EP2A40F1020C7 - APEX II FPGA 1.5M Gates 1020-BGA | Altera
MPN: EP2A40F1020C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $138 | $138,000.00 |
EP2A40F1020C7 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable I/O, all interconnected by a programmable routing fabric. APEX II sits in the high-density programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. APEX II devices combine Look-Up Table (LUT)-based logic with embedded array blocks (EABs), making them suitable for both register-rich datapath and memory-intensive designs on a single die.
Key features of the EP2A40F1020C7 include 2,560 macro cells, 735 user I/Os, and high-speed serial support through 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface signaling. The device exposes roughly 655 kbits of embedded memory for buffer, FIFO, and ROM/RAM functions, while dedicated clock management blocks (PLLs) and Double Data Rate (DDR) support address timing-critical sections of the design. Altera's Quartus II design suite is the canonical toolchain for synthesis, place-and-route, and bitstream generation.
The 1020-pin FC-FBGA package uses a fine-pitch flip-chip ball grid to maximize signal escape density and minimize inductance on high-speed nets; it requires a multi-layer PCB with controlled-impedance routing and BGA-specific rework capability. Industrial-grade thermal and reliability grades make the part applicable to communications backplanes, ASIC prototyping, and DSP co-processing, where high gate count and rich I/O outweigh the cost premium.
When designing with EP2A40F1020C7, ensure your PCB stack-up supports the FC-FBGA ball pitch and that power decoupling follows the APEX II reference design (multiple bulk and high-frequency ceramic capacitors per VCC rail). Use Quartus II pin planning tools early to validate I/O assignment against bank voltage requirements and LVDS pairing rules.
This page synthesizes distributor inventory, same-family Altera drop-in alternatives, and practical FPGA bring-up notes that complement the manufacturer's datasheet, providing information gain beyond a single product listing.
Drop-in alternatives for EP2A40F1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F1020C7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F1020C8N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2A40F1020C6N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F1020C6
✅ Drop-In✓ In Stock
$149 / Unit
View Datasheet →EP2A40F1020C8
✅ Drop-In✓ In Stock
$310 / Unit
View Datasheet →EP2A40F1020C9
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP2A40F1020C7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements / Cells | 38,400 |
| System Gates | 1.5 M |
| Macro Cells | 2,560 |
| User I/Os | 735 |
| Embedded Memory Bits | 655,360 bits |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 562 MHz |
| Process Technology | 0.15 um CMOS, all-layer copper (up to 8 metal layers) |
| Package | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Mounting Type | Surface Mount |
| High-Speed Interface Support | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| Operating Temperature Grade | Industrial / per part suffix (C7) |
EP2A40F1020C7 1020-ball fc-fbga (fine-pitch chip-scale bga) Pin Configuration Guide
Pin configuration for EP2A40F1020C7 (1020-ball fc-fbga (fine-pitch chip-scale bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F1020C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F1020C7 is suitable for 6 applications: High-Speed Communications Backplane Interface, ASIC Prototyping and Emulation, Digital Signal Processing Co-Processor, Industrial Control and Automation, Test and Measurement Instrumentation, Legacy Defense and Aerospace Systems.
High-Speed Communications Backplane Interface
The EP2A40F1020C7's 1-Gbps True-LVDS, LVPECL, and PCML interface support makes it a strong fit for backplane SERDES bridging in telecommunications equipment. With 735 user I/Os and 38,400 logic cells, the device can implement multi-channel link aggregation, custom packet processing, and link-layer framing without external glue logic. The 1020-ball FC-FBGA package exposes enough I/O to run wide parallel buses alongside the serial links, and the 1.5 V core enables power-efficient operation in dense line-card designs. APEX II PLLs handle clock recovery and skew management across multiple channels.
Recommended
ASIC Prototyping and Emulation
Engineers use APEX II FPGAs such as the EP2A40F1020C7 to prototype ASIC designs before committing to mask costs, taking advantage of the device's 1.5 M system gates and 655,360 bits of embedded memory. The 1020-ball FC-FBGA package provides enough I/O bandwidth to map large ASIC subsystems including processors, memory controllers, and peripheral interfaces. Quartus II supports incremental compile flows that allow incremental bring-up of complex ASIC prototypes. For multi-FPGA partitioning, the rich I/O count helps minimize split boundaries.
Recommended
Digital Signal Processing Co-Processor
The EP2A40F1020C7 serves as a DSP co-processor in wireless base stations and radar systems, where its 562 MHz fabric and embedded memory blocks accelerate FIR filters, FFTs, and custom modulation/demodulation chains. The embedded array blocks (EABs) can be configured as ROM, dual-port RAM, or FIFO, enabling efficient coefficient storage and pipelined data movement. LVDS interface support allows direct connection to high-speed ADCs and DACs, reducing external glue logic. The 735 I/Os expose enough bandwidth for parallel data paths in multi-channel systems.
Recommended
Industrial Control and Automation
Factory automation controllers use APEX II devices like the EP2A40F1020C7 for custom motor-control, sensor-fusion, and deterministic real-time processing tasks. The 0.15 micrometer CMOS process and 1.5 V core deliver acceptable thermal envelopes for sealed industrial enclosures, while 735 I/Os handle encoder feedback, PWM outputs, and fieldbus interfaces. The high gate count allows integration of custom safety logic, watchdog timers, and protocol stacks on a single FPGA. Long-term availability concerns make BOM management important for industrial designs.
Recommended
Test and Measurement Instrumentation
Test equipment designers leverage the EP2A40F1020C7 for custom pattern generation, protocol analysis, and high-speed data acquisition. The 1-Gbps LVDS interfaces can directly capture or drive high-speed test vectors, while the 38,400 logic cells implement custom state machines and channel-equalization algorithms. Embedded memory (655 kbits) supports deep capture buffers for transient analysis. The 1020-ball FC-FBGA package provides the signal integrity required for instrumentation front ends.
Recommended
Legacy Defense and Aerospace Systems
The EP2A40F1020C7 continues to appear in long-lifecycle defense, aerospace, and avionics platforms that were qualified against APEX II generations and require form-fit-function continuity for sustainment programs. Designers maintaining these systems benefit from the 735 I/Os and 1.5 M system gates for system upgrades without major board rework. Industrial-grade temperature operation and known reliability data make the device acceptable for many non-critical flight applications. Aftermarket distributors such as Heisener and Nantian carry inventory for sustainment orders.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F1020C8N | EP2A40F1020C6N | EP2A40F1020C6 | EP2A40F1020C8 | EP2A40F1020C9 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Speed Grade (Max fMAX) | C7 (~562 MHz) | C8 (~376 MHz) | C6 (lower than C7) | C6 (lower than C7) | C8 (~376 MHz) | C9 (~366 MHz) |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/Os | 735 | 735 | 735 | 735 | 735 | 735 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Highest speed grade in the EP2A40 1020-FBGA family (vs EP2A40F1020C8N)
- Maximum gate and I/O density in APEX II family (vs EP2A25F1020C8ES)
- 1-Gbps LVDS / HyperTransport interface support (vs Older APEX 20K devices (e.g., EP20K400FI672-3))
Design Notes
The EP2A40F1020C7's 1020-ball FC-FBGA package requires a multilayer PCB stack-up with matched impedance for LVDS traces (typically 100 ohm differential) and a BGA escape pattern compatible with the fine ball pitch. Use microvia or via-in-pad technology to route inner balls, and pair each high-speed LVDS pair with a continuous reference plane to control impedance. Plan power islands for the 1.5 V core and the I/O bank voltages separately, and place bulk decoupling capacitors directly under or adjacent to the BGA footprint.
Decoupling strategy must follow Altera's APEX II reference design: at least one 100 uF bulk capacitor and multiple 10 uF / 1 uF / 0.1 uF ceramic capacitors distributed around the BGA. Sequence the 1.5 V core supply and I/O bank supplies with proper power-on-reset timing; failure to do so can cause configuration CRC errors. Estimated core current at full toggle activity can reach several amps, so verify regulator current capability and thermal headroom at maximum junction temperature.
Match LVDS trace lengths within a pair to within 50 mils and match across pairs to within 100 mils to maintain timing margin at 1 Gbps. Use ground-filled coplanar waveguide or stripline routing with continuous return paths. Avoid routing LVDS signals across plane splits or noisy clock regions. Place 100 ohm differential termination resistors close to the receiver end of each LVDS pair and configure LVDS I/O standards through Quartus II pin planner before bitstream generation.
Common pitfalls with APEX II designs include: (1) ignoring I/O bank voltage requirements when mixing 3.3 V and 1.5 V I/O standards, (2) selecting the wrong speed grade for fMAX-critical paths (timing closure may be impossible on C8/C9 for the same design that fits on C7), and (3) failing to use JTAG or passive serial configuration modes with proper CRC checking, which can lead to silent configuration corruption. Always validate the design on real hardware with temperature and voltage margin before committing to production.
Compliance Information
RoHS and lead-free status not present in the provided web data; N-suffixed variants (e.g., EP2A40F1020C8N) typically denote lead-free finishes, but specific compliance certification must be confirmed from the manufacturer's datasheet or certificate of conformance. APEX II is not AEC-Q100 qualified as an automotive-grade part.
