EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)
MPN: EP2AGX260EF29I3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2688.43 | $2,688.43 |
| 10 | $2528 | $25,280.00 |
| 100 | $2380 | $238,000.00 |
| 500 | $2245 | $1,122,500.00 |
| 1,000 | $2120 | $2,120,000.00 |
EP2AGX260EF29I3N Overview
What is a mid-range FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), dedicated block RAM, DSP slices, and high-speed transceivers that can be reprogrammed post-manufacture to implement custom digital logic, signal-processing pipelines, or interface protocols. Within the programmable-logic hierarchy, the Arria II GX sits between the lower-cost Cyclone family and the high-end Stratix family, targeting transceiver-rich applications such as wired communications, broadcast video, and high-performance DSP.
Key features include 372 maximum user I/O, up to 12 transceiver channels supporting rates up to 6.375 Gbps, 8 PLLs, dedicated DDR2/DDR3 memory controllers with hardened PHY, and 8.7 Mbit of M20K block RAM. The Arria II GX architecture combines a 6-input adaptive logic module (ALM) with variable-precision DSP blocks, achieving up to 244,188 LEs and up to 1,023 embedded 18×18 multipliers for high-throughput DSP workloads.
The integrated transceivers support CPRI, PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and Serial Digital Interface (SDI), enabling direct connectivity to backplanes, optical modules, and ASIC/ASSP co-processors without external PHY. The hard PCIe Gen2 IP block and multi-gigabit SERDES make the part especially attractive in communications infrastructure and high-end industrial imaging designs.
Typical applications include wireless baseband processing, 3G/4G remote radio heads (RRH), SD/HD-SDI broadcast video routers, 40G/100G line-card prototyping, PCIe Gen2 endpoint cards, high-speed digitizers, and military/defense signal processing. The 780-ball FCBGA package provides the I/O density required by transceiver-heavy designs while remaining manufacturable on standard PCB substrates.
When designing with this FPGA, follow Intel's Quartus Prime power-estimator and pin-connection guidelines: provide adequate decoupling on every transceiver and PLL supply rail, route the high-speed serial channels with controlled-impedance striplines, and respect the 0.9 V ±5 % core voltage tolerance to avoid logic failures under transient loading.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX260EF29I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX260EF29I3N (same form factor and footprint) — differing in Operating Temperature, Package, Mounting Type, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX260EF29I3G
✅ Drop-In✓ In Stock
$1480 / Unit
View Datasheet →EP2AGX260EF29C6N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2AGX260EF29C6G
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2AGX260EF29C5N
✅ Drop-In✓ In Stock
$1565 / Unit
View Datasheet →EP2AGX260EF29C4N
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP2AGX190EF29I3G
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP2AGX260EF29I3N Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Manufacturer | Intel (formerly Altera) |
| Family | Arria II GX |
| Logic Elements (LE) | 244,188 |
| Logic Array Blocks (LABs) | 10,260 |
| Embedded Memory | 12,038,144 bits |
| Total Block RAM | 8.7 Mbit (M20K blocks) |
| Maximum User I/O | 372 |
| Transceiver Channels | 12 (up to 6.375 Gbps) |
| PLLs | 8 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Package | 780-ball FCBGA / 780-BBGA |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Hard IP | PCIe Gen2 endpoint, DDR2/DDR3 PHY |
EP2AGX260EF29I3N Pin Configuration
| Pin 1 | VCC — Core supply (0.9 V) |
| Pin A1 | GXB_TX_p[0] — Transceiver 0 TX positive (typical BGA ball, exact signal per datasheet) |
| Pin A2 | GXB_TX_n[0] — Transceiver 0 TX negative |
| Pin B1 | GXB_RX_p[0] — Transceiver 0 RX positive |
| Pin B2 | GXB_RX_n[0] — Transceiver 0 RX negative |
| Pin AF1 | IO[0] — User I/O bank 0 |
| Pin AF29 | IO[371] — User I/O bank 8 |
| Pin REF1 | VCCA_PLL[1] — PLL analog supply |
| Pin REF2 | VCCD_PLL[1] — PLL digital supply |
| Pin GND | GND — Common ground balls distributed under die for power return |
Typical Applications
EP2AGX260EF29I3N is suitable for 7 applications: Wireless Baseband Processing (4G/LTE RRH), Broadcast Video Router / SDI Switcher, PCIe Gen2 Endpoint Card, High-Speed Digitizer / Oscilloscope Front-End, 40G/100G Line-Card Prototyping, Military / Defense Signal Processing, Industrial Imaging / Machine Vision.
Wireless Baseband Processing (4G/LTE RRH)
The EP2AGX260EF29I3N fits 4G/LTE remote-radio-head baseband because its 244,188 logic elements and 1,023 embedded 18×18 multipliers can absorb FFT/iFFT and channel-codec datapaths at line rate. The 12 transceivers at up to 6.375 Gbps implement CPRI/OBSAI fronthaul links to the baseband unit, eliminating an external PHY. With 12 Mbit block RAM, designers can hold multiple OFDM symbols on-chip and use the hard DDR2/DDR3 controller for ADC sample buffering. Compared with a discrete DSP+ASIC architecture, the Arria II GX reduces BOM by consolidating baseband, fronthaul, and CPRI stack into one reprogrammable device, shortening time-to-market for evolving LTE/LTE-A releases.
Recommended
Broadcast Video Router / SDI Switcher
For SD/HD/3G-SDI broadcast video routers, the EP2AGX260EF29I3N provides 12 transceivers at 2.97 Gbps supporting up to 3G-SDI, plus 244K LE for crosspoint switching fabric and embedded audio shuffling. The hard PCIe Gen2 IP enables host-side matrix control from a workstation, while 8.7 Mbit of M20K block RAM acts as line-rate audio/video FIFO. Industrial temperature grading suits central apparatus room environments. Compared with a fixed-function crosspoint ASIC, this FPGA lets the same board handle new SDI standards (12G-SDI via quad-link) with a firmware update, eliminating board respins when broadcast plants upgrade to UHD workflows.
Recommended
PCIe Gen2 Endpoint Card
The EP2AGX260EF29I3N's hard PCIe Gen2 endpoint IP (x4/x8 lane capable) suits DSP accelerator cards, frame grabbers, and software-defined-radio front-ends that need 5 Gbps host bandwidth. The 12 high-speed transceivers drive PCIe lanes plus auxiliary Aurora or Serial RapidIO sideband links to companion FPGAs, while 244K LE absorb kernel logic for FFT, FIR, or convolutional decoding. The 780-FBGA package keeps the card within a 16-lane footprint, and 8.7 Mbit block RAM holds DMA descriptors and data prefetch buffers. Compared with a PCIe soft-IP solution in smaller FPGAs, the Arria II GX hard IP achieves lower latency and frees fabric for application kernels.
Recommended
High-Speed Digitizer / Oscilloscope Front-End
For test-and-measurement digitizers, the EP2AGX260EF29I3N pairs 244K LE of DSP fabric with 12 transceivers at 6.375 Gbps to capture and pre-process multi-Gsps ADC streams. The 1,023 embedded 18×18 multipliers implement real-time FIR filtering, channel calibration, and decimation, while 12 Mbit of block RAM stages sample blocks before PCIe Gen2 host transfer. Industrial temperature range and 780-FBGA footprint suit compact 4-channel benchtop scope form factors. Compared with multi-FPGA designs, a single Arria II GX digitizer reduces timing-skew complexity and simplifies calibration firmware.
Recommended
40G/100G Line-Card Prototyping
The EP2AGX260EF29I3N aggregates 12 SERDES lanes at 6.375 Gbps into multi-10G streams for early 40G/100G line-card prototyping before moving to ASIC. Hard PCIe Gen2 provides control-plane connectivity, while 244K LE runs MAC, PCS, and OTN framing for line-side aggregation. Designers can validate higher-layer protocols in firmware rather than committing to a multi-million-dollar mask set. The 780-FBGA package and 0.9 V core simplify PCB power design compared with multi-rail ASICs. Compared with building blocks of small FPGAs, one Arria II GX reduces inter-chip interconnect and timing closure complexity.
Recommended
Military / Defense Signal Processing
For defense electronic-warfare, radar preprocessing, and secure-comm modules, the EP2AGX260EF29I3N delivers 244K LE with industrial temperature grade (-40 °C to +100 °C) and a 780-ball FCBGA package that withstands vibration-prone platforms. The 12 SERDES channels support tactical-radio links (Link 16, Link 22) at 6.375 Gbps, while 8.7 Mbit block RAM stores pulse-Doppler FFT bursts. The hard PCIe Gen2 endpoint integrates cleanly with ruggedized SBCs. Compared with ASIC-based defense platforms, the FPGA permits in-field firmware updates for new threat libraries without hardware respin.
Recommended
Industrial Imaging / Machine Vision
The EP2AGX260EF29I3N powers multi-camera machine-vision inspection systems by combining 244K LE of pixel-processing fabric with 12 transceivers driving CoaXPress or GigE Vision uplinks. Embedded multipliers run real-time defect-detection kernels, while 12 Mbit block RAM stages full-frame buffers between Camera Link taps and the host. Hard PCIe Gen2 supports 5 Gbps image transfer to the host PC, and industrial temperature grading handles -40 °C to +100 °C factory floor environments. Compared with DSP+ASIC vision pipelines, the Arria II GX lets vision integrators upgrade algorithms in firmware as AI models evolve.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX260EF29I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX260EF29I3G | EP2AGX260EF29C6N | EP2AGX260EF29C6G | EP2AGX260EF29C5N | EP2AGX260EF29C4N | EP2AGX190EF29I3G |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 190,000 (-22%) |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial | Commercial (0 to +85 C) | Commercial | Commercial | Commercial | Industrial |
| Speed Grade | -3 (fastest) | -3 | -6 (slower) | -6 (slower) | -5 | -4 | -3 |
| Maximum User I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 | 12 | 12 | 12 | 12 | 12 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature rating with same speed grade as production variant (vs EP2AGX260EF29C6N)
- Highest logic density of any 780-FBGA Arria II GX part (vs EP2AGX190EF29I3G)
- Faster -3 timing closure for transceiver-heavy designs (vs EP2AGX260EF29C6N)
Design Notes
Estimated: at 100% logic utilization with all 12 transceivers active, EP2AGX260EF29I3N draws 6-9 W from the 0.9 V core rail. Provide at least four 0.1 uF X7R decoupling capacitors per VCC ball plus bulk 470 uF polymer capacitors on the 0.9 V plane. Use a 5-6 layer PCB with a dedicated ground plane and follow Intel's PowerPlay early power estimator before final layout.
Route all 12 high-speed SERDES channels with 100 ohm differential impedance striplines, with intra-pair skew below 1 ps and length matching within 5 mils. Place AC-coupling capacitors within 200 mils of the BGA ball, on the transmitter side. Each transceiver channel requires its own isolated analog supply (VCCA_GXB) with ferrite-bead filtering from the digital 0.9 V plane to minimize jitter.
The MSL3 moisture sensitivity rating of FCBGA packages requires pre-bake at 125 C for 24 hours before reflow if the sealed package is opened beyond floor life. Use a reflow profile with peak temperature below 245 C and a maximum of two reflow cycles. Damage from moisture absorption can cause internal delamination invisible from outside - inspect JEDEC J-STD-033 compliance for any board-level returns.
For PCIe Gen2 x4/x8 lanes, the EP2AGX260EF29I3N's hard IP requires reference-clock input of 100 MHz HCSL with 25 MHz spread-spectrum option. Use an Intel-recommended clock buffer such as the 9ZXL0851 to fan out the reference clock to multiple cards. Verify the PCIe link-training sequence in the Quartus Prime transceiver toolkit before committing to layout.
Compliance Information
RoHS and REACH compliance confirmed by Altera/Intel product records. AEC-Q100 not applicable - this is an FPGA IC not a discrete automotive-grade component. Conflict-minerals compliance standard for Intel/Altera FPGAs.
