Altera

EP2A40F672I7 - APEX II 1.5M Gates FPGA, 672-pin FC-FBGA | Intel/Altera

MPN: EP2A40F672I7 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss 672-ball FC-FBGA Package 562 MHz Speed
From $185 USD / Unit
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Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $256 $2,560.00
100 $228 $22,800.00
500 $205 $102,500.00
1,000 $185 $185,000.00
ℹ️ All prices are in USD

EP2A40F672I7 Overview

The Intel/Altera EP2A40F672I7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), delivering 1.5M system gates, 38,400 logic elements, and a 562 MHz core frequency in a 672-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. Manufactured on a 0.15 µm CMOS process, this device operates from a 1.5 V core supply and is specified for the industrial temperature range (-40 °C to +85 °C) as indicated by the 'I' speed-grade suffix. The '7' suffix denotes a 7-device speed grade pin-compatible with other speed grades in the EP2A40F672 family.

An FPGA is a reprogrammable semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than by the silicon vendor. APEX II sits in the FPGA taxonomy between traditional CPLDs (low density, glue logic) and high-end SoC FPGAs (multi-million LE with hardened CPUs). Within the broader programmable logic hierarchy, APEX II -> SRAM-based FPGA -> programmable logic -> semiconductor. Its reprogrammability, high pin count, and embedded MultiCore architecture made it popular for telecom line cards, baseband processing, and high-speed data-path prototyping in the early 2000s.

Key features of the EP2A40F672I7 include embedded MultiCore blocks combining lookup tables and product-term logic, a high-bandwidth MultiCore interconnect fabric, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, LVDS), and a configurable JTAG-based configuration port. The APEX II architecture combines fine-grain LUTs with coarse-grain Embedded System Blocks (ESBs) to balance logic density and arithmetic performance.

The 672-ball FC-FBGA package exposes 8 dedicated clock inputs, up to 24 user I/O banks, and a high pin density suitable for dense PCB escape routing. Multiple speed grades are available: -6 (fastest), -7, -8, and -9 (slowest). EP2A40F672I7 is the industrial-temperature speed-grade 7 variant.

Typical applications include telecommunications line interfaces, DSP co-processing, high-speed bus bridging, and legacy industrial control systems that require drop-in compatibility with other EP2A40 F672-pin FPGAs.

Designers should provide a stable 1.5 V core and a separate I/O VCCIO rail (3.3 V or 2.5 V typical), follow Altera's JTAG configuration guidelines, and observe the 220 °C peak reflow temperature limit required by the FC-FBGA's MSL-3 moisture sensitivity rating.

This page synthesizes distributor availability, pin-compatible speed-grade alternatives, and lifecycle observations not consolidated in the original APEX II datasheet.

Drop-in alternatives for EP2A40F672I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2A40F672I7 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Operating Temperature, Operating Temperature Grade.

Intel
Speed Grade: 7
Package: 672-pin FC-FBGA
Operating Temperature Grade: Industrial (-40C to +100C)
Compare with EP2A40F672I7 →
Intel
Package: 672-ball FC-FBGA (FineLine BGA)
Process Technology: 0.15 µm CMOS, all-layer copper, up to 8 metal layers
Operating Temperature Grade: Commercial (per 'C' suffix in speed grade)
Compare with EP2A40F672I7 →
Intel
Speed Grade: 7
Package: 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch
Process Technology: 0.15 µm CMOS, all-layer copper, up to 8 metal layers
Compare with EP2A40F672I7 →
Intel
Speed Grade: C9 (~1.55 ns propagation delay)
Package: BGA-672 (27 x 27 mm, 1.0 mm pitch)
Process Technology: 0.15 µm all-layer copper, up to 8 metal layers
Compare with EP2A40F672I7 →
Intel
Speed Grade: -8
Package: 672-pin FC-FBGA
Process Technology: 0.15 µm
Compare with EP2A40F672I7 →
Intel
Speed Grade: -9
Package: 672-pin FC-FBGA (Fine-pitch Ball Grid Array)
Operating Temperature: -40 °C to +100 °C (Industrial)
Compare with EP2A40F672I7 →
Altera
Speed Grade: I8 (industrial temperature, mid performance)
Package: 672-ball FC-FBGA (Fine-pitch Chip-Scale BGA)
Process Technology: 0.15 um
Compare with EP2A40F672I7 →
Altera
Speed Grade: 8
Package: 672-pin FC-FBGA
Process Technology: 0.15 micrometer
Compare with EP2A40F672I7 →
Intel
Package: 672-pin FC-FBGA
Operating Temperature Grade: Industrial (I)
Compare with EP2A40F672I7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2A40F672I-8

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FC-FBGA
APEX II · APEX II (EP2A) · 1.5 M · 38,400 · 0.15 µm · 1.5 V · 376 MHz · 672-pin FC-FBGA

✓ In Stock

$125 / Unit

View Datasheet →

EP2A40F672I-9

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FC-FBGA
APEX II · EP2A40 · 38,400 · 1,500,000 · 366 MHz · 0.15 µm CMOS · 1.5 V · 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked)

✓ In Stock

$165 / Unit

View Datasheet →

EP2A40F672C9N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FC-FBGA
APEX II · EP2A40 · 1,500,000 · 38,400 · 492 · BGA-672 (27 x 27 mm, 1.0 mm pitch) · FC-FBGA / PBGA672

✓ In Stock

$295 / Unit

View Datasheet →

EP2A40F672C8N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FC-FBGA
APEX II · EP2A40 · CMOS · 1.5 M · 38,400 · 376 MHz · 1.55 ns · 0.15 µm

✓ In Stock

$122 / Unit

View Datasheet →

EP2A40F672C7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 672-ball FC-FBGA
APEX II · 38,400 · 1.5 M · 492 · 1.55 ns · 562 MHz · 0.15 µm CMOS, all-layer copper, up to 8 metal layers · 1.5 V

✓ In Stock

$198 / Unit

View Datasheet →

EP2A40F672I7 Maximum Ratings & Electrical Characteristics

Family APEX II
Logic Elements 38,400
Maximum System Gates 1,500,000
Core Voltage (VCCINT) 1.5 V
Process Technology 0.15 µm CMOS
Core Frequency (max) 562 MHz
Operating Temperature -40 °C to +85 °C (Industrial)
Package 672-ball FC-FBGA
Package Family Fine-pitch Chip-scale BGA
Mounting Type Surface Mount
Speed Grade -7 (speed grade 7)
Moisture Sensitivity Level (MSL) 3
Peak Reflow Temperature 220 °C
Configuration Method JTAG / Passive Serial / Active Serial
RoHS Status unknown

EP2A40F672I7 fine-pitch chip-scale bga Pin Configuration Guide

Pin configuration for EP2A40F672I7 (fine-pitch chip-scale bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

fine-pitch chip-scale bga package pinout diagram for EP2A40F672I7

No detailed pinout data available for EP2A40F672I7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2A40F672I7 is suitable for 6 applications: Telecommunications Line-Card Aggregation, Legacy DSP Co-Processor / FIR Accelerator, High-Speed Bus Bridge and Protocol Converter, Legacy Industrial Control and SCADA, Telecom Backplane Cross-Point Switch, Aerospace and Defense Avionics (Legacy).

🌐

Telecommunications Line-Card Aggregation

The EP2A40F672I7's 1.5M system gates and 38,400 logic elements are well-matched to telecom line-card aggregation duties, where multiple E1/T1 or STM-1 framers, HDLC controllers, and traffic-management state machines must coexist on a single programmable device. The 562 MHz core frequency gives the design enough headroom for high-rate crosspoint switching and packet-classification pipelines. The 672-ball FC-FBGA exposes sufficient user I/O to terminate multi-port PHY interfaces (MII, RMII, GMII, POS-PHY Level 2/3) without external bus muxing. Industrial -40 °C to +85 °C operation (the 'I' suffix) lets the line card populate outdoor cabinets and central-office frames without derating. The MultiCore interconnect fabric and Embedded System Blocks provide deterministic timing for time-division multiplexed backplane traffic.

🖥️

Legacy DSP Co-Processor / FIR Accelerator

The APEX II MultiCore architecture integrates dedicated multiplier chains and Embedded System Block memories that the EP2A40F672I7 can instantiate as parallel FIR filters, FFT butterflies, and image-processing pipelines. At 562 MHz core frequency the device sustains multi-tap FIR throughput sufficient for video-rate DSP front-ends and software-defined radio baseband channels. The 0.15 µm CMOS process node gives balanced power and timing margins at 1.5 V VCCINT, allowing fanless operation with copper-pour-only heatsinking. Industrial temperature rating allows direct deployment in factory-floor DSP controllers and ruggedized signal-conditioning equipment. Designers typically pair the EP2A40F672I7 with external SRAM for coefficient storage and a host processor for control sequencing.

🔧

High-Speed Bus Bridge and Protocol Converter

Bus-bridging glue logic between legacy PCI/PMC interfaces and modern processors is a classic APEX II use case. The EP2A40F672I7's 672-ball FC-FBGA exposes enough user I/O to terminate a 64-bit PCI bus alongside a parallel RapidIO or POS-PHY interface, with the MultiCore fabric arbitrating between masters without external muxes. Industrial temperature grading permits deployment in factory automation and military vetronics chassis where commercial-only FPGAs fail reliability screens. The 1.5M-system-gate capacity absorbs full protocol stacks including DMA engines, scatter-gather descriptor controllers, and interrupt concentrators. Quartus II place-and-route produces predictable timing closure thanks to deterministic MultiCore routing.

🏭

Legacy Industrial Control and SCADA

Long-life industrial control platforms built around APEX II continue to operate in chemical, power, and transportation infrastructure. The EP2A40F672I7's industrial -40 °C to +85 °C operating range, 1.5 V regulated core, and 562 MHz timing margin suit deterministic PLC scanning, SCADA telemetry aggregation, and redundant controller supervision tasks. The 672-ball FC-FBGA package supports dense I/O expansion including differential RS-485, isolated 24 V digital inputs, and pulse-counter chains. Its obsolete lifecycle status is offset by long-term reliability records spanning two decades of installed base. Maintenance and refurbishment of these systems is the primary 2026 use case for the EP2A40F672I7.

🌐

Telecom Backplane Cross-Point Switch

The MultiCore interconnect fabric of the EP2A40F672I7 makes it well-suited for non-blocking crosspoint switches that route STS-1/STM-1 and STS-3/STM-3 streams across redundant backplanes. With 1.5 M system gates the device can switch hundreds of serial lanes in parallel and provide embedded diagnostics for BER monitoring, alarm generation, and protection-switching state machines. Industrial temperature rating ensures operation in uncontrolled central-office environments. The 672-ball FC-FBGA allows high pin-count LVDS links to multiple line cards without external transceivers. Quartus II timing closure is reliable across the -7 speed grade at 562 MHz.

✈️

Aerospace and Defense Avionics (Legacy)

Many avionics and defense subsystems designed in the early 2000s continue to operate using APEX II FPGAs, including flight-control test equipment, radar signal pre-processors, and secure-communication modems. The EP2A40F672I7's industrial temperature range and deterministic MultiCore routing make it acceptable for many non-flight-critical ground and lab environments. The 672-ball FC-FBGA supports the high I/O density demanded by parallel ADC/DAC interfaces and discrete digital control lines. Obsolescence management and DMSMS (Diminishing Manufacturing Sources and Material Shortages) programs drive 2026 demand for verified inventory of this part.

What family of FPGA is the EP2A40F672I7?
The EP2A40F672I7 is a member of the Altera APEX II family of SRAM-based FPGAs. According to the APEX II datasheet (DS-APEX2), the device integrates 38,400 logic elements, Embedded System Blocks (ESBs) for memory and product-term logic, and a MultiCore interconnect fabric on a 0.15 µm CMOS process. APEX II was the high-density follow-on to APEX 20K and predates the Stratix family in Altera's product roadmap.
How many system gates does EP2A40F672I7 provide?
The EP2A40F672I7 provides up to 1,500,000 (1.5 M) system gates. According to the Altera APEX II datasheet, system gates include all LUT-based logic, ESB-based logic, and memory resources the device can implement when fully utilized, making this part suitable for high-density logic aggregation and data-path integration tasks.
What is the maximum core frequency of EP2A40F672I7?
The maximum internal core frequency of the EP2A40F672I7 is rated at 562 MHz per the APEX II datasheet. This figure represents the maximum toggle / internal-operating speed available in the -7 speed grade; achievable fMAX for a given user design depends on routing, logic utilization, and the Quartus timing-analyzer closure report.
What package does the EP2A40F672I7 use?
The EP2A40F672I7 is housed in a 672-ball Fine-pitch Chip-scale BGA (FC-FBGA). According to the APEX II device handbook, the FC-FBGA offers the highest signal count of any APEX II package, exposes 8 dedicated clock input pins, multiple VCCINT/VCCIO power/ground balls, and supports MultiCore high-speed I/O standards including LVDS.
What is the core voltage of EP2A40F672I7?
The EP2A40F672I7 operates from a 1.5 V VCCINT core supply, characteristic of the APEX II family's 0.15 µm process node. According to the APEX II datasheet, VCCINT must be regulated within ±5% with a high-frequency decoupling network (typically 0.1 µF + 10 µF per supply ball group) to meet the 562 MHz timing closure.
What temperature range does EP2A40F672I7 support?
The 'I' suffix designates the EP2A40F672I7 for the industrial temperature range of -40 °C to +85 °C junction temperature. This is one step warmer than commercial (0 °C to +70 °C) and one step cooler than the military-grade variant, making the part suitable for factory-floor, outdoor telecom, and automotive under-hood-adjacent applications.
Where can I buy the EP2A40F672I7?
The EP2A40F672I7 is available from authorized obsolete-component distributors including Partstack, Vyrian, Jotrin Electronics, Octopart-listed brokers, and Digiode, as listed in current distributor listings. As of 2026-09-08, factory-direct Altera/Intel stock is unavailable; pricing ranges roughly $185-$285 per unit depending on quantity, reel date code, and inspection level (commercial, industrial, or military).
What is the price of EP2A40F672I7?
EP2A40F672I7 pricing as of 2026-09-08 starts at approximately $285 for single-piece quantities and decreases to roughly $185 at 1,000-piece volumes through obsolete-stock distributors. Premium pricing reflects the part's obsolete status; authenticated date codes and -40 °C to +85 °C industrial screening typically command higher prices than commercial-grade equivalents.
What is the lead time for EP2A40F672I7?
Lead time for EP2A40F672I7 as of 2026-09-08 varies from immediate shipment to 8-12 weeks, depending on the distributor's on-hand stock, reel date code availability, and inspection-level requirement. Brokers quoting lots that have been re-inspected for industrial temperature compliance often extend lead times to 6-8 weeks for full traceability documentation.
Is the EP2A40F672I7 obsolete?
Yes, the EP2A40F672I7 is listed as obsolete across major distributor databases. Altera/Intel discontinued the APEX II family years ago in favor of Stratix, Cyclone, and later Agilex families. Current sourcing is limited to obsolete-component brokers; long-term production or new design-in is not supported by the manufacturer.
EP2A40F672I7 vs EP2A40F672I-8 — which is faster?
The EP2A40F672I7 is faster than the EP2A40F672I-8 because Altera's speed-grade numbering convention assigns lower numbers to higher performance. The -7 device has a higher fMAX rating than the -8 device at the same VCCINT and temperature. Both share the same 672-ball FC-FBGA footprint and are drop-in pin-compatible within the same temperature grade, so choose -7 for speed-critical designs and -8 when -7 inventory is unavailable.
What is the best drop-in replacement for EP2A40F672I7?
The best drop-in replacement for the EP2A40F672I7 in the same 672-ball FC-FBGA footprint is the EP2A40F672I-8 (slower speed grade, identical pinout, same industrial temperature range). When EP2A40 inventory is exhausted, modern pin-compatible migration targets include Stratix EP1S40F672 (different die, requires Quartus re-synthesis) and Cyclone families, both requiring PCB revalidation.
Can I replace EP2A40F672I7 with EP2A40F672I-9?
Yes, the EP2A40F672I-9 is pin-compatible with the EP2A40F672I7 in the same 672-ball FC-FBGA package and industrial temperature grade. The -9 suffix denotes a slower speed grade; timing closure must be re-verified in Quartus. The two parts are bit-for-bit configuration compatible only when the user design meets both fMAX budgets, otherwise timing violations may appear in the slower -9 device.
Where to download the EP2A40F672I7 datasheet PDF?
The official Altera APEX II datasheet (document DS-APEX2) can be downloaded from Altera's legacy product literature archive or from Intel's MySupport (after free registration). Third-party mirrors are also available on FPGAkey, Jotrin, and Partstack product pages. The datasheet contains electrical characteristics, pinout tables, package drawings, and configuration timing specifications.
Where to find the EP2A40F672I7 pinout?
The EP2A40F672I7 pinout is documented in Chapter 7 of the APEX II Device Handbook and in the device pin-out files (.pin) distributed with the Quartus II design software. Each of the 672 FC-FBGA balls is assigned to a user I/O bank, VCCINT/VCCIO, GND, JTAG, or dedicated clock input. Consult the pin-out table for the F672 package variant to map ball coordinates to logical pin names.
What are the key specifications of EP2A40F672I7 that engineers should know?
The EP2A40F672I7 integrates 38,400 logic elements and up to 1.5 million system gates on a 0.15 µm CMOS process, runs a 1.5 V VCCINT core, supports up to 562 MHz internal operation in the -7 speed grade, and packs all of this into a 672-ball FC-FBGA with 8 dedicated clock inputs. Per the APEX II datasheet, MSL-3 moisture handling and a 220 °C peak-reflow profile are required during PCB assembly. Industrial -40 °C to +85 °C operation is designated by the 'I' suffix.

Engineering reference data for EP2A40F672I7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2A40F672I7 when your design requires 1.5 M system gates in a 672-ball FC-FBGA, the highest available -7 speed grade at industrial temperature, and a multi-decade installed base of APEX II tooling. Choose EP2A40F672I-8 or EP2A40F672I-9 when EP2A40F672I7 inventory is exhausted and timing closure fits within their reduced fMAX budgets — both share the same FC-FBGA footprint and pinout, requiring no PCB rework. Choose EP2A40F672C7N only for commercial-temperature lab or development environments. For greenfield designs, consider migrating to Cyclone, Stratix, or Agilex families, as APEX II is obsolete and supported only through third-party obsolete-component brokers.

Comparison with Alternatives

Parameter This Product EP2A40F672I-8 EP2A40F672I-9 EP2A40F672C9N EP2A40F672C8N EP2A40F672C7N
Brand Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel)
Package 672-ball FC-FBGA 672-ball FC-FBGA (same) 672-ball FC-FBGA (same) 672-ball FC-FBGA (same) 672-ball FC-FBGA (same) 672-ball FC-FBGA (same)
Speed Grade -7 -8 (slower) -9 (slowest) -9 -8 -7
Temperature Grade Industrial (-40 to +85 C) Industrial (-40 to +85 C) Industrial (-40 to +85 C) Commercial (0 to +70 C) Commercial (0 to +70 C) Commercial (0 to +70 C)
Logic Elements 38,400 38,400 (same) 38,400 (same) 38,400 (same) 38,400 (same) 38,400 (same)
System Gates (max) 1.5 M 1.5 M 1.5 M 1.5 M 1.5 M 1.5 M
Core Voltage (VCCINT) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
MSL 3 3 3 3 3 3

Key Differentiators

  • Industrial temperature screening on -7 speed grade (vs EP2A40F672C7N)
  • Highest fMAX among APEX II F672-pin industrial variants (vs EP2A40F672I-9)
  • Same package footprint as APEX 20K600 family (vs EP20K600CF672)

Design Notes

Estimated: APEX II static power at 1.5 V VCCINT and 25 °C junction for a fully populated EP2A40F672I7 is typically 1.5 W, with dynamic power scaling linearly with toggle rate up to several watts at 562 MHz fMAX. The 672-ball FC-FBGA requires a minimum 8-layer PCB stack-up with continuous inner ground planes to spread heat. For designs consuming more than 3 W sustained, attach a small copper heatsink or 2 oz copper pour directly under the BGA footprint. Keep junction temperature below 125 °C for industrial-grade reliability.

The 672-ball FC-FBGA uses 1.0 mm ball pitch; PCB escape routing requires microvia or via-in-pad technology on 4-layer stack-ups. Per Altera layout guidelines, place 0.1 µF and 10 µF decoupling capacitors within 100 mils of every VCCINT/VCCIO ball group. Maintain at least 4 ground balls per power ball for return-path integrity. MSL-3 handling requires dry-pack assembly within 168 hours of bag opening, otherwise rebake at 125 °C for 24 hours prior to reflow at the 220 °C peak profile.

Do not assume any APEX II speed grade can be swapped blindly: -7 to -8 to -9 each step reduces fMAX by roughly 15%, which can break timing closure. Verify Quartus II fMAX reports for every clock domain after substitution. JTAG configuration requires VCCIO bank 1 powered before nCONFIG toggles, otherwise configuration fails silently. Pin-compatible commercial-grade ('C' suffix) variants must NOT be used where industrial ('I' suffix) parts are specified — junction-temperature behavior diverges at the -40 °C lower bound and 85 °C upper bound.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance data not published in verified web sources for this obsolete Altera/Intel FPGA. APEX II family predates RoHS-6 directive enforcement in many Altera part numbers, so historical lead-free status cannot be confirmed.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EP2A40F672I7 APEX II FPGA Field Programmable Gate Array FC-FBGA Fine-pitch Chip-scale Ball Grid Array system gates logic element Embedded System Block MultiCore interconnect Quartus II JTAG VCCINT VCCIO 0.15 µm CMOS 1.5 V core supply Industrial temperature grade MSL-3 RoHS AEC-Q100 Stratix Cyclone configuration bitstream
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