EP2A40B724C9ES - 1.5M-Gate 366MHz FPGA | Intel
MPN: EP2A40B724C9ES ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2A40B724C9ES Overview
A field-programmable gate array, or FPGA, is a semiconductor device containing configurable logic blocks, routing resources, and programmable input/output structures. The FPGA hierarchy proceeds from configurable logic block to programmable logic device, programmable logic array, and ultimately to an integrated circuit used in digital system design. Unlike a fixed ASIC, an FPGA can be configured after manufacturing, making it suitable for evolving requirements, prototyping, production equipment, and applications where field updates are valuable. Intel represents the MPN in verified results as both an Altera-origin APEX II FPGA and an Intel programmable-logic product.
The headline characteristics are 1.5 million gates, 38,400 cells, and a 366 MHz rating. The 1.5 million-gate figure indicates aggregate programmable logic capacity, while the 38,400-cell count provides a more direct device-resource indicator. The 0.15 µm process technology identifies the fabrication generation used for the APEX II family, and the 1.5 V supply indicates the part's core electrical operating point. The 724-pin FCBGA package supplies the high pin count required by a large programmable device and a dense surface-mount interconnection scheme.
Within an FPGA architecture, configurable logic resources implement combinational and sequential functions, while programmable interconnects connect those functions and the I/O subsystem. Design software maps a hardware description or supported design entry into the device's configuration resources. Performance depends on the implemented logic, interconnect utilization, I/O timing, and power conditions; therefore, the 366 MHz figure is best interpreted as a published device characteristic rather than a guarantee for every possible design.
Typical uses include communications equipment, industrial automation, test and measurement systems, and embedded digital-control platforms. The APEX II family can be appropriate when a design needs programmable interfaces, custom state machines, protocol handling, or parallel digital processing. The 1.5 million-gate and 38,400-cell resources provide substantial capacity for systems that would otherwise require multiple fixed-function components.
Designers should verify configuration hardware, supported software versions, I/O assignments, clocking, power sequencing, thermal performance, and signal integrity against the manufacturer documentation before release. The legacy APEX II platform may impose migration and obsolescence-management considerations; use current authorized Intel support channels and the manufacturer datasheet before starting a new design.
This page combines the verified web specification record, sourcing context, package information, and cautious engineering guidance to help engineers assess EP2A40B724C9ES without treating unverified values as confirmed facts.
Drop-in alternatives for EP2A40B724C9ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724C9ES (same form factor and footprint) — differing in Package, Process Technology, Series, System Gates, Propagation Delay.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP2A40B724C9ES Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | APEX II |
| Gate Count | 1.5 M gates |
| Logic Cell Count | 38400 cells |
| Operating Frequency | 366 MHz |
| Process Technology | 0.15 um |
| Supply Voltage | 1.5 V |
| Package | 724-pin FCBGA |
| Package Technology | Flip Chip Ball Grid Array |
| Mounting Type | Surface Mount |
| Pin Count | 724 pins |
| Programmable Logic Type | FPGA |
| Logic Capacity | 1.5 M gates |
| Core Voltage Rating | 1.5 V |
| Technology Node | 0.15 um |
EP2A40B724C9ES flip chip ball grid array Pin Configuration Guide
Pin configuration for EP2A40B724C9ES (flip chip ball grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724C9ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724C9ES is suitable for 6 applications: Industrial Automation Controllers, Communications and Protocol Equipment, Test and Measurement Systems, Embedded Digital-Control Platforms, Legacy Digital System Maintenance, Custom Parallel Interface Logic.
Industrial Automation Controllers
EP2A40B724C9ES can serve as configurable control logic in industrial automation equipment where custom timing, interface handling, and state-machine functions are required. The verified APEX II capacity of 1.5 million gates and 38,400 cells provides substantial programmable resources for sequencing, sensor aggregation, actuator control, and machine-level communications. The 366 MHz published rating supports consideration for fast digital control and data movement, although actual timing depends on the implemented design and routing. The 1.5 V supply must be integrated with the board power architecture, and the 724-pin FCBGA package requires controlled high-density PCB layout. Engineers should confirm industrial temperature grading, I/O standards, configuration support, and lifecycle availability with Intel before selecting this legacy part for a new controller.
Recommended
Communications and Protocol Equipment
EP2A40B724C9ES is a candidate for communications equipment requiring custom framing, protocol conversion, channel monitoring, or parallel interface logic. Its 38,400 cells and 1.5 million-gate rating provide room for multiple digital functions in one programmable device, while the 366 MHz characteristic can support consideration of high-speed control and transport paths. The part is not a substitute for a dedicated transceiver or interface PHY, and the supplied data does not verify supported I/O standards or transceiver resources. A board design should use the manufacturer pinout to assign clocks, data buses, control signals, and configuration connections. Verify signal-integrity constraints, power sequencing, software compatibility, and long-term availability before using this legacy APEX II device in production communications hardware.
Recommended
Test and Measurement Systems
EP2A40B724C9ES can be evaluated for test and measurement systems that need programmable stimulus generation, synchronized acquisition control, data formatting, or deterministic digital sequencing. The published 1.5 million-gate capacity and 38,400 cells allow a design to combine control logic, counters, state machines, and interface functions while retaining configurability. The 366 MHz rating is useful for preliminary performance planning, but system throughput is limited by the selected I/O, clocking, board layout, and design timing closure. Because the supplied record does not specify operating temperature, I/O count, or configuration interface, those items remain [DATA_NEEDED]. Use the complete manufacturer documentation before assigning sensitive measurement signals or selecting this part for a new instrument platform.
Recommended
Embedded Digital-Control Platforms
EP2A40B724C9ES may fit embedded digital-control platforms that require custom peripherals, deterministic control loops, and reconfigurable system interfaces. Its 1.5 million-gate and 38,400-cell resources are suitable for combining control, glue logic, and communication functions, while the 1.5 V supply calls for careful power-tree design. The 366 MHz rating supports high-speed digital implementation planning, but it does not establish guaranteed timing for a particular configuration. The 724-pin FCBGA package can accommodate a substantial I/O and power interface, yet ball assignments must come from the verified manufacturer pinout. Before a new embedded design is released, confirm supported design software, configuration method, clock resources, I/O electrical limits, thermal behavior, and the current Intel lifecycle position.
Recommended
Legacy Digital System Maintenance
EP2A40B724C9ES is especially relevant to maintenance and spare-part planning for installed equipment that already uses the APEX II architecture. The device's 1.5 million gates, 38,400 cells, and 366 MHz published rating describe a substantial legacy programmable platform, while the 724-pin FCBGA package identifies the physical interface that must be preserved in replacement boards. A maintenance design should prioritize form, fit, function, configuration compatibility, and approved firmware or bitstream support rather than selecting a newer FPGA solely because it has more logic. Source traceability, date-code control, and change notification are important for obsolete or scarce components. The supplied web results do not provide current stock or lead time, so procurement must obtain a live supplier confirmation before committing to a build or repair schedule.
Recommended
Custom Parallel Interface Logic
EP2A40B724C9ES can implement custom parallel interfaces between processors, memories, converters, and application-specific peripherals. The 38,400-cell resource count supports combinational and sequential logic for data mapping, buffering, arbitration, and timing generation, while the 1.5 million-gate rating indicates significant aggregate capacity. The 366 MHz device rating helps guide preliminary clock planning, but interface performance also depends on I/O electrical characteristics, package escape, transmission-line effects, and the selected memory or peripheral. The 724-pin FCBGA package is a high-density surface-mount solution and should be laid out with controlled impedance, continuous reference planes, and verified ball assignments. The supplied data does not list I/O count or standards, so those parameters remain [DATA_NEEDED] and must be resolved from the manufacturer datasheet.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724C9ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724C9 | EP2A40B724C8ES | EP2A40B724C7ES |
|---|---|---|---|---|
| Package | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA |
| Brand | Intel | Intel | Intel | Intel |
| Family | APEX II | APEX II | APEX II | APEX II |
| Pin Count | 724 pins | 724 pins | 724 pins | 724 pins |
Key Differentiators
- High-density APEX II logic capacity (vs EP2A40B724C8ES)
- Published high-frequency device rating (vs EP2A40B724C7ES)
- Large 724-pin FCBGA interface (vs EP2A40B724C8ES)
Design Notes
Start the power design from the verified 1.5 V supply listing, but do not assume it is the only required rail. The supplied data does not provide I/O-voltage limits, auxiliary-rail requirements, current ratings, or power-up sequencing. Obtain the manufacturer datasheet and calculate regulator load, tolerance, transient response, and decoupling requirements. Place local decoupling close to the device supply balls, use a continuous reference plane, and keep high-current switching paths away from sensitive clock and configuration signals. Treat any current or power-dissipation estimate as an engineering estimate until it is confirmed by the manufacturer data.
The 724-pin FCBGA package requires a verified ball map before PCB implementation. Use the manufacturer pinout rather than deriving signal names from the package image. Confirm the complete escape routing, layer stack-up, via arrangement, impedance targets, and return-path continuity for high-speed clocks and data. Keep the ball-pad and escape geometry within the package-design rules, and review differential-pair length matching if the selected I/O interface uses differential signaling. The supplied data does not include the public pinout, so the pinout field is null and a complete ball-assignment record is required before layout release.
Use the 366 MHz device rating for preliminary architecture planning, not as a substitute for timing analysis. Evaluate clock distribution, setup and hold margins, I/O delay, package parasitics, crosstalk, and board-level termination in the implemented design. Simulate the selected interface corner cases and confirm whether the intended I/O voltage and standard are supported. The verified web data does not identify the I/O count or supported I/O standards, so those parameters remain [DATA_NEEDED]. Validate configuration-clock integrity and provide appropriate clock-source accuracy because configuration and user logic can have different timing requirements.
A high-density FPGA can require careful thermal analysis even when the core supply is listed as 1.5 V. Estimate power using the actual design utilization, clock rates, toggle activity, I/O loading, and configured logic, then apply the manufacturer thermal model and package boundary conditions. Use a multilayer PCB with an appropriate copper-spread strategy where the design rules allow it, and confirm junction and ambient temperature limits. The supplied data does not provide operating temperature or thermal-resistance values, so no junction-temperature result is presented. Treat any thermal estimate as an estimate and verify the final calculation against the complete manufacturer documentation.
Compliance Information
No compliance statements were included in the supplied verified web data. Compliance fields are therefore unknown rather than inferred. AEC-Q100 is recorded as not applicable because no automotive qualification claim was supplied.
