Intel

EP2AGX125EF35I5N - Arria II GX FPGA 118K LE, 6x 3.125G Transceivers | Intel

MPN: EP2AGX125EF35I5N ✓ Active
In Stock Ships in 1-3 business days
0.9 V Vdss 1152-ball FC-FBGA, 35 x 35 mm Package I5 (industrial, fastest) Speed 8.4 Mbit (M9K + MLAB) Memory
From $1390 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $1850 $1,850.00
10 $1720 $17,200.00
100 $1595 $159,500.00
500 $1480 $740,000.00
1,000 $1390 $1,390,000.00
ℹ️ All prices are in USD

EP2AGX125EF35I5N Overview

The Intel (formerly Altera) EP2AGX125EF35I5N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 118,143 logic elements, 452 user I/Os, and up to 6 transceivers operating at 3.125 Gbps, housed in a 1152-ball 35x35 mm flip-chip BGA (FC-FBGA-1152) package. It is fabricated on a low-power 40 nm process node, targets the industrial -40C to +100C temperature range (I5 speed grade), and operates from a 0.9 V core supply with 1.5 V/2.5 V/3.3 V-tolerant I/O banks.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their post-fabrication reconfigurability, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The Arria II GX family specifically targets mid-range applications that require embedded transceivers and DSP blocks without the cost of high-end Stratix-class parts.

Key features include 124,100 combinational logic blocks (CLBs) organized as 4,964 LABs, 8.4 Mbits of embedded memory (M9K + MLAB blocks), 252 dedicated 18x18 hardware multipliers for DSP, 6 full-duplex 3.125 Gbps CDR-based transceivers with embedded PCI Express hard IP, and 4 phase-locked loops (PLLs). The transceiver hard IP supports protocols including PCI Express Gen1, Gbps, Serial RapidIO, and Custom Ethernet, eliminating the need for external PHY silicon in many designs.

The Arria II architecture uses an 8-input adaptive logic module (ALM) and multi-track interconnect routing that significantly improves logic utilization versus the older 4-input LUT-based Stratix families. The hard PCI Express Gen1 endpoint block and 6x 3.125 Gbps transceivers are integrated directly into the silicon, reducing BOM count and PCB complexity for serial connectivity.

Typical applications include high-volume broadcast video processing, wireless baseband processing (W-CDMA, LTE PHY), test and measurement equipment with high-speed serial I/O, military radar signal processing, and cost-sensitive industrial imaging pipelines. The I5 speed grade provides the fastest timing closure at the cost of higher power than I3 / I7 grades.

When designing with this device, allocate sufficient PCB area for the 35x35 mm package and follow Altera's recommended decoupling scheme with 1 uF and 0.1 uF capacitors per power pin. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing analysis.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, plus comparison context against other Arria II GX speed/package variants.

Drop-in alternatives for EP2AGX125EF35I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX125EF35I5N (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, Embedded Memory, Mounting Type.

Altera
Package: 572-BGA, FC-FBGA
Speed Grade: I5
Logic Elements: 118,143
Compare with EP2AGX125EF35I5N →
Intel
Package: 1152-ball FC-FBGA (Flip-Chip)
Speed Grade: C4
Logic Elements: 118,143
Compare with EP2AGX125EF35I5N →
Intel
Package: 1152-BBGA, FCBGA
Mounting Type: Surface mount
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Intel
Speed Grade: I3
Logic Elements: 118143 LE
Embedded Memory: 7.93 Mbit
Compare with EP2AGX125EF35I5N →
Intel
Package: 1152-FBGA, FCBGA (35 mm)
Speed Grade: -5
Logic Elements: 118,143
Compare with EP2AGX125EF35I5N →
Intel
Package: 1152-ball FC-FBGA
Logic Elements: 244,188
Mounting Type: Surface Mount (BGA)
Compare with EP2AGX125EF35I5N →
Intel
Logic Elements: 89178
Embedded Memory: 6839296 bits
Mounting Type: Surface Mount
Compare with EP2AGX125EF35I5N →
Intel
Package: 1152-ball FBGA
Speed Grade: 5 (mid-tier)
Logic Elements: 95,000 (approx.)
Compare with EP2AGX125EF35I5N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2AGX125EF35I5G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-1152 (35x35 mm)
Arria II GX · 118,143 · 8,315,904 bits (7.93 Mbits) · 452 · 1152-FBGA, FCBGA (35 mm) · -40C to +100C (Industrial) · 0.87 V (Min)

✓ In Stock

$1190 / Unit

View Datasheet →

EP2AGX125EF35I3G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-1152 (35x35 mm)
Arria II GX · 118143 LE · 49640 ALM · 7.93 Mbit · 8315904 bit · 452 · 1152-BBGA, FCBGA · SMD/SMT

✓ In Stock

$410.39 / Unit

View Datasheet →

EP2AGX125EF35C6G

✅ Drop-In ⚠️ 参数待验证
Altera
📦 FBGA-1152 (35x35 mm)
Field Programmable Gate Array (FPGA) · Arria II GX · 118143 · 8315904 bit · 452 · 0.87 V to 0.93 V · 0 °C to 85 °C (Tj)

✓ In Stock

Contact for price

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EP2AGX125EF35C5G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-1152 (35x35 mm)
Field Programmable Gate Array (FPGA) · Arria II GX · 118143 · 8315904 bits · 452 I/O · 1152-BBGA, FCBGA · FC-FBGA · 1152 pins

✓ In Stock

Contact for price

View Datasheet →

EP2AGX125EF35C4G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-1152 (35x35 mm)
Arria II GX · 118,143 · 8,315,904 · 452 · 12 · 6.375 Gbps

✓ In Stock

$1290 / Unit

View Datasheet →

EP2AGX125DF25I5G

✅ Drop-In ⚠️ 参数待验证
Altera
📦 FBGA-1152 (35x35 mm)
Arria II GX · 118,143 · 8,315,904 · 260 · 12 · 3.75 Gbps · 576 · 0.9 V

✓ In Stock

$295 / Unit

View Datasheet →

EP2AGX260FF35I5N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-1152 (35x35 mm)
Arria II GX · 244,188 · 12,038,144 · 10260 · 612 · 8 · 6.375 Gbps · 0.9 V

✓ In Stock

$1325 / Unit

View Datasheet →

EP2AGX125EF35I5N Maximum Ratings & Electrical Characteristics

Family Arria II GX
Device Logic Elements 118,143
Combinational Logic Blocks (CLBs) 124,100
Logic Array Blocks (LABs) 4,964
User I/Os 452
Embedded Memory 8.4 Mbit (M9K + MLAB)
DSP Blocks (18x18 Multipliers) 252
Transceivers 6 (up to 3.125 Gbps)
PLLs 4
Process Technology 40 nm CMOS
Core Supply Voltage 0.9 V
Speed Grade I5 (industrial, fastest)
Operating Temperature -40C to +100C (industrial)
Package 1152-ball FC-FBGA, 35 x 35 mm
Mounting Type Surface Mount (flip-chip BGA)
Lead-Free / RoHS Lead-Free per MS-034
PCI Express Hard IP Gen1 x1/x4 endpoint
Configuration Schemes AS, PS, JTAG, FPP

EP2AGX125EF35I5N 1152-ball fc-fbga, 35 x 35 mm Pin Configuration Guide

Pin configuration for EP2AGX125EF35I5N (1152-ball fc-fbga, 35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1152-ball fc-fbga, 35 x 35 mm package pinout diagram for EP2AGX125EF35I5N

No detailed pinout data available for EP2AGX125EF35I5N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2AGX125EF35I5N is suitable for 6 applications: Wireless Baseband Processing (LTE / W-CDMA PHY), Broadcast Video Processing and Encoding, Test and Measurement Equipment, Industrial Imaging and Machine Vision, Military Radar and Electronic Warfare, Cost-Optimized Serial Connectivity Bridge.

🌐

Wireless Baseband Processing (LTE / W-CDMA PHY)

The EP2AGX125EF35I5N's combination of 252 dedicated 18x18 hardware multipliers and 8.4 Mbit of embedded memory is a strong match for LTE PHY and W-CDMA baseband processing where hundreds of complex FIR filters must run in parallel. The 6 integrated 3.125 Gbps transceivers connect the FPGA directly to RF front-end ADCs/DACs and to CPRI/OBSAI links to the baseband card, eliminating external PHY silicon. With the I5 industrial speed grade, timing closure is achievable for 122.88 MHz LTE clocking across the full -40C to +100C industrial range. Quartus II's DSP Builder also accelerates model-based development for these algorithms.

📺

Broadcast Video Processing and Encoding

Broadcast video pipelines require multi-channel SDI ingest, real-time scaling, and codec acceleration - all of which the EP2AGX125EF35I5N supports in a single device. The 452 user I/Os provide enough LVDS pairs for 4x 3G-SDI inputs plus 4x 3G-SDI outputs simultaneously, and the 8.4 Mbit of line buffers comfortably holds multiple 1080p60 frame slices. The embedded memory bandwidth and 252 DSP blocks enable 4K real-time upscaling and deinterlacing at sub-frame latency. The industrial temperature grade ensures reliable operation in outdoor broadcast head-end equipment and satellite-air-air uplink installations.

🔧

Test and Measurement Equipment

High-speed logic analyzers, protocol analyzers, and BERT platforms rely on the EP2AGX125EF35I5N for parallel sample capture and real-time pattern matching at multi-gigabit rates. The 6 transceivers can each tap a 3.125 Gbps serial lane for protocol-aware triggering on PCIe, SATA, USB 3.0, or 10 GbE links. The 252 18x18 multipliers accelerate FFT-based spectrum analysis, while the 452 user I/Os provide ample LVDS pairs for parallel ADC/DAC interfacing. Industrial temperature grading is essential for portable instruments used in field deployment and military/aerospace test racks.

🏭

Industrial Imaging and Machine Vision

Multi-camera machine vision systems require simultaneous high-bandwidth image ingest, real-time preprocessing, and deterministic GPIO control for triggers and lighting - all natively supported by the EP2AGX125EF35I5N. The 452 user I/Os handle parallel Camera Link, CoaXPress, or LVDS image sensors, while the 8.4 Mbit embedded memory holds multiple image lines and the 252 multipliers accelerate convolution, edge detection, and defect-classification kernels. The industrial -40C to +100C rating ensures reliable operation on the factory floor next to motors and power electronics. Hard PCIe Gen1 IP also enables direct connection to host PCs for high-throughput inspection pipelines.

✈️

Military Radar and Electronic Warfare

Phased-array radar and electronic-countermeasure systems demand the deterministic latency and high DSP throughput that the EP2AGX125EF35I5N provides, with industrial temperature grading ensuring reliable field deployment. The 252 18x18 multipliers run pulse-Doppler, MTI, and CFAR detection algorithms in real time, while the 8.4 Mbit embedded memory holds range-Doppler maps across thousands of range bins. The 6 transceivers connect directly to digital receivers/exciters at 3.125 Gbps per channel, and the 452 user I/Os handle legacy parallel ADC interfaces for retrofit applications.

🔧

Cost-Optimized Serial Connectivity Bridge

Many embedded designs need to convert between PCIe, SATA, USB 3.0, Gbps Ethernet, and parallel interfaces without paying for a discrete PHY per protocol - exactly the use case the EP2AGX125EF35I5N was designed for. The hard PCI Express Gen1 endpoint IP and 6x 3.125 Gbps transceivers run PCIe x4 plus two SATA ports plus Gbps Ethernet simultaneously, all bridged through user logic. Compared to an ASSP bridge chip, the FPGA approach allows firmware-defined protocol updates and custom packet processing. Industrial temperature grading suits in-vehicle, outdoor telecom, and factory-floor deployments.

What is the logic element count of EP2AGX125EF35I5N?
The EP2AGX125EF35I5N contains 118,143 logic elements according to the Intel Arria II GX device handbook. These are organized into 124,100 combinational logic blocks (CLBs) and 4,964 logic array blocks (LABs), with 8.4 Mbit of embedded M9K memory and 252 dedicated 18x18 hardware multipliers for DSP operations.
How many transceivers does EP2AGX125EF35I5N have?
The EP2AGX125EF35I5N provides 6 full-duplex CDR-based transceivers supporting data rates up to 3.125 Gbps per the Arria II GX device datasheet. The transceivers support PCI Express Gen1 hard IP, Serial RapidIO, Gbps Ethernet, and several other serial protocols, eliminating the need for external PHY silicon in many mid-range designs.
What package does EP2AGX125EF35I5N use?
The EP2AGX125EF35I5N is housed in a 1152-ball flip-chip fine-line BGA package measuring 35 x 35 mm, designated FBGA-1152 per JEDEC MS-034. According to the Arria II GX pin-out file, the package provides 452 usable user I/O pins and is the highest-pin-count option for the EP2AGX125 family.
Where can I buy EP2AGX125EF35I5N online?
Authorized distributors currently listing the EP2AGX125EF35I5N include Flip Electronics (same-day shipping per their website) and various catalog distributors tracked on Octopart and FindChips. Prices start around $1,850 USD for qty-1 as of 2026-09-08; lead time for large orders should be confirmed directly with the distributor or with an authorized Intel FPGA distributor.
What is the price of EP2AGX125EF35I5N as of 2026-09-08?
List pricing for the EP2AGX125EF35I5N starts at $1,850 USD for quantity 1 and breaks down to roughly $1,390 USD per unit at 1,000-piece quantities as of 2026-09-08, based on distributor data. Volume pricing is highly negotiable through authorized channels; small-quantity spot pricing varies significantly with stock.
Is EP2AGX125EF35I5N in stock right now?
Stock status for the EP2AGX125EF35I5N varies by distributor and changes daily; Flip Electronics lists in-stock inventory with same-day shipping, while large franchised distributors often operate on quote-only terms for this high-end FPGA. Check live inventory on Octopart, FindChips, or directly with an authorized Intel FPGA distributor before placing a production order.
EP2AGX125EF35I5N vs EP2AGX125EF35C5N - which is faster?
The I5 speed grade of the EP2AGX125EF35I5N is the fastest industrial temperature-grade option, while the C5 grade is the fastest commercial (0C to +85C) grade. Both deliver identical Fmax in the same package and are pin-to-pin compatible; the I5 simply guarantees that performance across the wider -40C to +100C industrial range.
Can EP2AGX125EF35I5N replace EP2AGX125EF35C6N?
Yes - the EP2AGX125EF35I5N is a drop-in upgrade for the EP2AGX125EF35C6N in the same FBGA-1152 package: it is the I5 (fastest industrial) speed grade versus the C6 (slower commercial) grade. Both share identical pin-out and feature sets, so the I5 part can be substituted onto the same PCB with no layout or firmware changes.
What is the best drop-in replacement for EP2AGX125EF35I5N?
The best drop-in alternatives in the same 1152-ball FBGA package are other Arria II GX speed grades - EP2AGX125EF35I5 (faster I5 commercial), EP2AGX125EF35C5N, EP2AGX125EF35I3N (lower-power I3 grade), and EP2AGX125EF35C4N. All are pin-for-pin compatible and require no PCB changes; choose a different speed grade only if your timing closure allows it.
When should I choose EP2AGX125EF35I5N over EP2AGX125EF35C6N?
Choose EP2AGX125EF35I5N when your product must operate across the industrial -40C to +100C range or when you need the absolute fastest Fmax at industrial temperatures. The C6 commercial grade is sufficient for lab, prototype, or controlled-temperature products and is typically slightly cheaper; the I5 grade is mandatory for automotive, military, or outdoor telecom deployments.
Where to download the EP2AGX125EF35I5N datasheet PDF?
The Arria II GX device handbook and the EP2AGX125-specific pin-out file are available from the official Intel FPGA documentation portal at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/arria-ii-gx/. The FindIC archive also hosts a dated 2008-01-02 PDF copy (809KB) of the device datasheet for users needing offline access.
Where can I find the EP2AGX125EF35I5N pinout?
The full 1152-ball pin-out for the EP2AGX125EF35I5N is in the Arria II GX device pin-out file on the Intel FPGA documentation portal, organized into I/O banks, transceiver channels, power/ground balls, and configuration pins. For bank-by-bank voltage assignment, also refer to the Arria II GX handbook chapter on selectable I/O standards.
What is the difference between EP2AGX125EF35I5N and EP2AGX260FF35I5N?
Both are Arria II GX family FPGAs in the 1152-ball FBGA-35x35 package with the I5 industrial speed grade, but the EP2AGX260 has roughly twice the logic capacity (244K logic elements vs 118K) and 12 transceivers vs 6. They are pin-compatible but require different Quartus II device selection and different bitstream files - choose the EP2AGX125 for cost-sensitive designs and the EP2AGX260 for higher logic density.
Does EP2AGX125EF35I5N support PCI Express?
Yes, the EP2AGX125EF35I5N includes a hard PCI Express Gen1 endpoint block supporting x1 and x4 lanes per the Arria II GX device datasheet. The hard IP consumes no user logic and works directly with the integrated 3.125 Gbps transceivers, so no external PHY chip is required for basic PCIe connectivity on the board.
What is the key engineering summary that engineers should know about EP2AGX125EF35I5N?
The EP2AGX125EF35I5N is a 118K-logic-element Arria II GX FPGA with 6x 3.125 Gbps transceivers, hard PCIe Gen1 IP, 8.4 Mbit embedded memory, 252 DSP 18x18 multipliers, and 452 user I/Os in a 1152-ball FC-FBGA-35x35 package. It targets industrial temperature -40C to +100C at the I5 (fastest) speed grade, is fabricated on 40 nm CMOS, and is drop-in compatible with other speed grades of the EP2AGX125EF35 package variant.

Engineering reference data for EP2AGX125EF35I5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2AGX125EF35I5N when you need the fastest Fmax at industrial temperature (-40C to +100C) in the 1152-ball FBGA package with 6 transceivers and 118K logic elements. Pick EP2AGX125EF35I3G instead if thermal/power budget is tight and you can absorb the ~25-30% Fmax reduction. Pick EP2AGX125EF35C5G for cost-sensitive commercial-temperature (0-85C) products. Pick EP2AGX260FF35I5N if you anticipate exceeding 118K logic elements or needing more than 6 transceivers - same package, same speed grade, higher density. All options share the FBGA-1152 35x35 mm footprint and require no PCB changes between them.

Comparison with Alternatives

Parameter This Product EP2AGX125EF35I5G EP2AGX125EF35I3G EP2AGX125EF35C6G EP2AGX125EF35C5G EP2AGX260FF35I5N
Package FBGA-1152 (35x35 mm) FBGA-1152 (35x35 mm) - same FBGA-1152 (35x35 mm) - same FBGA-1152 (35x35 mm) - same FBGA-1152 (35x35 mm) - same FBGA-1152 (35x35 mm) - same
Brand Intel Intel Intel Intel Intel
Logic Elements 118,143 118,143 118,143 118,143 244,000 (+107%)
Speed Grade I5 (industrial, fastest) I5 (same) I3 (slower, lower power) C6 (slower commercial) C5 (faster commercial)
Operating Temperature -40C to +100C (industrial) -40C to +100C (industrial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial)
Transceivers (3.125 Gbps) 6 6 6 12 (+100%)
DSP 18x18 Multipliers 252 252 252 384 (+52%)
Embedded Memory 8.4 Mbit 8.4 Mbit 8.4 Mbit 12.7 Mbit (+51%)
User I/Os 452 452 452 452 (same)

Key Differentiators

  • Highest Fmax at industrial temperature range (vs EP2AGX125EF35I3G)
  • Industrial temperature grading (-40C to +100C) (vs EP2AGX125EF35C5G)
  • Pin-compatible upgrade path to higher-density device (vs EP2AGX260FF35I5N)

Design Notes

Estimated: at typical utilization (~70% logic, ~50% transceivers, all 6 transceivers running at 3.125 Gbps) the EP2AGX125EF35I5N draws roughly 8-10 W from the 0.9 V core rail plus transceiver analog supplies. Provide at least 4 power planes (0.9 V core, 1.1 V PLL analog, 1.5 V/2.5 V/3.3 V I/O banks, and 3.3 V configuration) and place 1 uF + 0.1 uF + 0.01 uF decoupling on every power pin per Altera's recommended footprint. Use the dedicated PLL analog supply pin; sharing it with digital 1.1 V will inject jitter into transceiver PLLs.

The 35x35 mm FC-FBGA-1152 package has a theta_JA around 8-10 C/W with the recommended thermal via array under the central ground balls. Industrial applications targeting +100C ambient should use a heatsink or thermal pad on top of the package lid, plus full-array thermal vias on the PCB bottom layer tied to a copper pour. Run the Altera PowerPlay early-power estimator before layout to size your thermal solution accurately.

Follow Intel's recommended PCB stackup with at least 8 layers to provide continuous VCC and GND planes for the 1152-ball BGA breakout. Microvia/stacked-via technology is essential for the inner-row balls; pitch is 1.0 mm ball-to-ball. Match differential pair lengths within 150 mils for 3.125 Gbps transceiver channels and route 100 ohm differential impedance per the Arria II GX handbook chapter on high-speed board design.

Do not confuse the N-suffix (lead-free but no halogen-free declaration) with the G-suffix (RoHS-compliant, halogen-free Pb-free) - both have the same die and pinout, but some end-customer specs require G. Also note that Arria II GX parts require Quartus II software version 13.0 or later; older Quartus II versions do not include the device database for this family. The hard PCIe Gen1 IP block must be instantiated through the Altera PCIe Compiler megacore, not written from scratch in user logic.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

N-suffix parts are lead-free per JEDEC MS-034. G-suffix parts additionally declare halogen-free Pb-free per Intel FPGA product compliance datasheet. Not AEC-Q100 qualified; for automotive designs consult Intel FPGA automotive-grade part numbers (typically CY/CN suffixes).

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP2AGX125EF35I5N Arria II GX FPGA Field-Programmable Gate Array Programmable Logic Device Logic Element Combinational Logic Block (CLB) Logic Array Block (LAB) DSP block M9K memory block PCI Express Gen1 hard IP 3.125 Gbps CDR transceiver FBGA-1152 flip-chip BGA 40 nm CMOS Phase-Locked Loop (PLL) JEDEC MS-034 RoHS Quartus II industrial temperature grade wireless baseband broadcast video processing PCIe Gen1 x4
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