EP2A40B724C9 - APEX II 40K LE FPGA, 540 I/O, 724-BGA | Altera (Intel)
MPN: EP2A40B724C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $500.4893 | $500.49 |
| 10 | $480.47 | $4,804.70 |
| 50 | $455.45 | $22,772.50 |
| 100 | $425.42 | $42,542.00 |
| 250 | $395.38 | $98,845.00 |
EP2A40B724C9 Overview
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also includes CPLDs. Within the IC hierarchy, an FPGA sits between a microcontroller (sequential, software-driven) and a custom ASIC (fixed-function, masked): FPGAs deliver hardware-level parallelism with the flexibility of in-system reconfiguration.
Key features of the EP2A40B724C9 include up to 1,600 Kbits of True Dual-Port RAM, MultiVolt I/O support for interfacing with 1.5V, 1.8V, 2.5V, and 3.3V logic families, and a core voltage of 1.5V (operating supply 1.425V to 1.575V). The 540 user I/O count makes it well-suited for memory-rich applications, ASIC prototyping, and parallel DSP pipelines.
The APEX II architecture combines Look-Up Table (LUT)-based logic with embedded memory blocks, supporting both single-port and true dual-port RAM. The high I/O count and large embedded memory footprint distinguish the EP2A40 from smaller density siblings such as the EP2A15 and EP2A25 variants.
Typical applications include ASIC prototyping, telecommunications line cards, parallel DSP processing pipelines, image processing front-ends, and high-bandwidth memory interfaces. The 540 I/O count and 655,360 embedded RAM bits specifically suit designs that require wide external memory buses or multi-channel data acquisition.
When designing with this device, note that the 35x35 mm FCBGA package requires multi-layer PCB with controlled-impedance routing and via-in-pad assembly for signal integrity at high toggle rates. Plan thermal dissipation around the typical 1.5W to 3W core power envelope.
This page synthesizes distributor pricing, same-family APEX II drop-in alternatives, and practical BGA layout guidance not found in the manufacturer datasheet.
Drop-in alternatives for EP2A40B724C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724C9 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Logic Elements, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B724C8
✅ Drop-In✓ In Stock
$615 / Unit
View Datasheet →EP2A40B724C7
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP2A40B652C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92.4 / Unit
View Datasheet →EP2A40B724C9 Maximum Ratings & Electrical Characteristics
| Series | APEX II |
| Logic Elements (LE) | 38,400 |
| Embedded RAM Bits | 655,360 (approximately 655 Kbits / 80 Kbytes) |
| Number of User I/O | 540 |
| Operating Supply Voltage | 1.425 V to 1.575 V (core) |
| MultiVolt I/O Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Package / Case | 724-BBGA, FCBGA (Flip-Chip BGA) |
| Supplier Device Package | 724-BGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C |
| Shipping Medium | Tray |
| Architecture | LUT-based with embedded memory blocks |
EP2A40B724C9 724-bga (35x35 mm) Pin Configuration Guide
Pin configuration for EP2A40B724C9 (724-bga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724C9 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecommunications Line Cards, Parallel DSP Processing Pipelines, High-Bandwidth Image Processing Front-Ends, Industrial Parallel Control Systems, Legacy Aerospace and Defense Avionics.
ASIC Prototyping and Emulation
The EP2A40B724C9 is well-suited to ASIC prototyping because its 38,400 logic elements can absorb large portions of an ASIC netlist while the 655,360 embedded RAM bits (approximately 80 Kbytes) provide realistic memory model buffering without forcing designers to map every FIFO off-chip. The 540 user I/O pins let prototype boards expose wide external buses and parallel verification ports. The MultiVolt I/O controllers on this Altera APEX II device mean the FPGA can be connected to 3.3V, 2.5V, 1.8V, or 1.5V ASIC pads simultaneously. Unlike a custom ASIC, the design can be re-programmed in-system to iterate logic bugs in hours rather than weeks.
Recommended
Telecommunications Line Cards
Telecommunications line cards use the EP2A40B724C9 because of its high I/O count of 540 pins, which allows routing of parallel TDM buses, multi-channel SERDES interfaces, and control plane I/O simultaneously. The 1.5V core operates within typical line card power budgets of 2 to 4W, while the MultiVolt I/O bank configuration allows direct connection to legacy 3.3V framer and PHY devices. The 655,360 embedded RAM bits provide sufficient on-chip buffering for packet queues without external SSRAM. The Altera APEX II architecture supports True Dual-Port RAM, simplifying ingress and egress FIFO design.
Recommended
Parallel DSP Processing Pipelines
Parallel DSP pipelines benefit from the EP2A40B724C9 because its 38,400 logic elements can be partitioned into hundreds of multiply-accumulate units operating concurrently, while the 655,360 embedded RAM bits hold coefficient tables and intermediate results close to the datapath. The 540 user I/O count supports wide external memory interfaces (e.g., ZBT SRAM or DDR banks) needed to feed multi-channel pipelines. The 1.5V core voltage of this Altera APEX II part minimizes switching power in dense DSP fabrics compared to older 2.5V cores.
Recommended
High-Bandwidth Image Processing Front-Ends
Image processing front-ends use the EP2A40B724C9 because the 540 I/O count accepts wide parallel LVDS or CMOS sensor interfaces and feeds the 38,400 logic elements running pipeline stages of pixel processing, color conversion, and histogram accumulation. The 655,360 embedded RAM bits buffer full image lines or tile regions on-chip, eliminating the latency of off-chip SDRAM access. The Altera APEX II 724-BGA package exposes enough pins for both the sensor input bank and the DDR2/QDR memory interface bank.
Recommended
Industrial Parallel Control Systems
Industrial parallel control systems deploy the EP2A40B724C9 because its 540 user I/O can address hundreds of GPIO lines, encoder inputs, or PWM outputs simultaneously without external bus expanders. The MultiVolt I/O supports 24V-tolerant interfacing through external transceivers, and the 0C to +85C operating range covers factory floor environments. The 655,360 embedded RAM bits of this Altera APEX II FPGA allow multiple PID control loops to be implemented in firmware while holding set-point and telemetry history on-chip.
Recommended
Legacy Aerospace and Defense Avionics
Aerospace and defense programs with long lifecycles continue to use the EP2A40B724C9 because the APEX II family has been qualified into numerous existing platforms and re-designing with a modern FPGA would require re-qualification of the entire system. Rochester Electronics supports the part as a franchised long-term source, reducing obsolescence risk for these programs. The 540 user I/O and 38,400 LE handle radar preprocessing, navigation computation, or display driving workloads typical in these platforms. The Altera APEX II 724-BGA package is already designed into the platform PCB.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B724C8 | EP2A40B724C7 | EP2A40B652C9 |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 724-BGA (FCBGA, 35x35 mm) | 724-BGA (FCBGA, 35x35 mm) - same | 724-BGA (FCBGA, 35x35 mm) - same | 652-BGA (FineLine BGA) |
| Logic Elements | 38,400 LE | 38,400 LE - identical | 38,400 LE - identical | 38,400 LE - identical |
| Embedded RAM Bits | 655,360 bits | 655,360 bits - identical | 655,360 bits - identical | 655,360 bits - identical |
| User I/O Count | 540 | 540 - identical | 540 - identical | 493 (652-BGA) |
| Speed Grade | C9 (fastest) | C8 (-1 grade) | C7 (-2 grades) | C9 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest I/O count in the APEX II family (vs EP2A25B724C9)
- C9 speed grade for tightest timing margin (vs EP2A40B724C7)
- Largest 724-BGA variant with full RAM (vs EP2A40B652C9)
Design Notes
The 724-ball FCBGA (35x35 mm) package requires multi-layer PCB (typically 8 to 12 layers) with 1.0 mm ball pitch and via-in-pad assembly. Use a high-Tg (170C+) PCB material such as Isola FR408HR to survive reflow. Escape routing from the inner row balls must use staggered microvias (laser-drilled) since through-hole vias cannot reach the inner pad rows without violating antipad clearance. Maintain continuous reference planes under the BGA for controlled-impedance signal return paths.
Estimated: At a core voltage of 1.5V, the EP2A40B724C9 consumes approximately 1.5 to 3W typical core power depending on utilization and toggle rate. With the FCBGA 35x35 mm package, theta_JA is approximately 10 to 15 C/W on a standard JEDEC 4-layer test board, producing a 15C to 45C junction temperature rise. A thermal pad or heatsink is recommended if utilization exceeds 70% or if ambient temperature is above 60C. Derate by 1 C per 100m above 1.5V nominal.
Do not assume that the APEX II architecture supports in-system programming via JTAG for production code without configuring the configuration controller - APEX II uses passive serial or parallel configuration with a dedicated controller, not native JTAG-driven bitstream loading for production code. Also note that Quartus II design files from older versions may not import cleanly into newer Quartus releases; keep the original Quartus II version with the project. Plan for supply-chain obsolescence by stocking at least 12 months of inventory.
Group MultiVolt I/O banks carefully: each I/O bank on the EP2A40B724C9 has its own VCCIO supply rail and supports 1.5V/1.8V/2.5V/3.3V. Place decoupling capacitors (100nF X7R per bank pin pair, plus a bulk 10uF per VCCIO bank) directly under the BGA landing pads using the bottom-side capacitor mounting technique. Use length-matched traces within each bus group; skew budgets of +/-50 ps per byte lane are typical for LVDS interfaces to this Altera APEX II device.
Compliance Information
Compliance status not present in verified web data for the EP2A40B724C9. AEC-Q100 not applicable since this is a commercial-grade FPGA. Use [DATA_NEEDED] markers until compliance certificates are obtained from the distributor.
