EP2A70F1508C7ES - 1.5V 70K LE APEX II FPGA 1508-FBGA | Intel / Altera
MPN: EP2A70F1508C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $380 | $380.00 |
| 10 | $350 | $3,500.00 |
| 50 | $320 | $16,000.00 |
| 100 | $295 | $29,500.00 |
| 500 | $270 | $135,000.00 |
| 1,000 | $250 | $250,000.00 |
EP2A70F1508C7ES Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs belong to the broader class of programmable logic devices (PLDs), sitting between simple CPLDs (complex programmable logic devices) and fixed-function ASICs (application-specific integrated circuits) in terms of density and flexibility. The APEX II architecture specifically targets high-speed datapath, on-chip bus, and embedded processing applications where LUT-based logic and significant embedded memory are required.
Key features of the EP2A70F1508C7ES include 6,720 logic array blocks (LABs) clustered into MultiCore columns, four phase-locked loops (PLLs) with multiple output taps, and dedicated carry chains that enable arithmetic-intensive datapaths. The embedded memory is organized as 4,096-bit True-Lookup-Table-based RAM blocks that can be configured as single-port RAM, dual-port RAM, FIFO, or ROM, supporting high-bandwidth on-chip buffering.
The APEX II family supports I/O rates up to 840 Mbps using LVDS pairs, with the EP2A70 reaching an internal maximum clock frequency of 420 MHz according to manufacturer characterization data. The architecture combines Look-Up-Table (LUT) logic for fine-grained functions with Embedded System Blocks (ESBs) for memory, making the device suitable for datapath-intensive designs such as protocol bridges, high-speed image processing front-ends, and telecom backplane interfaces.
Typical applications include high-speed serial protocol bridging (UTOPIA, POS-PHY, SPI-4.2, RapidIO), telecommunications switching fabrics, digital signal processing front-ends, and high-density data-path glue logic. The -7 speed grade combined with industrial-grade screening makes this part well suited for performance-sensitive but non-automotive systems.
When designing with this device, follow Altera's recommended power-on sequencing for VCCINT and VCCIO rails to avoid in-rush damage to the core logic. Use the Quartus II design suite (legacy 13.0sp1 is the last supported release) for synthesis, place-and-route, and timing closure. The FC-FBGA package requires careful PCB stack-up design for the flip-chip BGA escape.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2A70F1508C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70F1508C7ES (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Mounting Type, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70F1508C7
✅ Drop-In✓ In Stock
$645 / Unit
View Datasheet →EP2A70F1508C6
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$175 / Unit
View Datasheet →EP2A70F1020C7
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$92 / Unit
View Datasheet →EP2A70F1020C8
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EP2A70F1020C9
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View Datasheet →EP2A70F1508C7ES Maximum Ratings & Electrical Characteristics
| Series | APEX II |
| Family | APEX II (EP2A) |
| Logic Elements | 67,200 |
| System Gates | 3,000,000 |
| Logic Array Blocks (LABs) | 6,720 |
| Total RAM Bits | 1,146,880 |
| Maximum User I/O | 1,060 |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V (typ. 1.5 V) |
| Process Technology | 0.15 µm CMOS |
| Speed Grade | -7 |
| Operating Temperature (commercial) | 0 °C to +85 °C (TJ) |
| Package | 1508-pin FC-FBGA (40 × 40 mm) |
| PLLs | 4 |
| Internal Clock Frequency | up to 420 MHz |
| Mounting Type | Surface Mount (flip-chip BGA) |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL, LVDS, GTL+ |
| MultiVolt I/O | Yes (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
EP2A70F1508C7ES 1508-pin fc-fbga (40 × 40 mm) Pin Configuration Guide
Pin configuration for EP2A70F1508C7ES (1508-pin fc-fbga (40 × 40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70F1508C7ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70F1508C7ES is suitable for 6 applications: High-Speed Protocol Bridge (UTOPIA / SPI-4.2 / POS-PHY), Telecommunications Switching Fabric Interface, Digital Signal Processing Front-End, Image and Video Processing Pipeline, Industrial High-Density Glue Logic, Legacy Networking Line Card ASIC Replacement.
High-Speed Protocol Bridge (UTOPIA / SPI-4.2 / POS-PHY)
The EP2A70F1508C7ES is well suited for high-speed protocol bridging between telecom interfaces such as UTOPIA, POS-PHY Level 3/4, and SPI-4.2. Its 67,200 logic elements provide sufficient capacity to implement multi-channel protocol engines, while the 1,146,880 bits of embedded RAM (configurable as single-port, dual-port, or FIFO) are sized for typical packet buffering at OC-48/STM-16 line rates. The 1,060 user I/O pins enable direct multi-port connection to PHYs without external bus expansion. Placed on the line-card between framer and network processor, the part supports up to 840 Mbps LVDS pairs and 420 MHz internal clock speeds, eliminating the latency penalty of off-chip bridging ASICs.
Recommended
Telecommunications Switching Fabric Interface
In telecom switching systems, the EP2A70F1508C7ES can implement the line-side interface to TDM and ATM switching fabrics. Its four PLLs provide the multiple clock domains required to bridge between the system backplane frequency and per-port serial rates, while the 6,720 LABs and embedded system blocks (ESBs) deliver the parallel datapath throughput needed for cell/frame processing at STS-192/STM-64 aggregation points. The multiVolt I/O banks simplify interfacing to legacy 3.3 V backplane drivers alongside newer 2.5 V or 1.8 V PHY devices. The 1508-FBGA package offers ample signal integrity for designs requiring controlled-impedance traces at 100 MHz+.
Recommended
Digital Signal Processing Front-End
The EP2A70F1508C7ES can serve as a DSP front-end performing filtering, FFT preprocessing, or modulation/demodulation prior to host processor handoff. While APEX II lacks dedicated DSP blocks (no hardware multipliers), the architecture supports distributed arithmetic implementations in LUT-RAM, with the 1,146,880 embedded RAM bits delivering the coefficient and sample storage required for 256-tap FIR filters or 1024-point radix-2 FFT pre-processing. The 67,200 logic elements support 8-16 parallel filter channels at voice-bandwidth sample rates. Placed between the ADC and the host DSP or microprocessor, the FPGA can perform pre-decimation, channelization, and gain control.
Recommended
Image and Video Processing Pipeline
The EP2A70F1508C7ES supports image and video processing pipelines such as real-time edge detection, color-space conversion, or frame-rate conversion. With 67,200 logic elements and 1,146,880 embedded RAM bits, the device can buffer 1024 × 768 8-bit grayscale frames entirely on-chip, eliminating external SDRAM for moderately sized image windows. The 1,060 user I/O pins accommodate parallel video buses, camera-link interfaces, and DDR memory controllers simultaneously. Placed between a CMOS image sensor or camera-link receiver and a host display processor, the FPGA performs pixel-level operations with deterministic latency.
Recommended
Industrial High-Density Glue Logic
In industrial automation systems, the EP2A70F1508C7ES can serve as a high-density programmable interface bridge between legacy fieldbus standards (Profibus, CANopen, DeviceNet) and modern Ethernet/IP or EtherCAT controllers. Its 6,720 LABs provide ample capacity to implement multiple protocol stacks in parallel, while the four PLLs derive the bus-specific baud-rate clocks from a single 50 MHz reference. Placed on the master controller card, the FPGA consolidates what would otherwise require several discrete UART/SPI controllers plus a CPLD, reducing board area and BOM cost. The -7 speed grade supports deterministic real-time protocol timing.
Recommended
Legacy Networking Line Card ASIC Replacement
The EP2A70F1508C7ES is frequently used as a low-volume replacement for obsolete ASICs in legacy networking line cards (OC-48, OC-192 framer interfaces, ATM SAR, HDLC controllers). Its 67,200 logic elements and 1,146,880 embedded RAM bits replicate the function of mid-complexity ASICs while allowing field reprogrammability. The 1508-FBGA package provides the I/O count (1,060 pins) needed to maintain backward compatibility with legacy bus architectures. Placed on the line card as a drop-in ASIC substitute, the FPGA enables continued production of mature telecom equipment without expensive ASIC re-spins.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70F1508C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70F1508C7 | EP2A70F1508C6 | EP2A70F1020C7 | EP2A70F1020C8 | EP2A70F1020C9 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1508-FBGA (40x40 mm) | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same | 1020-BGA - different footprint, PCB redesign required | 1020-BGA - different footprint, PCB redesign required | 1020-BGA - different footprint, PCB redesign required |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| Speed Grade | -7 (Fmax 420 MHz) | -7 (Fmax 420 MHz) | -6 (Fmax ~340 MHz, -19%) | -7 (Fmax 420 MHz) | -8 (~378 MHz, -10%) | -9 (slowest, -19%) |
| Embedded RAM Bits | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 |
| Maximum User I/O | 1,060 | 1,060 | 1,060 | ~720 (lower due to smaller package) | ~720 | ~720 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 0.15 µm | 0.15 µm | 0.15 µm | 0.15 µm | 0.15 µm | 0.15 µm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| PCB Compatibility | 1508-FBGA reference footprint | Drop-in compatible | Drop-in compatible | PCB redesign required | PCB redesign required | PCB redesign required |
Key Differentiators
- Largest pin-count package in APEX II family for maximum I/O (vs EP2A70F1020C7)
- Fastest -7 speed grade in the APEX II family (vs EP2A70F1508C6)
- Same 1508-FBGA package as EP2A70F1508C7 with customer-labeling variant (vs EP2A70F1508C7)
Design Notes
The 1508-FBGA flip-chip BGA requires a 12-16 layer PCB stack-up with microvia escape and 50 Ω controlled-impedance routing. Use the Altera AN 113: 'Package Information for APEX II Devices' reference for escape routing guidelines. Place 0.1 µF decoupling capacitors at every four VCCINT/VCCIO ball groups, with bulk capacitors (47-100 µF) at the regulator outputs. Maintain a 0.2 mm via-in-pad design rule for the inner-row BGA escapes.
Power on sequencing must follow VCCINT (1.5 V core) before VCCIO (per-bank I/O) to prevent I/O bus contention and potential ESD damage. Use a sequenced PMIC (e.g., TI TPS74xx series) or dedicated Altera-recommended controllers. The APEX II core can draw up to 3-5 A at 420 MHz across all 67,200 logic elements, requiring a heatsink or thermal via array under the FC-FBGA thermal pad for industrial temperature operation.
Always check the date code and screening level of the EP2A70F1508C7ES before purchase - some legacy date codes are lead-bearing and not RoHS compliant. Since the part is obsolete, verify bitstream compatibility between your Quartus II 13.0sp1 compilation environment and the actual silicon revision. Use the JTAG IDCODE check at board power-on to verify the correct device revision is mounted before loading configuration.
MultiVolt I/O banks (1.5/1.8/2.5/3.3 V) require careful bank-by-bank VCCIO planning before PCB layout. Mixing voltage banks on the same physical die region causes bus contention. The LVDS pairs on APEX II support up to 840 Mbps but require 100 Ω differential termination at the receiver; use the Altera-developed IBIS models (EP2A_IBIS package) for SI simulation.
Compliance Information
Original APEX II production predates full RoHS transition. Lead-bearing and lead-free date codes both exist; verify specific lot RoHS compliance with distributor before purchase. No AEC-Q100 qualification for any APEX II device.
