and industrial vision platforms where several FPGAs must load in lockstep. By centralizing bitstream storage in one EPC, the design reduces total flash footprint, simplifies JTAG chain ordering for boundary-scan testing, and shortens configuration time compared to per-FPGA PROMs. Engineers should verify nCONFIG and nSTATUS handshaking timing across the chain, and confirm that the EPC's flash capacity is sufficient for the sum of all target bitstreams. The 724-ball BGA package also provides ample I/O for direct connect to multiple FPGA configuration ports.
Recommended
Telecom and Networking Line Cards
Telecom and networking line cards often use Altera APEX II FPGAs for high-throughput packet processing, and the EP2A25F724 serves as the central non-volatile boot device for these platforms. Its industrial-grade operating range, JTAG in-system programmability, and support for field firmware updates make it suitable for carrier-grade equipment where remote provisioning and reliability are required. The 724-ball FineLine BGA package supports high-density PCB layouts common in ATCA and AdvancedMC line-card form factors. Integrating the EPC with the FPGA reduces system-level power consumption versus discrete configuration solutions, and the on-chip oscillator removes the need for an external configuration clock source. For new designs, engineers should also consider Intel Cyclone or Arria FPGA families that offer longer lifecycle support.
Recommended
Industrial Vision and Signal Processing
Industrial machine vision and DSP platforms leverage APEX II FPGAs for parallel pixel processing and the EP2A25F724 provides a reliable single-chip configuration source. The EPC's flash-based storage is resistant to shock, vibration, and temperature extremes encountered on factory floors, and its JTAG ISP support allows production-line reprogramming of camera and sensor processing algorithms. Designers pair the EPC with high-speed ADC/DAC front ends and DDR memory buffers to build complete vision pipelines. The 724-ball BGA offers sufficient I/O for direct connection to the FPGA's passive parallel configuration bus, enabling fast multi-Mbit bitstream load at power-up. For new designs, industrial-grade temperature variants and AEC-Q-style reliability testing should be verified with the manufacturer.
Recommended
Military and Aerospace Embedded Systems
Military and aerospace embedded systems often rely on the Altera APEX II family for radiation-tolerant signal processing, and the EP2A25F724 supports these applications by providing non-volatile configuration storage that retains bitstreams through power cycles. Its in-system programmability via JTAG enables field upgrades in deployed systems, while the 724-ball BGA package supports ruggedized PCB assemblies. The EPC's flash memory eliminates battery-backed SRAM, removing a common failure mode in long-lifecycle military programs. Engineers should review Altera/Intel FPGA derating guidelines for radiation environments and confirm the EPC's extended temperature variants meet program requirements. For new aerospace designs, consider Altera/Intel Stratix or comparable rad-hard FPGAs with modern configuration devices.
Recommended
Legacy FLEX FPGA Boot Support
Beyond APEX II, the EP2A25F724 retains backward compatibility with the Altera FLEX 10K and FLEX 6000 FPGA families via the passive serial and passive parallel configuration interfaces. This makes the EPC a useful migration tool for systems that combine newer APEX II devices with legacy FLEX logic on the same board. The EPC's flash storage consolidates multiple bitstreams into a single non-volatile device, simplifying inventory and programming flow. Engineers extending the life of installed FLEX-based equipment can use the EP2A25F724 as a unified configuration source, taking advantage of its larger flash capacity and JTAG ISP to support both old and new bitstreams without redesigning the boot subsystem.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F724 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPC2TC32N | EP2A25F672I8 | EP2A25F672C9 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 724-ball FineLine BGA | 32-ball BGA | 672-ball FineLine BGA | 672-ball FineLine BGA |
| Device Family | EPC2 / APEX II | EPC2 | EPC2 / APEX II | EPC2 / APEX II |
| Target FPGA | EP2A25 APEX II | APEX II family | EP2A25 APEX II | EP2A25 APEX II |
| Configuration Interface | Passive Serial / Passive Parallel | Passive Serial / Passive Parallel | Passive Serial / Passive Parallel | Passive Serial / Passive Parallel |
| JTAG ISP Support | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) | Yes (IEEE 1149.1) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Pre-sized bitstream storage for EP2A25 APEX II (vs EPC2TC32N)
- 724-ball BGA supports highest-density PCB layouts (vs EP2A25F672I8)
- Single-chip non-volatile boot solution (vs Discrete flash + CPLD boot PROM)
Design Notes
Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy chain with no stubs. Place a 33 ohm series resistor near the EPC's JTAG balls to damp reflections on long traces. Decouple every VCC/GND ball pair with a 0.1uF X7R ceramic capacitor placed within 5mm of the ball; add a 10uF bulk capacitor near the package for transient suppression during FPGA configuration.
Verify nCONFIG/nSTATUS handshaking timing between the EP2A25F724 and the target APEX II FPGA before PCB layout. The EPC drives nSTATUS low during power-up and releases it once configuration data is valid; the FPGA must see this transition within the datasheet's t_CFG window. Failure to respect this timing causes intermittent boot failures that often appear only at cold-start or low temperature.
The 724-ball FineLine BGA requires blind or buried vias if routing on inner layers. Use microvia stack-ups (e.g., 4-2-4) to fan out the inner-row balls. Keep DCLK trace length-matched to DATA0 within 100 mil to avoid setup/hold violations on the FPGA configuration port. Maintain a continuous ground plane under the BGA for return-current integrity.
Compliance Information
RoHS and lead-free compliant per Altera/Intel product documentation. Not AEC-Q100 qualified (configuration memory, not automotive-grade part). NRND status: Altera acquired by Intel in 2015; APEX II family not recommended for new designs.
