EP2A70F1508C7 - APEX II FPGA, 70K LE, 1508-FBGA | Altera
MPN: EP2A70F1508C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $805 | $8,050.00 |
| 100 | $750 | $75,000.00 |
| 500 | $695 | $347,500.00 |
| 1,000 | $645 | $645,000.00 |
EP2A70F1508C7 Overview
An FPGA is a programmable logic device (PLD) that allows hardware designers to implement arbitrary digital logic via a configuration bitstream, distinguishing it from fixed-function ASICs. APEX II belongs to the broader hierarchy of programmable logic: PLD -> CPLD/FPGA -> high-density FPGA with embedded memory and LVDS-capable transceivers. APEX II devices include embedded system blocks (ESBs) that double as CAM or RAM, making them suitable for designs with large lookup tables, FIFOs, and on-chip buffering. The EP2A70F1508C7 specifically targets data-path, telecom, and high-speed serial interface applications that need more than 1 million bits of internal memory.
Key features of this part include up to 1060 user I/O pins, support for 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O standards, and high-speed interconnect via copper interconnect layers that reduce RC delay. The 1508-FCBGA package exposes enough balls to route the wide LVDS buses typical of APEX II designs, and the large die footprint supports the device's high LE count and embedded RAM density.
Typical end uses include high-speed networking line cards, parallel LVDS backplane interfaces, DSP co-processing for telecom baseband, and ASIC prototyping where designers need maximum logic density combined with multi-gigabit serial links.
When designing with this part, ensure the PCB has a sufficient via-in-pad escape pattern for the 1.0 mm pitch FCBGA, use controlled-impedance routing for LVDS pairs, and verify the Quartus II design toolchain supports the EP2A70 device (legacy APEX II flow).
This page aggregates distributor pricing, parametric drop-in alternatives, and design notes from the Altera APEX II datasheet family to help engineers sourcing long-lifecycle FPGA inventory.
Drop-in alternatives for EP2A70F1508C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70F1508C7 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Series, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70F1508C6
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A40F1508
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2A70F1508C7 Maximum Ratings & Electrical Characteristics
| Series | APEX II |
| Device Family | APEX II (EP2A) |
| Logic Elements (typical) | 67,200 LEs |
| Total RAM Bits | 1,146,880 bits |
| User I/O Pins | 1060 (max) |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage | 1.425 V to 1.575 V |
| I/O Standards | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| Package | 1508-BBGA, FCBGA (40 x 40 mm) |
| Supplier Device Package | 1508-FBGA |
| Operating Temperature | 0C to 85C (commercial, C grade) |
| Mounting Type | Surface Mount (FCBGA, 1.0 mm pitch) |
| RoHS Status | compliant (per Rochester Electronics listing) |
| Lead-Free | yes |
| Speed Grade | 7 |
EP2A70F1508C7 1508-fbga Pin Configuration Guide
Pin configuration for EP2A70F1508C7 (1508-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70F1508C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70F1508C7 is suitable for 6 applications: High-Speed Networking Line Card, Telecom Baseband DSP Co-Processing, ASIC Prototyping with High Logic Density, Multi-Channel LVDS Backplane Interface, Legacy Industrial Control System, Parallel-to-Serial Bridge for Legacy Telecom.
High-Speed Networking Line Card
The EP2A70F1508C7 fits high-speed networking line cards because it integrates 67,200 LEs and 1.14 Mbit of embedded RAM, supporting large parallel packet-processing datapaths. Its 1060 I/Os in the 1508-FCBGA expose enough pins for wide parallel LVDS buses to PHY/serializer devices. The 1 Gbps True-LVDS capability meets legacy 10 GbE and telecom backplane interconnect rates. Embedded system blocks (ESBs) can be configured as CAM to accelerate route-table lookups, which are critical for IP forwarding. Power dissipation under full load is higher than modern Cyclone/Stratix parts, so designers must include thermal vias under the FCBGA and adequate airflow. Use the part only for sustaining existing designs because new builds should target Cyclone 10 GX or Stratix 10 for better power efficiency.
Recommended
Telecom Baseband DSP Co-Processing
The EP2A70F1508C7 suits baseband co-processing applications because the 1.14 Mbit embedded RAM is sufficient for storing FIR filter taps, constellation maps, and channel-state buffers. Its 67,200 LEs implement hundreds of multiply-accumulate operations in parallel, offloading baseband DSP from the host processor. The HyperTransport-compatible I/O enables chip-to-chip interconnect at gigabit rates with telecom ASSPs. 1.5 V core operation keeps per-LE dynamic power acceptable when the device runs at full speed. Industrial temperature grades are not available for this C-speed-grade variant, so the part is limited to climate-controlled central-office racks. Design verification should include signal-integrity simulation of LVDS pairs across the FCBGA breakout region.
Recommended
ASIC Prototyping with High Logic Density
The EP2A70F1508C7 is widely used for ASIC prototyping because the 67,200 LEs are sufficient to map million-gate ASIC designs into multiple FPGAs with reduced partition overhead. The 1.14 Mbit embedded RAM matches typical ASIC memory densities, allowing realistic timing closure during prototyping. The 1508-FCBGA exposes enough I/Os to bridge multiple FPGAs in a prototyping chain, and the 1 Gbps LVDS I/Os emulate ASIC-on-chip serial links. APEX II devices are supported by the Quartus II design toolchain, with extensive library of reference designs and IP cores from Altera's legacy IP catalog. Designers should budget for high static and dynamic power consumption during long prototyping bring-up cycles and use active cooling.
Recommended
Multi-Channel LVDS Backplane Interface
The EP2A70F1508C7 is well suited for LVDS backplane interface cards, where its 1 Gbps True-LVDS capability and 1060 I/Os support many parallel LVDS channels across a backplane. Embedded system blocks can store frame buffers and protocol translation tables, simplifying the FPGA's data-path logic. The copper-interconnect 0.15 µm process reduces RC delay on internal long-line routes, improving timing margin at high toggle rates. The 1508-FCBGA package requires a 1.0 mm-pitch via-in-pad escape pattern; designers should plan at least 6 routing layers and follow Altera's APEX II layout guidelines. Because the part is obsolete, end-of-life hardware refresh programs are the typical use case.
Recommended
Legacy Industrial Control System
The EP2A70F1508C7 continues to be deployed in long-life industrial control systems because its high logic density accommodates multi-axis motor control, PID loops, and protocol bridging on a single device. Embedded RAM allows large lookup-based waveform generation, and the LVDS I/Os interface to high-precision ADCs/DACs commonly used in servo drives. The part is specified for commercial 0C to 85C operation, so chassis with active thermal management are required for industrial environments. Lifecycle management is critical: maintain a 12-24 month safety stock with the original franchised distributor because the part is end-of-life and second-source is unavailable.
Recommended
Parallel-to-Serial Bridge for Legacy Telecom
The EP2A70F1508C7 works as a parallel-to-serial bridge in legacy telecom equipment because its 1 Gbps True-LVDS, LVPECL, and HyperTransport I/Os natively interface with telecom framers and serializer/deserializer chips. The 67,200 LEs implement protocol conversion, error correction, and clock-data recovery glue logic. Embedded RAM buffers payload data between parallel buses and high-speed serial links. The 1508-FCBGA package exposes 1060 pins to accommodate wide parallel buses on one side and multiple serial links on the other. Quiescent current is significant, so power-sequencing and thermal monitoring must be designed in from the start.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70F1508C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70F1508C6 | EP2A40F1508 | EP2A70B724I9 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 1508-BBGA, FCBGA (40x40 mm) | 1508-BBGA, FCBGA (40x40 mm) - same | 1508-BBGA, FCBGA (40x40 mm) - same | 724-BGA - different (not pin-compatible) |
| Logic Elements | 67,200 LEs | 67,200 LEs - same | 40,000 LEs (-40%) | 67,200 LEs - same |
| Embedded RAM | 1,146,880 bits | 1,146,880 bits - same | ~600,000 bits (-50%) | 1,146,880 bits - same |
| User I/O Pins | 1060 | 1060 - same | lower (refer to 1508-FBGA pin map) | fewer (724-BGA package) |
| Speed Grade | 7 | 6 (slower) | 7 - same | 9 (faster) |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to 100C (industrial) |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same | 1.425 V to 1.575 V - same |
Key Differentiators
- Largest density in the APEX II family (vs EP2A40F1508)
- Same package as the lower-speed variant (vs EP2A70F1508C6)
- Industrial temperature variant available in smaller package (vs EP2A70B724I9)
Design Notes
Estimated: at 1.5 V core, full logic utilization, and ~100 MHz toggle rate, APEX II FPGAs in the FCBGA-1508 package dissipate 8-12 W. The 40 x 40 mm FCBGA requires a thermal via array under the die and at least 1 oz copper pour on both outer layers plus internal planes. Reference the APEX II datasheet thermal management section and provide 200-400 LFM airflow for sustained full-load operation.
The 1508-FBGA package uses a 1.0 mm ball pitch and via-in-pad escape geometry; plan at least 6 PCB routing layers with microvia stackups (e.g., 1-2-1 build-up). Decoupling follows Altera's APEX II guidelines: place 0.1 µF X7R ceramics on every VCC and VCCIO pin pair within 100 mils, plus 10 µF bulk capacitors adjacent to each power plane entry. Maintain impedance-controlled routing for LVDS pairs (100 Ω differential).
LVDS signal integrity is critical: route 1 Gbps True-LVDS pairs with matched length within 25 mil, maintain 100 Ω differential impedance, and keep at least 3x dielectric height clearance to other signals. Use ground-coplanar waveguide with via stitching every λ/10 of the highest harmonic. Configure I/O standards via Quartus II assignment editor before fitting to avoid pinout remapping late in the design cycle.
Critical to remember: EP2A70F1508C7 is obsolete. Do not use for new designs unless supporting an existing certified product. Stock on hand is finite; safety stock with Rochester Electronics or authorized brokers is essential for long-life programs. Cyclone IV/V, Stratix IV/V, and Arria 10 are recommended modern replacements, but they require PCB redesign because the package and ball map differ.
Compliance Information
RoHS compliance per Rochester Electronics DigiKey listing. REACH, halogen-free, and conflict-mineral status not explicitly published for EP2A70F1508C7 in the verified web data.
