EP2A40B724C7N - APEX II 1.5M Gates FPGA, 724-Pin FCBGA | Intel/Altera
MPN: EP2A40B724C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $220 | $22,000.00 |
| 250 | $198 | $49,500.00 |
| 500 | $175 | $87,500.00 |
EP2A40B724C7N Overview
An FPGA is a reprogrammable digital integrated circuit whose logic function is defined by user configuration rather than fixed mask interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and are differentiated from CPLDs by their register-rich, fine-grained architecture, on-chip block RAM, dedicated DSP/multiplier blocks, and high-speed transceivers. The APEX II family targeted high-performance, gate-intensive designs including networking line cards, telecom bridges, and ASIC prototyping.
Key specifications of the EP2A40B724C7N include 1.5M system gates, 38,400 logic cells, 536 user I/O, 1.5 V core supply, 0.15 um CMOS process, 1.55 ns propagation delay, 562 MHz internal performance, and 724-pin FCBGA packaging. The MACROCELL output function and LOADABLE PLD classification confirm its APEX II family membership, with embedded system blocks (ESBs) providing RAM and ROM functions configurable per design.
Architecturally, the APEX II device combines lookup-table-based logic elements (LEs) with embedded system blocks that operate as dual-port RAM or content-addressable memory. The 1.5 V VCCINT supply and 0.15 um process were state of the art when the APEX II family launched, enabling lower dynamic power than earlier 0.18 um APEX devices while sustaining the family's high I/O count. The 724-pin FCBGA package supports the 536 I/O lines plus configuration, clock, and power pins.
Typical applications include high-speed networking line cards, telecommunications bridges, ASIC prototyping and emulation, high-performance DSP pipelines, and legacy industrial control platforms. The 1.5M gates and 536 I/O lines make the EP2A40B724C7N well suited to designs that must aggregate multiple buses or implement wide datapaths.
When designing with this legacy device, engineers should verify that the Altera Quartus II design tool (version supporting APEX II) is available and that any required IP cores have not been removed from current Quartus releases. The 0.15 um process and 1.5 V core imply careful power-plane design and decoupling, and the BGA package requires X-ray inspection during assembly.
This page synthesizes distributor pricing, lifecycle status, and drop-in alternative notes that are not collated on any single manufacturer or distributor page, providing a consolidated reference for engineers maintaining or sourcing APEX II designs.
Drop-in alternatives for EP2A40B724C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724C7N (same form factor and footprint) — differing in Package, Process Technology, Series, System Gates, Core Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724C7
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2A40B724C7ES
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2A40B724C7N Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Series | EP2A40 |
| Device Type | FPGA (Loadable PLD) |
| System Gates | 1.5 M |
| Logic Cells / Elements | 38,400 |
| Maximum Internal Performance | 562 MHz |
| Propagation Delay | 1.55 ns |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| User I/O Lines | 536 |
| Package | 724-pin FCBGA (PBGA) |
| JESD-30 Package Code | S-PBGA-B724 |
| Terminal Count | 724 |
| Output Function | MACROCELL |
| Operating Temperature Range | 0 C to 85 C (commercial) |
| Mounting Type | Surface Mount (BGA) |
EP2A40B724C7N s-pbga-b724 Pin Configuration Guide
Pin configuration for EP2A40B724C7N (s-pbga-b724 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724C7N is suitable for 6 applications: High-Speed Networking Line Cards, Telecommunications Bridges and Aggregators, ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Legacy Industrial Control Platforms, Military and Aerospace Avionics (Legacy).
High-Speed Networking Line Cards
The EP2A40B724C7N's 1.5 million system gates and 536 user I/O lines make it a strong fit for early-2000s networking line cards that aggregate multiple Gigabit Ethernet ports or implement packet-processing pipelines. The 562 MHz internal performance and 1.55 ns propagation delay support high-speed datapath logic, while the 724-pin FCBGA package provides the pin density required for wide external bus interfaces. Unlike a CPLD-based design, this FPGA scales to full custom forwarding engines with on-chip memory. Designers should target Altera Quartus II APEX II device support and verify IP availability.
Recommended
Telecommunications Bridges and Aggregators
Telecom bridge designs of the APEX II era require wide datapath aggregation, multiple clock domains, and embedded memory for cell/packet buffering - all of which the EP2A40B724C7N delivers. The 38,400 logic cells implement TDM-to-packet conversion logic, while the embedded system blocks (ESBs) provide dual-port RAM for FIFO queues. The 1.5 V core reduces dynamic power versus the older APEX 0.18 um parts in always-on central-office deployments. Unlike an ASIC, the FPGA allows late-stage protocol updates via JTAG reconfiguration, critical for evolving telecom standards.
Recommended
ASIC Prototyping and Emulation
The EP2A40B724C7N's 1.5M gates and high I/O count make it useful as an ASIC prototyping vehicle for mid-complexity designs targeting 0.15 um or 0.18 um ASIC processes. Multiple EP2A40 devices can be arrayed on a logic-emulation board with high-speed backplane interconnects to validate ASIC RTL before tape-out. The 1.55 ns propagation delay approximates expected ASIC gate delay, improving timing correlation. Unlike CPLD-based prototyping, the FPGA supports full RTL synthesis with Quartus II and provides realistic place-and-route feedback ahead of the ASIC flow.
Recommended
High-Performance DSP Pipelines
DSP designs benefit from the EP2A40B724C7N's 38,400 logic elements and embedded system blocks that can be configured as multipliers or RAM. The 562 MHz internal frequency supports high-sample-rate FIR filters and FFT pipelines, while the 536 I/O lines accommodate wide parallel ADC/DAC interfaces. Unlike a fixed-function DSP processor, the FPGA implements custom arithmetic pipelines tuned per design. The 1.5 V core reduces power in thermally constrained embedded DSP applications.
Recommended
Legacy Industrial Control Platforms
Long-lifecycle industrial platforms - factory automation controllers, CNC machine interfaces, and railway signaling - rely on the EP2A40B724C7N's mature, well-characterized APEX II silicon for deterministic real-time logic. The 536 I/O lines aggregate many sensors and actuators, and the 1.55 ns propagation delay supports deterministic control-loop timing. Unlike modern FPGAs, the APEX II toolchain is well understood by long-tenured industrial engineering teams, simplifying safety re-certification on existing platforms.
Recommended
Military and Aerospace Avionics (Legacy)
Older avionics and military systems use the EP2A40B724C7N for high-density control and signal-processing logic where long-term configuration stability and traceability outweigh modern feature requirements. The 1.5 V core and 0.15 um process deliver predictable radiation-tolerance behavior well documented in legacy Altera reliability reports. Unlike newer SRAM-based FPGAs, the APEX II has multi-decade field history in deployed platforms. Note that new military designs should evaluate radiation-hardened modern alternatives; the EP2A40 is typically a sustainment/aftermarket part.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724C7 | EP2A40B724C7ES | EP2A40B652C9 | EP2A40B652C8 | EP2A40B652C7 |
|---|---|---|---|---|---|---|
| Package | 724-pin FCBGA | 724-pin FCBGA - same | 724-pin FCBGA - same | 652-pin FCBGA - different footprint | 652-pin FCBGA - different footprint | 652-pin FCBGA - different footprint |
| Brand | Intel (formerly Altera) | Intel/Altera - same | Intel/Altera - same | Intel/Altera - same | Intel/Altera - same | Intel/Altera - same |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Cells / Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | C7 | C7 - same | C7 - same | C9 - slower | C8 - slower | C7 - same |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same silicon die with full pin-to-pin compatibility (vs EP2A40B724C7)
- Same 724-pin FCBGA with extended screening (vs EP2A40B724C7ES)
- Lower cost at slower speed grade, same die (vs EP2A40B652C9)
Design Notes
Estimated: at 1.5 V core and 562 MHz operation, the EP2A40B724C7N can dissipate 3 W to 5 W depending on toggle rate and utilization. With the FCBGA package theta_JA typically in the 15 C/W to 25 C/W range (JEDEC test board), a 4 W dissipation produces a 60 C to 100 C junction temperature rise above ambient. For sustained operation, use at least a 4-layer PCB with a continuous ground plane beneath the BGA, and consider a small heat spreader for high-utilization designs. Verify final thermal performance with a thermocouple measurement on the package top.
The 724-pin FCBGA package requires a 4-layer (minimum) PCB with matched impedance routing for high-speed signals. Use 0.5 mm or 0.8 mm ball pitch BGA land patterns exactly per the Altera APEX II package specification, and assign at least one continuous ground plane directly beneath the BGA for return-current paths. Decoupling must include 0.1 uF X7R ceramics within 2 mm of every power pin and 10 uF bulk capacitors per VCCINT island. X-ray inspection after reflow is mandatory because BGA solder joints cannot be visually inspected.
The APEX II family is end-of-life and the latest Altera/Intel Quartus II versions may have removed device support. Before starting a new design, verify the installed Quartus II version explicitly supports the EP2A40 device family (older Quartus II service packs retain APEX II support, but current Quartus Prime editions do not). Also confirm that any required IP cores (memory controllers, transceivers) are still available in the chosen tool version; otherwise, lock in the legacy toolchain via license and archive the install media.
Match length on high-speed differential pairs to within 0.127 mm (5 mil) to preserve signal integrity. Assign I/O banks carefully because the APEX II has multiple I/O supply rails (VCCIO) supporting different voltage standards; mixing SSTL and LVTTL in the same bank is not allowed. Consult the EP2A40B724C7N pinout file for bank assignments and reserve the global clock pins (CLK0..CLK3) for primary clocks only.
Compliance Information
RoHS compliance and lead-free terminal finish indicated by the 'N' suffix in EP2A40B724C7N per standard Altera/Intel naming convention. REACH, halogen-free, and conflict-minerals status not explicitly stated in verified web data; set to 'unknown'. AEC-Q100 not applicable for FPGAs.
