EP20K60ETC144-3 - APEX 20KE FPGA, 92 I/O, 144-LQFP | Intel
MPN: EP20K60ETC144-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.1 | $421.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $31.2 | $15,600.00 |
| 1,000 | $26.8 | $26,800.00 |
EP20K60ETC144-3 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that lets engineers implement arbitrary digital logic via a configurable array of logic elements (LEs), embedded memory blocks (ESBs), and routing resources. The APEX 20KE series specifically pioneered MultiCore integration of look-up table logic, embedded system blocks (ESBs for memory), and product-term blocks on a single die, fitting between pure CPLDs and modern high-density FPGAs. EP20K60ETC144-3 parts are well-known for low-power 1.8 V core operation, in-system programmability via JTAG, and broad Quartus II / MAX+PLUS II toolchain support.
Key features of EP20K60ETC144-3 include 2,560 logic elements, 32,768 bits of embedded SRAM, 196 maximum user I/Os (package-limited to 92 in the 144-LQFP), and a maximum internal frequency of 160 MHz to 182 MHz depending on measurement method. The device supports multi-voltage I/O standards including LVTTL, LVCMOS, PCI, SSTL-2/3, and LVDS via dedicated I/O banks. It also includes built-in clock lock loops (analog PLLs) for clock conditioning.
The APEX 20KE architecture combines four types of resources - LABs (Logic Array Blocks), ESBs (Embedded System Blocks for memory), MegaLAB structures, and FastTrack interconnect - to deliver a balance of register-rich logic, distributed SRAM, and predictable timing. The '-3' speed grade makes this part the lowest-cost option, ideal for telecom line cards, industrial controllers, and legacy networking equipment where 100 MHz+ operation is not required.
Typical applications include telecommunications line interface cards, industrial automation controllers, legacy networking routers and switches, low-density DSP front-ends, and PCI bus interface glue logic. The 144-LQFP package supports hand-soldering and rework, making it attractive for prototype and low-volume production.
When designing with this device, ensure 1.8 V core decoupling uses at least four 0.1 µF ceramic capacitors placed near the VCC pins. All unused I/O pins should be configured as tri-stated inputs with weak pull-ups in software to minimize power consumption. Note: this device is in the Intel/Altera legacy product portfolio; verify lifecycle status before committing to new designs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet - giving engineers a one-stop reference for sourcing and designing the EP20K60ETC144-3.
Drop-in alternatives for EP20K60ETC144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K60ETC144-3 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Family, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K60ETC144-3N
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP20K60ETC144-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152 / Unit
View Datasheet →EP20K60ETC144-2X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$51.8 / Unit
View Datasheet →EP20K60ETC144-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65 / Unit
View Datasheet →EP20K60ETC144-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152 / Unit
View Datasheet →EP20K60ETC144-3 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | APEX 20KE |
| Logic Elements | 2,560 |
| Embedded Memory (RAM bits) | 32,768 |
| Maximum User I/O Pins (device) | 196 |
| User I/O Pins (this package) | 92 |
| Package | 144-LQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 160 MHz to 182 MHz |
| Propagation Delay | 1.72 ns |
| Operating Temperature | 0 °C to 85 °C (TJ) |
| Speed Grade | -3 |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2/3, LVDS |
| Configuration Interface | JTAG (IEEE 1149.1) |
| Total Package Pins | 144 |
EP20K60ETC144-3 144 Pin Configuration Guide
Pin configuration for EP20K60ETC144-3 (144 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K60ETC144-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K60ETC144-3 is suitable for 7 applications: Telecommunications Line Cards, Industrial Automation Controllers, Legacy Networking Routers and Switches, Low-Density DSP Front-End Logic, PCI Bus Interface Glue Logic, Print Engine and Imaging Controllers, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K60ETC144-3 fits telecommunications line cards because its 2,560 logic elements and 32,768 bits of embedded SRAM are sufficient for T1/E1 framers, HDLC controllers, and low-density channel aggregation logic at legacy telecom data rates. The device's 92 user I/Os in the 144-LQFP package expose ample connectivity for parallel bus interfaces to framer ASICs, while the MultiCore architecture lets designers mix register-rich glue logic with small FIFO buffers in a single chip. The 1.8 V core voltage is also a good match for 1990s/2000s-era telecom backplane voltage rails, and the JTAG interface supports in-system reconfiguration during card bring-up.
Recommended
Industrial Automation Controllers
The EP20K60ETC144-3 suits industrial automation controllers because it integrates 2,560 logic elements, embedded SRAM, and analog PLLs on a single die, eliminating the need for a separate CPLD plus memory chips in PLC and motion controller designs. Its 92 user I/Os in the 144-LQFP package support multi-axis servo interfaces, encoder inputs, and parallel field-bus glue logic. The Quartz II / MAX+PLUS II toolchain is mature and well-supported, and the device's 0 °C to 85 °C operating temperature covers factory-floor environments. The hand-solderable LQFP package also simplifies prototyping and rework.
Recommended
Legacy Networking Routers and Switches
The EP20K60ETC144-3 is commonly deployed in legacy routers and switches because its 2,560 logic elements and 32 kbits of embedded SRAM match the requirements of 10/100 Mbps Ethernet MAC controllers, packet classifiers, and QoS queuing engines. The 144-LQFP package provides 92 user I/Os to bridge between PHY chips, TCAMs, and network processors via standard LVTTL/LVCMOS busses. APEX 20KE devices were a workhorse for early-2000s routing platforms, and many of those platforms remain in service in Tier-2/3 ISP and enterprise networks. The NRND status requires careful lifecycle planning for spares inventory.
Recommended
Low-Density DSP Front-End Logic
The EP20K60ETC144-3 works in DSP front-end pre-processing because its parallel fabric can implement FIR filters, FFT butterfly networks, and sample-rate converters at audio bandwidths below the 100 MHz Nyquist limit. The embedded SRAM blocks (ESBs) provide efficient coefficient storage for adaptive filters, and the dedicated PLL generates the high-speed sample clock from a low-frequency reference. With 92 I/Os, the device bridges between ADCs, DACs, and downstream DSP processors via standard parallel interfaces. The 1.8 V core voltage and CMOS process deliver predictable low-noise operation for sensitive analog signal chains.
Recommended
PCI Bus Interface Glue Logic
The EP20K60ETC144-3 is well-suited as PCI bus interface glue logic because it supports the 3.3 V PCI signaling standard via its programmable I/O banks and provides the register-rich logic needed for target/initiator state machines. Its 92 user I/Os cover a full 32-bit PCI bus plus side-band signals (REQ#, GNT#, INTA#) plus auxiliary peripheral interfaces. The 2,560 logic elements and 32 kbits of embedded SRAM are sufficient for small buffer FIFOs and configuration space registers. APEX 20KE devices were a popular PCI interface solution in the late 1990s and early 2000s.
Recommended
Print Engine and Imaging Controllers
The EP20K60ETC144-3 fits print engine and imaging controller designs because its parallel logic fabric can drive laser scan motors, paper transport steppers, and high-speed video datapaths at the rates required for mid-volume office printers. The embedded SRAM provides line-buffer storage for raster image processing, and the 92 I/Os handle parallel video buses and motor control signals simultaneously. The 144-LQFP package is preferred for printer controllers because the 0.5 mm pitch and gull-wing leads are compatible with standard SMT lines used in printer manufacturing.
Recommended
Test and Measurement Instrumentation
The EP20K60ETC144-3 is used in legacy test and measurement instruments because its combination of register-rich logic, embedded SRAM, and analog PLLs allows a single chip to implement custom trigger circuits, timing generators, and small capture buffers. The JTAG interface simplifies boundary-scan test integration, and the parallel fabric can implement IEEE 488 (GPIB) controllers and serial instrument buses. The 144-LQFP package is convenient for instrument backplane cards where moderate I/O count and through-hole-compatible SMT footprints are required.
Recommended
Recommended Products Summary
Engineering reference data for EP20K60ETC144-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K60ETC144-3N | EP20K60ETC144-1 | EP20K60ETC144-2X | EP20K60ETC144-2N | EP20K60ETC144-1X |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Speed Grade | -3 (slowest) | -3 (slowest) | -1 (fastest) | -2 (mid-tier) | -2 (mid-tier) | -1 (fastest) |
| Logic Elements | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 |
| Embedded SRAM | 32,768 bits | 32,768 bits | 32,768 bits | 32,768 bits | 32,768 bits | 32,768 bits |
| User I/O Pins | 92 | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 °C to 85 °C (TJ) | 0 °C to 85 °C (TJ) | 0 °C to 85 °C (TJ) | Extended screening | 0 °C to 85 °C (TJ) | Extended screening |
| Relative Cost | 1.00x (baseline) | ~1.00x (Pb-free) | ~1.25x (faster grade) | ~1.12x (mid speed, ext temp) | ~1.08x (mid speed) | ~1.30x (fastest, ext temp) |
Key Differentiators
- Lowest-cost speed grade in the APEX 20KE family (vs EP20K60ETC144-1)
- Hand-solderable 144-LQFP package vs BGA alternatives (vs EP20K60EFC144-2)
- Mature Quartus II / MAX+PLUS II toolchain (vs Cyclone IV EP4CE6)
Design Notes
Decouple the EP20K60ETC144-3 core supply (VCCINT, 1.71 V to 1.89 V nominal 1.8 V) with at least four 0.1 µF ceramic capacitors placed within 5 mm of the VCCINT pins on the package perimeter. Add a single bulk 47 µF to 100 µF tantalum or low-ESR ceramic capacitor near the package for transient suppression during configuration. Each VCCIO bank should also have its own 0.1 µF decoupling capacitor if multiple I/O voltage standards (LVTTL, LVCMOS, PCI, SSTL) are mixed on the same device. Insufficient decoupling is the most common cause of JTAG configuration failures on APEX 20KE designs.
The 144-LQFP package has 0.5 mm lead pitch and 20 mm x 20 mm body size. Use 4 mil (0.1 mm) trace-and-space rules for escape routing from the inner leads, and reserve at least 8 mil (0.2 mm) clearance between adjacent leads to support post-reflow inspection. A continuous ground plane on layer 2 is essential for the high-speed I/O banks (LVDS and SSTL); signal return paths must not cross plane splits. JTAG chain routing should keep TCK, TMS, TDI, and TDO matched within ±5 mm to avoid configuration timing violations.
Do not confuse the EP20K60E (APEX 20KE) part number with the original EP20K60 (APEX 20K). The 20KE variant adds LVDS I/O support and improved PLL performance, but the bitstream formats are NOT compatible between the two families. Also note that Quartus II support for APEX 20KE is provided only through legacy versions (Quartus II 13.0 and earlier); MAX+PLUS II is required for designs targeting older APEX 20KE tool flows. Unused I/O pins should always be configured as tri-stated inputs with weak pull-ups in the Quartus pin assignment file to minimize power consumption.
Differential I/O pairs (LVDS) must be routed with 100 Ω differential impedance and matched lengths within ±0.5 mm to maintain signal integrity. The PLL analog supply pins (VCC_PLL) require their own filtered supply rail - a ferrite bead plus 10 µF + 0.1 µF capacitor network is recommended to isolate PLL noise from the digital core. Clock input pins (CLK[0..3]) should be routed with controlled 50 Ω impedance and guarded by ground traces on both sides. Configuration-related pins (nCONFIG, nSTATUS, CONF_DONE) require 10 kΩ pull-ups to VCCIO for stable operation during power-up.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not stated in verified web data; refer to manufacturer datasheet or Intel product compliance declarations for authoritative values. Not AEC-Q100 qualified - this is a commercial-grade FPGA.
