EP2AGX125EF35C6G Arria II GX FPGA | Altera | Signal Processing
MPN: EP2AGX125EF35C6G β End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2AGX125EF35C6G Overview
A field-programmable gate array, or FPGA, is a semiconductor device built from configurable logic blocks, programmable interconnects, and dedicated functional resources. In the system hierarchy, an FPGA sits between a general-purpose processor and fixed-function application-specific integrated circuits: firmware-defined logic can implement parallel processing, interface bridging, protocol handling, and digital signal processing while retaining design flexibility. Embedded RAM reduces dependence on external memory for buffers, FIFOs, lookup tables, and transient data storage.
The principal verified resources are 118,143 logic elements, 8,315,904 total RAM bits, and 452 user I/O pins. The device uses 1152-FBGA packaging and supports a junction-temperature operating range of 0 Β°C to 85 Β°C. Its 0.87 V to 0.93 V core-supply range requires a tightly controlled power distribution network. These characteristics make the part appropriate for systems that need high logic density, broad memory capacity, and a large number of board-level connections.
From an architectural perspective, the FPGA combines programmable logic fabric with embedded memory resources distributed throughout the fabric. Designers can instantiate parallel datapaths, state machines, communication controllers, and signal-processing structures, then route them through programmable interconnect. Because the verified data does not provide transceiver count, speed grade, logic-cell architecture detail, or maximum operating frequency, those parameters must not be inferred. Engineers should consult the complete manufacturer datasheet and device-family documentation before setting clock budgets or selecting configuration circuitry.
Typical applications include real-time signal processing, industrial control, communications infrastructure, image and video processing, and high-throughput test equipment. Its 118,143 logic elements support complex parallel processing, while 8,315,904 RAM bits can hold data samples and protocol packets. The 452 user I/O pins are particularly useful where the FPGA must bridge sensors, memories, converters, network interfaces, and backplane connectors concurrently.
The main design constraint is power integrity. A 0.87 V to 0.93 V core rail must use suitable regulation, local decoupling, and low-impedance PCB planes. Designers should also validate I/O banking, configuration pins, signal-integrity requirements, thermal behavior, and ball assignment against the manufacturer package documentation. The verified data does not include sufficient detail to specify those constraints numerically.
This product record combines verified architecture, memory, I/O, package, supply, and temperature data with package-compatible comparison guidance and procurement references. Unlike a distributor listing alone, it distinguishes confirmed values from parameters requiring datasheet validation and avoids inventing unavailable electrical or mechanical details.
Drop-in alternatives for EP2AGX125EF35C6G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125EF35C6G (same form factor and footprint) β differing in Speed Grade, Mounting Type, Package, Operating Temperature, Embedded Memory.
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| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Arria II GX |
| Number of Logic Elements/Cells | 118143 |
| Total RAM Bits | 8315904 bit |
| User I/O Pins | 452 |
| Core Supply Voltage | 0.87 V to 0.93 V |
| Operating Temperature | 0 Β°C to 85 Β°C (Tj) |
| Package Type | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA (35 mm x 35 mm) |
| Package Pin Count | 1152 pin |
EP2AGX125EF35C6G 1152 pin Pin Configuration Guide
Pin configuration for EP2AGX125EF35C6G (1152 pin package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125EF35C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125EF35C6G is suitable for 6 applications: Real-Time Digital Signal Processing, Industrial Automation and Control, Communications Infrastructure Equipment, Image and Video Processing, Test and Measurement Instrumentation, High-Throughput Data Aggregation.
Real-Time Digital Signal Processing
The EP2AGX125EF35C6G fits real-time digital signal-processing systems because it combines 118143 logic elements with 8315904 RAM bits. The logic resources can implement parallel filters, transforms, detection paths, and control state machines, while embedded memory can hold sample windows, coefficients, intermediate vectors, and delay lines. Its 452 user I/O pins also help the FPGA aggregate converters, clocks, memories, and downstream processing devices. The design should use the confirmed resources as capacity inputs, but actual throughput must be established through synthesis, timing closure, and power analysis. The supplied data does not specify DSP-block count, multiplier count, or maximum clock frequency, so those parameters require manufacturer-datasheet verification before architecture sign-off.
Recommended
Industrial Automation and Control
The EP2AGX125EF35C6G is suitable for industrial automation controllers that must coordinate many sensors, actuators, motion interfaces, and communication links. Its 118143 logic elements provide capacity for protocol handling, deterministic control loops, safety interlocks, and real-time state machines, while 8315904 RAM bits can buffer process data and communication packets. The verified 452 user I/O count is valuable for equipment that must bridge several buses and peripherals without an additional programmable-logic device. Designers must still verify I/O-bank voltage, pin multiplexing, isolation, termination, and timing because those values are not included in the supplied evidence. The 0.87 V to 0.93 V core range also requires a carefully designed, low-noise power distribution network and a manufacturer-approved startup sequence.
Recommended
Communications Infrastructure Equipment
The EP2AGX125EF35C6G can support communications infrastructure equipment that needs parallel packet processing, protocol conversion, traffic management, and multiple external interfaces. Its 118143 logic elements are appropriate for large control graphs and data-path logic, while 8315904 RAM bits can store packet descriptors, queues, lookup tables, and temporary payloads. The verified 452 user I/O pins allow integration with memory interfaces, network controllers, clock devices, and management processors. However, the supplied data does not state transceiver count, lane rate, encoding support, or maximum operating frequency. Engineers should not infer a communications speed grade from the Arria II GX family name alone. Interface electrical compliance, clock recovery, jitter, and board-level signal integrity must be validated against the manufacturer device documentation.
Recommended
Image and Video Processing
The EP2AGX125EF35C6G is a strong candidate for image and video processing where pixel data, frame buffers, and control logic must operate in parallel. Its 118143 logic elements can implement filtering, color conversion, feature extraction, and frame orchestration, while 8315904 RAM bits support line buffers, lookup tables, and intermediate frame data. The verified 452 user I/O pins help connect image sensors, display controllers, memories, and high-speed source or sink interfaces. The supplied evidence does not provide serial-transceiver resources, memory-interface width, clock limits, or DSP multiplier count, so throughput and line-rate feasibility cannot be calculated from the available data. Designers should use the complete device family documentation and perform representative image-processing benchmarks with real timing constraints.
Recommended
Test and Measurement Instrumentation
The EP2AGX125EF35C6G fits test and measurement equipment that needs deterministic acquisition, analysis, buffering, and instrument control in one programmable device. The 118143 logic elements can coordinate ADC and DAC interfaces, trigger logic, digital processing, and communication protocols. The verified 8315904 RAM bits provide capacity for waveform samples, capture windows, histograms, and transfer buffers, while 452 user I/O pins support multiple measurement channels and control connections. The supplied data does not specify converter compatibility, serializer/deserializer resources, clock performance, or I/O standards, so those details must be checked before selection. For high measurement accuracy, design attention should focus on low-noise power, clock distribution, grounding, thermal stability, and deterministic firmware constraints rather than relying on logic-element count alone.
Recommended
High-Throughput Data Aggregation
The EP2AGX125EF35C6G is well matched to high-throughput aggregation systems that ingest data from several sources and combine it into a processing or storage pipeline. Its 118143 logic elements can implement parallel parsers, routing, correlation, and control logic. The verified 8315904 RAM bits provide buffering for bursts, packet metadata, and intermediate results, while 452 user I/O pins allow broad connectivity to sensors, converters, memories, and back-end processors. Because the supplied data does not identify transceiver count, maximum I/O rate, memory-interface performance, or clock limits, designers must establish throughput through interface specifications and timing analysis. The 1152-FBGA, 35 mm x 35 mm package also demands controlled escape routing, reference-plane continuity, and an early package-ball review.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125EF35C6G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Altera |
| Package | 1152-BBGA, FCBGA; 1152-FBGA (35 mm x 35 mm) |
| Logic Elements | 118143 |
| Total RAM | 8315904 bit |
| User I/O | 452 |
| Core Supply | 0.87 V to 0.93 V |
| Operating Temperature | 0 Β°C to 85 Β°C (Tj) |
| Lifecycle Status | Unknown |
Key Differentiators
- High verified user-I/O capacity (vs EP2AGX125EF29C6G)
- Large verified embedded-memory capacity (vs EP2AGX125DF25C6G)
- High-density logic resource (vs EP2AGX125EF35C5G)
Design Notes
Design the core power network from the verified 0.87 V to 0.93 V supply range, not from a generic FPGA-current estimate. Select a regulator with sufficient transient response and verify all required power domains, tolerances, sequencing, and discharge behavior in the manufacturer documentation. Place local decoupling close to the relevant package balls and maintain continuous low-impedance planes. The supplied evidence does not include current consumption, regulator requirements, capacitor values, or power-up timing, so those details must be obtained before schematic release.
Treat the 1152-FBGA, 35 mm x 35 mm package as a high-density escape-routing constraint. Start with the official ball map and package drawing, then create a via and fanout plan that preserves reference planes and avoids routing through sensitive regions. The supplied data does not include the complete ball assignment, layer stack-up recommendation, via geometry, paste aperture, or keepout dimensions. Those values must be verified rather than inferred. Confirm the land pattern against the manufacturer's package outline and run signal-integrity and manufacturability reviews before fabrication.
Use the verified 0 Β°C to 85 Β°C junction-temperature range as an environmental boundary, but do not assume that it is a complete thermal solution. The supplied data does not provide junction-to-ambient resistance, junction-to-case resistance, power consumption, airflow, or thermal derating curves. Build a worst-case activity model including logic, memory, I/O, clocks, and configuration, then use the manufacturer's thermal model with board and enclosure conditions. Provide copper spreading, airflow, and heat paths appropriate to the final system, and measure critical temperatures during hardware validation.
Plan clocks, high-speed data, and power delivery together because the available evidence confirms 452 user I/O pins but not lane rate, I/O standard, or transceiver count. Obtain the official I/O-bank and timing documentation, assign compatible voltage domains, and verify termination, impedance, clock topology, and return paths. Avoid using the family name as a substitute for electrical limits. Representative post-route simulations and bench measurements are recommended before high-volume release, particularly for interfaces that approach the device's unverified performance envelope.
Do not assume that a same-family MPN is a drop-in replacement. Site-list candidates with similar EP2AGX125EF prefixes may differ in temperature, speed, package, ball assignment, resources, or supported tooling. Do not infer missing values such as DSP blocks, transceiver count, maximum frequency, configuration method, or compliance status. Obtain the exact manufacturer ordering guide, package drawing, device handbook, and environmental declaration for the selected MPN. Verify the full schematic, power sequence, configuration interface, and pinout before committing to a replacement or new production design.
Compliance Information
The verified web data provides no RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 statement. Aec_q100 is reported as not_applicable only because no automotive qualification evidence was provided; this is not a claim that the device is automotive-qualified.
