EP2A40F672C9 - APEX II FPGA 1.5M Gates 38400 Cells 672-BGA | Altera
MPN: EP2A40F672C9 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.5 | $34,250.00 |
| 1,000 | $62 | $62,000.00 |
EP2A40F672C9 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic through SRAM-based configuration cells. FPGAs sit hierarchically above CPLDs and below ASICs in the programmable logic taxonomy, and the APEX II family is positioned as a high-density, embedded-multiplier-rich variant that bridged telecom, networking, and DSP prototyping workloads in the early-2000s generation of programmable logic.
Key features of the EP2A40F672C9 include support for 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards, embedded memory blocks, embedded multipliers, and a maximum toggle performance in the 366 MHz range. The FineLine BGA-672 footprint exposes 492 user I/O pins, providing the channel density required for parallel bus interfaces and high-speed serial links. Operating temperature is graded for commercial use from 0 °C to 85 °C.
Architecturally, the APEX II device combines LAB (Logic Array Block) structures with embedded system blocks (ESBs) for dual-port RAM and ROM, and dedicated multiplier blocks optimized for DSP filter pipelines. The 0.15-µm process delivers high logic density while the 1.5 V core minimizes dynamic power for the gate count, and the eight-metal stackup enables efficient routing of wide buses.
Typical applications include telecom line-card prototyping, high-speed serial backplane bridging, DSP co-processing, bus-width conversion glue logic, and ASIC prototyping. The 672-ball BGA package and 1.5 V core also suit legacy designs migrated from earlier APEX 20K families that need additional gate capacity and faster I/O standards.
When designing with this device, plan power sequencing for the 1.5 V core and I/O bank supplies separately, and follow Altera's BGA layout guidelines for 1 mm-pitch FineLine packages to ensure reliable solder joint integrity through thermal cycling.
This page synthesizes distributor pricing, verified same-package alternatives in the APEX II family, and practical design notes not found in the original APEX II datasheet (DS-APEXII-3.0). It is intended as an engineering reference for sourcing, replacement, and lifecycle planning.
Drop-in alternatives for EP2A40F672C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F672C9 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F672C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$122 / Unit
View Datasheet →EP2A40F672C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$68 / Unit
View Datasheet →EP2A40F672C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP2A40F672C7ES
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$124.75 / Unit
View Datasheet →EP2A40F672C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP2A40F672C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165 / Unit
View Datasheet →EP2A40F672C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$105 / Unit
View Datasheet →EP2A40F672C9 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Device Family | APEX II PLD |
| Logic Elements / Cells | 38,400 |
| System Gates | 1.5 M |
| Macros | 2,560 |
| User I/Os | 492 |
| Number of Pins | 672 |
| Package | 672-BBGA, FC-FBGA (FineLine) |
| Package Size | 27 mm × 27 mm, 1 mm ball pitch |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers |
| Logic Family | CMOS |
| Propagation Delay | 1.55 ns |
| Internal Speed Grade | 366 MHz |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport |
| Mounting Type | Surface Mount |
EP2A40F672C9 27 mm × 27 mm, 1 mm ball pitch Pin Configuration Guide
Pin configuration for EP2A40F672C9 (27 mm × 27 mm, 1 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F672C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F672C9 is suitable for 6 applications: Telecom Line-Card Prototyping, DSP Co-Processor Pipeline, ASIC Prototyping and Emulation, Bus-Width Conversion Glue Logic, Industrial Control and Automation Backplane, Legacy Test and Measurement Instrumentation.
Telecom Line-Card Prototyping
The EP2A40F672C9's 1.5M system gates and 38,400 logic cells deliver sufficient density to prototype telecom line cards that aggregate TDM, Ethernet, and ATM traffic. The 492 user I/Os exposed by the 672-ball BGA provide ample parallel bus capacity for backplane interfacing. Per the Altera APEX II datasheet, support for 1 Gbps True-LVDS, LVPECL, and HyperTransport I/O standards enables direct connection to high-speed serial backplane transceivers without external glue logic. Designers can implement framer, mapper, and cross-connect functions entirely in the FPGA while deferring ASIC tape-out decisions. The 366 MHz internal toggle rating at the C9 speed grade meets the timing budgets of most telecom backplane designs.
Recommended
DSP Co-Processor Pipeline
The EP2A40F672C9's embedded multiplier blocks and embedded system blocks (ESBs) make it a strong fit for DSP co-processing pipelines alongside a host CPU or DSP chip. The APEX II family integrates dedicated multiplier structures optimized for FIR filters, FFT butterflies, and multiply-accumulate chains. Per Altera's APEX II datasheet, 1.5 V core operation minimizes dynamic power in long DSP pipelines running at 366 MHz. The 38,400 logic cells support wide datapath routing around the multiplier array, while the 492 user I/Os enable direct connection to external memory buses (DDR, QDR SRAM). This combination suits radar, software-defined radio, and audio processing prototyping where throughput per watt matters.
Recommended
ASIC Prototyping and Emulation
The EP2A40F672C9 serves as an effective ASIC prototyping and emulation vehicle thanks to its 1.5M gate capacity and SRAM-based configuration. Engineers can map multi-million-gate ASIC RTL onto a network of APEX II devices for early software bring-up and verification. Per Altera's APEX II family datasheet, the device's high logic density and 366 MHz timing at the C9 grade allow emulation at near-ASIC speed for many designs. The 672-ball FineLine BGA package also supports JTAG-based configuration chaining across multiple FPGAs on a single emulation board. This use case remains common for legacy ASICs whose migration to modern Arria or Stratix devices would otherwise force re-validation of the entire RTL.
Recommended
Bus-Width Conversion Glue Logic
The EP2A40F672C9 is well-suited to bus-width and protocol conversion glue logic between mismatched legacy buses. Its 492 user I/Os comfortably host parallel interfaces spanning 32-bit, 64-bit, and wider buses, while embedded system blocks can implement FIFOs, dual-port RAM, and timing skew buffers. Per the Altera APEX II datasheet, the device supports multiple I/O standards simultaneously, enabling direct interfacing between TTL, LVCMOS, LVDS, and LVPECL domains without external translators. The 1.5 V core plus per-bank I/O voltages let the device sit between 3.3 V legacy ASICs and modern 1.8 V processors. Many industrial and medical designs still rely on APEX II glue for legacy bus bridging.
Recommended
Industrial Control and Automation Backplane
The EP2A40F672C9's commercial temperature grade (0 °C to 85 °C) and 492 user I/Os suit industrial control and automation backplane designs where deterministic logic and many physical interfaces are required. Programmable logic in industrial systems aggregates sensor buses, drives actuator PWM, and implements safety interlocks. Per the Altera APEX II datasheet, the 0.15-µm copper process and 1.5 V core deliver high logic density without the power penalty of older processes, which matters in densely populated PLC chassis. The 672-ball FineLine BGA package also simplifies mechanical layout for IP67-rated industrial enclosures where component density is high. Designs can be re-spin-reconfigured in the field by updating the SRAM configuration bitstream.
Recommended
Legacy Test and Measurement Instrumentation
The EP2A40F672C9 supports legacy test and measurement instrumentation that demands flexible I/O and embedded DSP blocks. Function generators, logic analyzers, and protocol testers often use high-density programmable logic to implement reconfigurable measurement paths. Per the Altera APEX II datasheet, the device's True-LVDS, LVPECL, and PCML I/O support lets it directly probe signals at sub-nanosecond edge rates. The 366 MHz C9 timing enables on-chip counters, timers, and pattern generators to operate in real time. Many legacy T&M instruments shipped in the 2000s used APEX II devices, and this part remains useful for board-level repair and clone manufacture of those instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F672C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F672C8N | EP2A40F672C8 | EP2A40F672C7N | EP2A40F672C7ES | EP2A40F672C7 | EP2A40F672C6N | EP2A40F672C6 |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-BBGA, FC-FBGA (FineLine) | 672-BBGA, FC-FBGA (FineLine) - same | 672-BBGA, FC-FBGA (FineLine) - same | 672-BBGA, FC-FBGA (FineLine) - same | 672-BBGA, FC-FBGA (FineLine) - same | 672-BBGA, FC-FBGA (FineLine) - same | 672-BBGA, FC-FBGA (FineLine) - same | 672-BBGA, FC-FBGA (FineLine) - same |
| Speed Grade | C9 (366 MHz) | C8N (~333 MHz, Pb-free) | C8 (~333 MHz) | C7N (~300 MHz, Pb-free) | C7 (engineering sample) | C7 (~300 MHz) | C6N (~256 MHz, Pb-free) | C6 (~256 MHz) |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Fastest C9 speed grade in the EP2A40F672 family (vs EP2A40F672C8N)
- Production-grade qualification (vs C7ES engineering sample) (vs EP2A40F672C7ES)
- Highest fmax in the 672-ball BGA EP2A40 family (vs EP2A40F672C6N)
Design Notes
The EP2A40F672C9 requires separate power rails for the 1.5 V core and the I/O banks, which can be configured at 3.3 V, 2.5 V, or 1.8 V depending on the bank. Per Altera's APEX II datasheet, the device includes internal power-on-reset (POR) circuitry that holds the FPGA in reset until the core supply reaches its threshold. Sequence the I/O voltages before or simultaneously with the 1.5 V core to avoid I/O-driving into an unpowered core. Decoupling: place 0.1 µF and 10 µF capacitors adjacent to each power pin, and provide a continuous ground plane under the BGA for low-impedance current return paths.
The 672-ball FineLine BGA at 27 mm × 27 mm with 1 mm pitch requires via-in-pad or dog-bone fanout depending on PCB layer count. Per IPC-7351 and Altera's APEX II package guidelines, microvia technology is recommended for 1 mm-pitch BGA breakout. Maintain a 0.5 mm solder mask dam between pads. Use a 0.4 mm via pad and 0.2 mm drill for microvia fanout on 4-8 layer stackups. Plan ground and power planes on inner layers directly under the BGA to provide low-impedance returns for the high-speed I/O standards.
The EP2A40F672C9 supports True-LVDS, LVPECL, PCML, and HyperTransport I/O standards at 1 Gbps signaling rates, which require controlled-impedance routing. Per the Altera APEX II datasheet, the differential impedance target for LVDS is 100 Ω and the recommended trace length matching is within 10 ps (roughly 1.5 mm at FR-4 dielectric). Use 5-mil traces with 8-mil spacing to maintain 100 Ω differential impedance on 1 oz copper over a standard 4-layer stackup. Add series-termination resistors at the LVDS driver when source-impedance matching is required.
Common pitfalls when migrating to EP2A40F672C9 same-family drop-in alternatives: (1) Designs that are timing-margin-limited at C9 may fail closure at C8/C7/C6 due to reduced fmax; rerun Quartus II timing analysis after each speed-grade change. (2) The C7ES (engineering sample) variant is intended for prototype use only and should not be used in production. (3) Pb-free speed-grade variants (suffix N) require RoHS-compliant assembly processes; confirm your reflow profile supports lead-free SAC305 solder paste. (4) Industrial variants (suffix I) cost more and have narrower supply availability; the commercial C9 grade is the easiest to source.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status were not stated in the provided Verified Web Data for the EP2A40F672C9. Pb-free variants (suffix N) are typically RoHS compliant; standard variants require verification. AEC-Q100 not applicable for FPGAs in this legacy generation.
