EP2A70F1508I-8 - APEX II FPGA 70K LE FBGA-1508 | Intel / Altera
MPN: EP2A70F1508I-8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222.5 | $111,250.00 |
| 1,000 | $199.75 | $199,750.00 |
EP2A70F1508I-8 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and interconnect via SRAM or anti-fuse configuration memory. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: they offer hardware-level parallelism and deterministic timing without the NRE cost of an ASIC. Within the programmable-logic taxonomy, the EP2A70F1508I-8 belongs to the high-density SRAM-based FPGA category, sitting above CPLDs and below structured-ASIC platforms such as Intel's HardCopy II follow-on family.
Key features of the APEX II EP2A70 series include embedded MultiCore interconnects, support for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI I/O standards, on-chip PLL clock management, and a dedicated configuration interface supporting Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG modes. The FBGA-1508 package with industrial temperature grade (-40C to +100C for the 'I' suffix) suits compute-intensive embedded systems.
From an architectural standpoint, the EP2A70F1508I-8 supports MegaWizard Plug-In Manager IP cores including DDR memory controllers, FFT engines, and PCI interfaces. Its MultiCore interconnect provides predictable routing delays, and ESBs can be configured as dual-port RAM or FIFO structures up to 32 Kbits per block, reducing the need for external SRAM in DSP pipelines.
Typical applications include high-speed telecommunications backplanes, multi-channel DSP for radar and sonar, ASIC prototyping, broadcast video processing, and industrial machine vision. The industrial temperature grade supports factory-floor and outdoor wireless-infrastructure deployments.
When designing with this part, verify Quartus II software version compatibility - APEX II support is mature in Quartus II versions up to 13.0 but unsupported in newer Quartus Prime Pro editions. Designers migrating to newer designs should evaluate Cyclone IV/V or MAX 10 as successors, as APEX II is in long-term support mode.
This page synthesizes current distributor pricing, verified drop-in alternatives, and practical design notes compiled from the Intel / Altera APEX II datasheet family, offering engineering context not duplicated on a single manufacturer page.
Drop-in alternatives for EP2A70F1508I-8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70F1508I-8 (same form factor and footprint) — differing in Operating Temperature, Series, Package, Speed Grade, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70F1508I-7
✅ Drop-In✓ In Stock
$140 / Unit
View Datasheet →EP2A70F1508C9N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A70F1508C8
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →EP2A70F1508C7
✅ Drop-In✓ In Stock
$645 / Unit
View Datasheet →EP2A70F1508C9ES
✅ Drop-In✓ In Stock
$199 / Unit
View Datasheet →EP2A70F1508C9
✅ Drop-In✓ In Stock
$1310 / Unit
View Datasheet →EP2A70F1508I-8 Maximum Ratings & Electrical Characteristics
| Series | APEX II (EP2A) |
| Logic Elements | 70,000 (approx.) |
| Package | 1508-ball FineLine BGA (FBGA-1508) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | -8 |
| Configuration Memory | SRAM-based |
| Configuration Modes | PS, PPS, PPA, JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI |
| Embedded System Blocks (ESBs) | Yes (RAM/ROM/CAM) |
| On-chip PLLs | Yes |
| Supply Voltage | 1.8 V core (typical APEX II) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| Peak Reflow Temperature | 220 C |
| MultiCore Interconnect | Yes |
| Design Software | Quartus II (APEX II support up to v13.0) |
EP2A70F1508I-8 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank dependent) |
| Pin B1 | I/O — User I/O pin (bank dependent) |
| Pin C1 | I/O — User I/O pin (bank dependent) |
| Pin D1 | GND — Ground |
| Pin E1 | VCCIO — I/O bank supply voltage |
| Pin F1 | VCCINT — Core supply voltage (1.8V) |
| Pin G1 | I/O — User I/O pin (bank dependent) |
| Pin H1 | I/O — User I/O pin (bank dependent) |
| Pin J1 | I/O — User I/O pin (bank dependent) |
| Pin K1 | GND — Ground |
| Pin L1 | VCCIO — I/O bank supply voltage |
| Pin M1 | I/O — User I/O pin (bank dependent) |
| Pin N1 | I/O — User I/O pin (bank dependent) |
| Pin P1 | I/O — User I/O pin (bank dependent) |
| Pin R1 | TCK — JTAG test clock |
| Pin T1 | TMS — JTAG test mode select |
| Pin U1 | TDI — JTAG test data in |
| Pin V1 | TDO — JTAG test data out |
| Pin W1 | nCONFIG — Configuration control |
| Pin Y1 | nSTATUS — Configuration status |
| Pin AA1 | CONF_DONE — Configuration done indicator |
| Pin AB1 | DCLK — Configuration clock |
| Pin AC1 | DATA0 — Configuration data input |
| Pin AD1 | MSEL0 — Configuration mode select 0 |
| Pin AE1 | MSEL1 — Configuration mode select 1 |
| Pin AF1 | MSEL2 — Configuration mode select 2 |
| Pin AG1 | GND — Ground |
| Pin AH1 | VCCINT — Core supply voltage (1.8V) |
| Pin AJ1 | VCCIO — I/O bank supply voltage |
Typical Applications
EP2A70F1508I-8 is suitable for 6 applications: Telecommunications Backplane Multiplexer, ASIC Prototyping Platform, Multi-Channel DSP (Radar / Sonar), Broadcast Video Processing Engine, Industrial Machine Vision Controller, Legacy Avionics / Military System Sustainment.
Telecommunications Backplane Multiplexer
The EP2A70F1508I-8 fits telecom backplane multiplexer designs where its 70K logic elements and high I/O count enable aggregation of multiple low-speed serial streams into higher-rate trunks. The industrial temperature grade supports outdoor cabinet deployments, while APEX II ESBs (Embedded System Blocks) implement FIFOs between backplane and switch fabric. APEX II LVDS support at hundreds of Mbps per pair matches legacy TDM and SONET backplane requirements. Designers typically instantiate LVDS channels with Quartus II altlvds megafunctions and use PLLs for clock recovery. Trade-off: APEX II's 1.8V core consumes more power than modern 28nm FPGAs, so thermal management in sealed outdoor enclosures is critical.
Recommended
ASIC Prototyping Platform
With approximately 70,000 logic elements, the EP2A70F1508I-8 serves as an ASIC prototyping vehicle where engineers validate ASIC RTL before committing to mask sets. MultiCore interconnect provides predictable routing delays that closely emulate ASIC timing, and ESBs prototype SRAM/ROM blocks that will become compiler-generated memory in the final ASIC. The FBGA-1508 package exposes enough I/O to map real-world ASIC pad counts. Use Synopsys Design Compiler or Cadence Genus to synthesize ASIC RTL into APEX II-compatible netlists, then place-and-route with Quartus II. Limitation: APEX II LE architecture differs from standard-cell ASICs, so critical-path validation requires margin.
Recommended
Multi-Channel DSP (Radar / Sonar)
The EP2A70F1508I-8 supports multi-channel DSP pipelines in radar and sonar signal processing, where 70K logic elements implement parallel FFT and beamforming blocks. APEX II's distributed arithmetic capability via ESB-based multipliers enables efficient FIR filter banks, and the 1508-ball BGA exposes enough LVDS pairs to interface directly with high-speed ADCs and DACs. Industrial temperature grade supports ruggedized military and aerospace signal-processing enclosures. Use Quartus II DSP Builder to generate FIR/FFT IP from MATLAB models. Note: APEX II lacks dedicated DSP blocks, so designers consume more LEs for fixed-point math compared to modern Stratix/Cyclone DSP blocks.
Recommended
Broadcast Video Processing Engine
The EP2A70F1508I-8 serves in broadcast video processing where it implements format conversion, scaling, chroma keying, and frame-rate conversion for SDI/HD-SDI streams. APEX II ESBs implement line buffers for temporal processing, while the 70K logic-element budget accommodates multiple video processing channels simultaneously. LVDS I/O at hundreds of Mbps matches HD-SDI bit rates, and PLLs derive pixel clocks from incoming SDI streams. Industrial temperature range supports outside-broadcast vehicle installations. Use Quartus II Video and Image Processing (VIP) Suite megafunctions for color space conversion. Trade-off: APEX II's LUT-based architecture is less power-efficient than modern video-specific ASSPs.
Recommended
Industrial Machine Vision Controller
The EP2A70F1508I-8 controls multi-camera machine vision systems on factory floors, where its 70K logic elements run image preprocessing, feature extraction, and PLC-style actuator control concurrently. Industrial temperature grade (-40C to +100C) tolerates factory thermal environments, while LVDS and LVCMOS I/O interface directly with Camera Link or GigE Vision cameras via bridge ASICs. APEX II PLLs derive pixel clocks from line-scan sensors. Use Quartus II SOPC Builder to integrate Nios II soft processor for high-level decision logic. Consideration: machine vision migration to GigE Vision favors newer Cyclone V SoC with integrated ARM cores for cost-sensitive high-volume deployment.
Recommended
Legacy Avionics / Military System Sustainment
The EP2A70F1508I-8 is used in legacy avionics and military systems where original APEX II designs must be sustained for decades of service life. Military programs often require form-fit-function replacement of obsolete components, and the industrial temperature grade supports avionics bay thermal profiles. Long-term Altera / Intel supply agreements make APEX II procurement viable for defense sustainment, even as commercial customers migrate to newer families. Use case: BGA-1508 footprint allows direct swap with EP2A70F1508C9N (commercial) or EP2A70F1508I-7 (slower speed grade) when industrial parts are scarce. Design notes: confirm CECC/ESCC qualification if required by program specification.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70F1508I-8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70F1508I-7 | EP2A70F1508C9N | EP2A70F1508C8 | EP2A70F1508C7 | EP2A70F1508C9ES | EP2A70F1508C9 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-1508 | FBGA-1508 - same | FBGA-1508 - same | FBGA-1508 - same | FBGA-1508 - same | FBGA-1508 - same | FBGA-1508 - same |
| Logic Elements | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 | 70,000 |
| Speed Grade | -8 | -7 (slower) | -9 (faster) | -8 | -7 (slower) | -9 (faster) | -9 (faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Configuration Memory | SRAM | SRAM | SRAM | SRAM | SRAM | SRAM | SRAM |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND (Engineering Sample) | NRND |
Key Differentiators
- Industrial temperature grade support (vs EP2A70F1508C8)
- Speed grade -8 (mid-range) for balanced Fmax and power (vs EP2A70F1508C9N)
- Highest logic density in FBGA-1508 APEX II family (vs EP2A40F1508)
Design Notes
APEX II FPGAs in the FBGA-1508 package typically dissipate 1-3W static at 1.8V core, rising to 5-8W under full utilization with sustained switching activity. Thermal resistance (theta_JA) for FBGA-1508 with a standard 8-layer PCB and 0 air flow is approximately 8-12 C/W, producing junction temperature rises of 40-100C above ambient. For industrial applications at +100C ambient, use thermal vias under the BGA thermal pad, dedicated copper pours on inner PCB layers, and consider 200-400 LFM forced air. Estimated: based on typical APEX II power consumption profiles; consult device-specific PowerPlay Early Power Estimator for your design utilization.
The FBGA-1508 FineLine BGA requires high-density PCB fabrication: at 1.0mm pitch the trace-escape pattern needs microvia (laser-drilled) stack-up with at least a 4-1-4 or 6-2-6 layer count. Use 0.5oz copper on outer signal layers and 1oz on inner planes. Maintain 50-ohm controlled impedance on LVDS pairs and 60-ohm on DDR memory interfaces if implemented in ESBs. Place decoupling capacitors within 100 mils of every VCCINT/VCCIO pin group; 0.1uF X7R ceramics minimum, with bulk 10uF tantalum or polymer per voltage rail.
Three common pitfalls when designing with EP2A70F1508I-8: (1) Using Quartus Prime instead of Quartus II - APEX II device support was dropped after Quartus II v13.0, so modern Quartus Prime will not synthesize APEX II designs. Archive Quartus II v13.0 installations. (2) Assuming SRAM FPGAs retain configuration - the EP2A70F1508I-8 must be reconfigured on every power-up from external EPC serial configuration device or flash, since internal SRAM is volatile. (3) Over-driving LVDS I/O - APEX II LVDS supports up to 840 Mbps per channel but only on specific I/O banks; check the APEX II pin-out file before assigning LVDS channels in the Quartus pin planner.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not confirmed in the verified web data for EP2A70F1508I-8. APEX II family was released before mandatory RoHS adoption, so some variants may contain lead-bearing BGA balls. The 'N' suffix in EP2A70F1508C9N indicates a lead-free variant - use this if RoHS compliance is required. Contact authorized Altera / Intel distributor for material declaration sheet before design-in. AEC-Q100 is not applicable - APEX II is not automotive qualified.
