Intel

EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel

MPN: EP2AGX260EF29I3G ✓ Active

In Stock Ships in 1-3 business days

0.9 V Vdss 780-BBGA, FCBGA Package 500 MHz Speed

From $1480 USD / Unit

MOQ: 1 |

Price updated: 2026-09-08

Volume Pricing

Qty	Unit Price	Extended
1	$1850	$1,850.00
10	$1720	$17,200.00
100	$1620	$162,000.00
500	$1540	$770,000.00
1,000	$1480	$1,480,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

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EP2AGX260EF29I3G Overview

The Intel EP2AGX260EF29I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements and 12,038,144 bits of embedded memory, fabricated on a 40 nm process node and housed in a 780-ball Flip-Chip BGA (FCBGA) package. It supports a maximum internal operating frequency of up to 500 MHz across its logic fabric and incorporates 372 user I/O pins, making it suitable for high-throughput digital designs.

A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit within the broader category of programmable logic devices (PLDs) > digital integrated circuits > semiconductors. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, transceiver bandwidth, and power efficiency, placing it between Cyclone (low-cost) and Stratix (high-performance) families within Intel's (formerly Altera's) FPGA portfolio.

Key features of the EP2AGX260EF29I3G include 244,188 logic elements, 12 Mbits of embedded memory, integrated transceivers supporting multi-gigabit serial interfaces, on-chip multipliers for DSP operations, and a 0.9 V core supply. The 40 nm process technology provides an optimal balance between static and dynamic power consumption, which is critical for thermally constrained embedded systems.

The architecture combines a lookup-table-based logic fabric with hard DSP blocks, block RAM (M9K/M144K), and high-speed serial transceivers. This heterogeneous structure enables designers to implement complex signal processing pipelines, packet processing engines, and high-speed interface bridging without sacrificing logic utilization.

Typical applications include wireless baseband processing, high-definition video broadcast equipment, military secure communications, industrial machine vision, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The industrial temperature grade (-40C to +100C) makes it appropriate for harsh-environment deployments.

When designing with this device, ensure proper power decoupling and thermal management. The 780-ball FCBGA package requires controlled-impedance PCB stackup and high-quality BGA assembly processes. Designers should reference the manufacturer datasheet for transceiver channel placement, PLL configuration, and I/O standard support.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for EP2AGX260EF29I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX260EF29I3G (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Process Technology, Mounting Type.

EP2AGX260EF29C4G

Intel

Operating Temperature: 0C to +85C (commercial)

Package: 780-BBGA, FCBGA (29 mm)

Speed Grade: C4 (commercial, performance-optimized)