EP2A70F1020C7 - 70k LEs FPGA, 735 I/O, 1020-FBGA | Intel (Altera)
MPN: EP2A70F1020C7 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP2A70F1020C7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that can be reconfigured by the end user after manufacturing. FPGAs sit at the top of the digital logic hierarchy between fixed-function ASICs (lower unit cost at high volume, no flexibility) and microcontrollers (programmable in software, much lower throughput). APEX II devices in particular target high-speed parallel datapath and memory-intensive designs thanks to their LUT-based logic fabric and embedded SRAM.
The EP2A70F1020C7 delivers roughly 67,200 logic elements (LEs), a maximum of 735 user I/O pins, and substantial embedded memory, making it well suited for data-path-intensive applications. The 1020-ball flip-chip FBGA package exposes hundreds of user I/O and provides excellent signal integrity for high-speed interfaces. Speed grade 'C7' represents the standard performance tier; faster grades (C8, C9) offer higher Fmax at the cost of higher power dissipation. The commercial operating range makes the part appropriate for indoor, controlled-environment systems.
Architecturally, the device combines look-up-table (LUT) based logic with embedded SRAM blocks, dedicated I/O structures supporting multiple I/O standards, and a high-speed interconnect fabric. This architecture supports designs such as custom parallel processors, telecommunications line-card datapaths, high-speed glue logic, and ASIC prototyping where high gate count and abundant I/O are required.
Typical applications include telecom line cards, ASIC prototyping, high-speed test and instrumentation, video/image processing pipelines, and industrial control. The high I/O count also makes it suitable for designs that emulate large ASICs and for system-level integration where many interface standards must be supported.
When designing with this part, verify that the 1020-ball FBGA footprint, 0.7 ns speed grade, and commercial temperature range match your system constraints. Because the APEX II family is mature and largely serviced through the secondary market, lead times and authorized-distributor availability should be confirmed before committing to high-volume production.
This page synthesizes distributor pricing from ten-plus authorized and independent distributors, drop-in alternative guidance, and practical design considerations not consolidated on any single manufacturer page.
Drop-in alternatives for EP2A70F1020C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70F1020C7 (same form factor and footprint) β differing in Package, Speed Grade, Family, Mounting Type, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2A70F1020C8
β Drop-Inβ In Stock
$135 / Unit
View Datasheet βEP2A70F1020C9
β Drop-Inβ In Stock
$132.8 / Unit
View Datasheet βEP2A70F1020C8ES
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2A70F1020C9ES
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2A70F1020
β Drop-Inβ In Stock
$118.5 / Unit
View Datasheet βEP2A70F1020C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2A70F1020C7 Maximum Ratings & Electrical Characteristics
| Logic Elements (LEs) | 67200 |
| Maximum User I/O | 735 |
| Package | 1020-ball FBGA |
| Speed Grade | C7 |
| Operating Temperature | 0C to +85C (commercial) |
| Family | APEX II (EP2A) |
| Mounting Type | Surface Mount (BGA) |
EP2A70F1020C7 1020-ball fbga Pin Configuration Guide
Pin configuration for EP2A70F1020C7 (1020-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70F1020C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70F1020C7 is suitable for 6 applications: ASIC Prototyping Platform, Telecom Line Card Datapath, High-Speed Test & Measurement Equipment, Video and Image Processing Pipeline, Industrial Control and Factory Automation, Aerospace and Defense Test Bench (Heritage Systems).
ASIC Prototyping Platform
The EP2A70F1020C7 fits ASIC prototyping because its roughly 67,200 logic elements and 735 user I/O pins give engineers enough capacity to map large ASIC RTL blocks onto a single device. The 1020-ball FBGA exposes hundreds of user I/O, supporting multi-standard bridges between DDR-style memory buses and custom parallel interfaces in one prototype board. The C7 commercial speed grade provides sufficient Fmax for sub-100 MHz logic-heavy prototyping. According to Altera APEX II documentation, the LUT-based fabric and embedded SRAM simplify mapping ASIC RTL with minimal performance loss. Engineers commonly partition across multiple EP2A70 devices to prototype ASICs exceeding one million gates.
Recommended
Telecom Line Card Datapath
The EP2A70F1020C7 fits telecom line-card datapaths because its high logic density and abundant I/O support parallel channel processing, framer/mapper functions, and packet classification. The 735 user I/O enables direct connection to multiple SERDES, UTOPIA, or SPI interfaces without external muxing. The APEX II LUT fabric plus embedded memory is well suited to lookup-table-based packet processing and queue management. The C7 commercial speed grade covers typical telecom clock rates; faster bins are available if timing closure is tight. The 1020-ball FBGA provides the controlled-impedance escape needed for 100+ MHz parallel buses.
Recommended
High-Speed Test & Measurement Equipment
The EP2A70F1020C7 fits high-speed test and measurement designs because its dense logic fabric handles parallel DSP datapaths, custom trigger logic, and protocol-aware pattern generation in one device. The 735 user I/O accommodate multiple high-speed LVDS channels for instrument front-ends, while embedded SRAM blocks act as deep capture buffers. The C7 speed grade delivers predictable timing closure for deterministic measurement windows. The APEX II family's JTAG boundary-scan support simplifies in-system test of densely populated boards. Designers value the device's combination of density, I/O count, and mature toolchain support for instrumentation.
Recommended
Video and Image Processing Pipeline
The EP2A70F1020C7 fits video and image-processing pipelines because its high logic element count and embedded memory can sustain real-time pixel-rate processing for multi-stream HD video. The 735 user I/O support multiple BT.656/BT.1120 video ports, memory interfaces, and color-space conversion paths in parallel. The LUT-based fabric enables custom filter kernels, motion-estimation blocks, and deinterlacing algorithms in hardware. The C7 commercial speed grade handles pixel clocks in the 100-150 MHz range typical for HD pipelines. The 1020-ball FBGA provides the routing density required for parallel video buses.
Recommended
Industrial Control and Factory Automation
The EP2A70F1020C7 fits industrial control and factory-automation designs because its abundant user I/O can interface with many sensors, actuators, and fieldbuses (PROFIBUS, CAN, RS-485, Ethernet) simultaneously. The 67,200 logic elements support real-time PLC-style control loops, motion-control algorithms, and HMI graphics rendering in a single device. The C7 commercial speed grade handles deterministic 1 ms scan times required by industrial standards. Embedded SRAM buffers data between the fieldbus and host CPU. The 1020-ball FBGA also provides the mechanical and thermal headroom required in factory-floor enclosures.
Recommended
Aerospace and Defense Test Bench (Heritage Systems)
The EP2A70F1020C7 fits heritage aerospace/defense test benches because the APEX II family is established in long-lifecycle military and avionics programs requiring stable component sourcing. The 735 user I/O support MIL-STD-1553, ARINC 429, and discrete avionics interfaces in one device, while the LUT fabric implements custom bus monitors and protocol analyzers. The C7 commercial speed grade is widely accepted in lab and ground-test environments; industrial-grade variants exist for harsher thermal envelopes. Engineers use the 1020-ball FBGA for legacy PCB designs targeting form-fit-function replacements.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70F1020C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70F1020C8 | EP2A70F1020C9 | EP2A70F1020C8ES | EP2A70F1020 | EP2A70F1020C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FBGA | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same |
| Logic Elements | 67200 | 67200 | 67200 | 67200 | 67200 | 67200 |
| Maximum User I/O | 735 | 735 | 735 | 735 | 735 | 735 |
| Speed Grade | C7 | C8 (faster) | C9 (fastest) | C8 extended screening | unspecified (default commercial) | C7 Pb-free |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (extended screening) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Family / Die | APEX II EP2A70 | APEX II EP2A70 - same die | APEX II EP2A70 - same die | APEX II EP2A70 - same die | APEX II EP2A70 - same die | APEX II EP2A70 - same die |
| Pin-to-Pin Compatible | Reference | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- High logic density with abundant I/O (vs EP2A40F1020C7)
- C7 commercial speed grade availability (vs EP2A70F1020C9)
- Mature APEX II toolchain support (vs Newer Intel FPGA families (Cyclone V, Arria V))
Design Notes
Estimated: The 1020-ball FBGA exposes a large die to the PCB. With approximately 67,200 logic elements switching at moderate toggle rates, internal power dissipation commonly reaches 4-8 W in the C7 commercial speed grade. Provide a continuous ground plane on inner PCB layers directly under the BGA and thermal vias connecting the center balls to the bottom-side copper pour. For enclosed industrial enclosures, conduct a thermal characterization with realistic workloads; do not assume the small standoff height of the FBGA is sufficient without forced airflow.
The 1020-ball FBGA requires multilayer PCB fabrication with controlled-impedance routing and microvia or via-in-pad escape. Use the Altera APEX II device handbook ball-map to assign signal layers and to verify that high-speed buses (DDR memory, LVDS links) route on adjacent layers with continuous reference planes. Maintain at least 8 mil trace-and-space fabrication capability and confirm stackup with the PCB vendor before committing to layout.
Because the EP2A70F1020C7 is NRND, do not assume long-term availability. Confirm stock and pricing with the distributor at RFQ stage, and verify that the engineering team has access to a Quartus II toolchain license supporting the APEX II family. For new designs, weigh migration to Cyclone V or Arria V/VII - they are not drop-in compatible and require a PCB redesign, but offer substantially better lifecycle support and lower power.
Compliance Information
Compliance status not explicitly listed in the provided web snippets; refer to the official Altera/Intel datasheet for current RoHS/REACH statements.
