EP4CGX110CF23I7N - Cyclone IV GX FPGA, 109K LE, 484-FBGA | Intel
MPN: EP4CGX110CF23I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2062.6 | $2,062.60 |
| 10 | $1959.47 | $19,594.70 |
| 100 | $1856.34 | $185,634.00 |
| 500 | $1753.21 | $876,605.00 |
| 1,000 | $1650.08 | $1,650,080.00 |
EP4CGX110CF23I7N Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory into a single silicon die. It belongs to the PLD (programmable logic device) family within the broader category of digital integrated circuits and semiconductors. The Cyclone IV GX family targets low-power, high-volume applications that require integrated transceivers and a flexible logic fabric, sitting between simple CPLDs and high-end FPGAs in the Intel (Altera) product hierarchy.
Key features include 5,621,760 bits of embedded RAM, integrated 3.125 Gbps transceivers (Cyclone IV GX family), up to 270 user I/Os, hard PCI Express Gen1 blocks, and hardware multipliers for DSP operations. The 'I7' speed grade balances timing margin and power consumption, while the 'N' suffix indicates lead-free / RoHS compliance.
The device uses a 60 nm low-power CMOS process and a logic architecture optimized for high logic density at low static and dynamic power. Hard IP blocks for memory controllers, PCIe Gen1, and high-speed transceivers offload common functions from the programmable fabric, reducing logic consumption and improving deterministic performance. The 484-FBGA package supports extensive I/O count while maintaining a manageable PCB footprint for high-volume designs.
Typical applications include industrial motor control and factory automation, video processing and broadcast equipment, automotive driver assistance and infotainment prototypes, telecommunications line cards, USB 3.0 host controllers using the integrated transceivers, and embedded vision systems. The combination of integrated transceivers, embedded multipliers, and 270 user I/Os makes it suitable for cost-sensitive systems requiring high serial bandwidth.
When designing with this FPGA, plan power sequencing for the 1.2 V core rail, 2.5 V/3.3 V I/O auxiliaries, and PLL analog supplies. Thermal management is critical at high toggle rates: use thermal vias under the BGA and follow the Intel thermal design guide for FBGA-484 to keep junction temperature below 100 Β°C for industrial-grade lifetime.
This page synthesizes distributor pricing from LCSC, Mouser, DigiKey, and Arrow, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet, providing a one-stop reference for procurement and engineering teams.
Drop-in alternatives for EP4CGX110CF23I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110CF23I7N (same form factor and footprint) β differing in Package, Operating Temperature, Embedded Memory, Speed Grade, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX110CF23I7
β Drop-Inβ In Stock
$338.55 / Unit
View Datasheet βEP4CGX110CF23C7N
β Drop-Inβ In Stock
$89.12 / Unit
View Datasheet βEP4CGX110CF23C8N
β Drop-Inβ In Stock
$178.9 / Unit
View Datasheet βEP4CGX110CF23C8
β Drop-Inβ In Stock
$132.75 / Unit
View Datasheet βEP4CGX110CF23C7
β Drop-Inβ In Stock
$224.84 / Unit
View Datasheet βEP4CGX110CF23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | 6,839 |
| Embedded Memory | 5,621,760 bits |
| User I/O Count | 270 |
| Supply Voltage (Core) | 1.2 V |
| Process Technology | 60 nm |
| Package | FBGA-484 (484-pin FineLine BGA) |
| Package Body Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Maximum Operating Frequency | 472.5 MHz |
| Speed Grade | I7 (industrial, balance of speed and power) |
| Lead-Free / RoHS | Yes (N suffix) |
| Operating Temperature | -40 Β°C to +100 Β°C (industrial, inferred from 'I') |
| Mounting Type | Surface Mount (BGA) |
EP4CGX110CF23I7N 23 x 23 mm Pin Configuration Guide
Pin configuration for EP4CGX110CF23I7N (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110CF23I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110CF23I7N is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Processing and Broadcast Equipment, Automotive Infotainment and Driver Assistance Prototypes, Telecommunications Line Cards and Protocol Bridging, USB 3.0 Host Controllers and High-Speed Serial Bridging, Embedded Vision and Machine Learning Inferencing.
Industrial Motor Control and Factory Automation
The EP4CGX110CF23I7N suits industrial motor control because its 109,424 logic elements and 6,839 LABs can implement multi-axis field-oriented control (FOC) loops, encoder interfaces, and safety logic simultaneously. The 270 user I/Os accommodate multiple encoder channels, gate-driver PWMs, and industrial Ethernet MACs such as EtherCAT. Its industrial -40 to +100 Β°C temperature grade supports factory-floor environments, while the integrated transceivers enable SERCOS III or EtherCAT master connections on a single chip.
Recommended
Video Processing and Broadcast Equipment
With 5,621,760 bits of embedded RAM and 270 user I/Os, the EP4CGX110CF23I7N handles real-time video pipelines including color-space conversion, scaling, deinterlacing, and overlay composition for broadcast equipment. Its hardware multipliers accelerate motion-estimation and deinterlacing algorithms at 60 fps for 1080p streams. The 484-pin FBGA package offers sufficient I/O for parallel RGB/HDMI input-output, while the integrated transceivers support SDI and DisplayPort at production-grade bandwidths.
Recommended
Automotive Infotainment and Driver Assistance Prototypes
The EP4CGX110CF23I7N's industrial temperature grade and integrated transceivers make it a strong fit for automotive infotainment prototypes and ADAS development platforms. Its 109,424 logic elements handle camera fusion algorithms, surround-view stitching, and H.264 encoding in early prototypes before ASIC migration. The PCIe Gen1 hard block simplifies connection to automotive SoCs, while the 484-pin BGA supports the high pin-count interfaces typical of multi-camera and LVDS display systems.
Recommended
Telecommunications Line Cards and Protocol Bridging
The Cyclone IV GX family transceivers up to 3.125 Gbps make the EP4CGX110CF23I7N a fit for telecommunications line cards bridging legacy T1/E1 or SONET/SDH to modern Ethernet or CPRI links. Its 109K logic elements implement full protocol stacks including HDLC, GFP, and pseudo-wire encapsulation. The 270 user I/Os accommodate multiple SGMII / SFP links and CPU bus interfaces, while the hard PCIe endpoint simplifies host-side integration in compact PCI-SIG form factors.
Recommended
USB 3.0 Host Controllers and High-Speed Serial Bridging
The integrated 3.125 Gbps transceivers in the EP4CGX110CF23I7N enable USB 3.0 host and peripheral implementations, SATA controllers, and PCIe Gen1 endpoint designs without external PHY chips. Its 109K LEs accommodate USB stack, mass-storage class drivers, and DMA engines. The hard PCIe Gen1 block can be used as a downstream port for PCIe-to-USB bridge ASICs, and the 484-pin BGA provides the high pin count required for parallel expansion buses and external memory interfaces.
Recommended
Embedded Vision and Machine Learning Inferencing
The EP4CGX110CF23I7N supports embedded vision applications by combining 5,621,760 bits of embedded RAM for line buffers and frame stores with hardware multipliers for convolutional operations in small CNN models. Its 270 user I/Os connect to MIPI-CSI camera sensors and parallel output displays. While not a substitute for dedicated inference ASICs, the Cyclone IV GX's logic density is sufficient for quantized INT8 models up to a few million parameters, enabling low-power edge vision in industrial and robotics applications.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110CF23I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110CF23I7 | EP4CGX110CF23C7N | EP4CGX110CF23C8N | EP4CGX110CF23C8 | EP4CGX110CF23C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Embedded Memory | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits | 5,621,760 bits |
| User I/O Count | 270 | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | I7 (industrial) | I7 (industrial) | C7 (commercial) | C8 (commercial) | C8 (commercial) | C7 (commercial) |
| Operating Temperature | -40 Β°C to +100 Β°C (industrial) | -40 Β°C to +100 Β°C (industrial) | 0 Β°C to +85 Β°C (commercial) | 0 Β°C to +85 Β°C (commercial) | 0 Β°C to +85 Β°C (commercial) | 0 Β°C to +85 Β°C (commercial) |
| Lead-Free / N Suffix | Yes (N suffix) | No N suffix | Yes (N suffix) | Yes (N suffix) | No N suffix | No N suffix |
Key Differentiators
- Industrial temperature grade with full 109,424-LE density (vs EP4CGX110CF23C7N)
- Highest speed grade (I7) in the F23 package at full density (vs EP4CGX110CF23C8N)
- Full-density 109K-LE Cyclone IV GX with integrated transceivers (vs EP4CGX30CF23I7N)
Design Notes
Estimated: the EP4CGX110CF23I7N requires a 1.2 V core rail at up to ~3 A under heavy logic utilization (assumption: 80% utilization, 200 MHz toggle), plus 2.5 V and 3.3 V I/O auxiliaries. Use a power-sequencer IC such as the LM3880 or TPS65086 to enforce proper rail ramp order (3.3 V before 1.2 V before PLL analog) to prevent latch-up and long-term reliability degradation.
The 484-pin FBGA package has a typical theta-JA of approximately 15 Β°C/W on a 4-layer JEDEC test board, but this drops below 5 Β°C/W with a thermal-via array under the package and bottom-side copper flooding. Estimated: at 2 W dissipation, junction temperature rises ~10 Β°C above ambient with proper thermal design. Always measure case temperature in-system to validate against the 100 Β°C industrial ceiling.
Route all 270 user I/Os with impedance-controlled differential pairs (90 ohm USB, 100 ohm Ethernet) where applicable, and keep reference planes continuous under the BGA footprint. Use a 0.8 mm pitch breakout via-in-pad for the FBGA-484 - capture all power and ground balls with at least 4 vias per ball to the internal planes. Decoupling: place 0402 100 nF caps on every 4th power pin within 5 mm trace length.
Do not assume all 109,424 logic elements are usable - the Quartus fitter reserves ~5-10% for routing and clock-tree resources. Always check the fitter resource utilization report before final sign-off. Also note the I7 speed grade is the slowest in the family; designs targeting >250 MHz internal frequencies should consider I8 (not offered in this package) or migrate to Cyclone V GX.
The integrated 3.125 Gbps transceivers require careful PCB stackup: use low-loss dielectric (Df < 0.01 at 5 GHz), keep transceiver lanes on stripline layers 3 or 4 (not outer layers), and provide AC-coupling capacitors (100 nF) on each serial transmit pair. Reference the Cyclone IV GX Transceiver User Guide for channel simulation methodology.
Compliance Information
RoHS compliance indicated by 'N' suffix per Altera/Intel ordering code conventions. AEC-Q100 not qualified (industrial grade only); full automotive qualification requires specific automotive part numbers - consult Intel.
