EP2AGX260EF29C6N - Arria II GX FPGA 244K LE 780-FCBGA | Intel
MPN: EP2AGX260EF29C6N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1700 | $17,000.00 |
| 50 | $1580 | $79,000.00 |
| 100 | $1495 | $149,500.00 |
| 500 | $1395 | $697,500.00 |
EP2AGX260EF29C6N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, DSP, transceivers) into a single silicon fabric. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and sub-microsecond reconfiguration. Arria II GX belongs to Altera's mid-range transceiver-equipped FPGA family, optimized for cost-sensitive high-speed serial I/O designs, bridging between the lower-cost Cyclone families and the high-end Stratix families.
Key features of the EP2AGX260EF29C6N include hardened PCI Express Gen2 x1/x2/x4 endpoints, dedicated 6.375 Gbps transceivers with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks, up to 1,148 embedded 18x18 multipliers (variable by device variant), and 32-bit DDR3 SDRAM external memory interfaces with integrated PHY. The -C6N speed grade provides a balanced trade-off between Fmax and power consumption, while the industrial-grade 'I' option and 0.9 V core simplify PCB power distribution when paired with high-efficiency switching controllers. The 780-ball FCBGA package exposes 8 transceiver channels per side in dedicated GXB banks.
Architecturally, the EP2AGX260EF29C6N organizes logic into Adaptive Logic Modules (ALMs) of 8-input fracturable look-up tables with dedicated arithmetic and register resources, paired with high-speed routing lines between LABs and column/row interfaces. Transceiver channels integrate serializer/deserializer, PLL, and equalization, allowing direct connection to SFP+, SFP, and backplane SERDES without external PHY. The 40 nm process technology, combined with Altera's Quartus Prime toolchain, delivers timing closure on complex multi-channel serial designs.
Typical applications for the EP2AGX260EF29C6N include wireless baseband processing in LTE/WiMAX base stations, broadcast video routers with SMPTE 259M/292M/424M SDI, defense signal-intelligence front ends, medical imaging preprocessing pipelines (CT, MRI, ultrasound beamforming), industrial high-speed data acquisition, and ASIC prototyping for networking line cards. The high logic density and PCIe Gen2 hard IP make it ideal for system controller and co-processing daughter cards on ATCA/AMC platforms.
When designing with this device, plan the power-tree for the 0.9 V core with adequate decoupling (multiple 0.1 uF + 10 uF + bulk ceramic capacitors) and assign high-speed transceiver pins early in PCB layout to keep loss budget under control. Quartus Prime provides synthesis, place-and-route, and SignalTap logic analyzer integration, with optional Qsys platform designer for system-level IP assembly.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes that are not aggregated in the manufacturer datasheet, helping procurement and design engineers quickly assess this part.
Drop-in alternatives for EP2AGX260EF29C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX260EF29C6N (same form factor and footprint) β differing in Operating Temperature, Package, Speed Grade, Process Technology, Embedded Memory.
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View Datasheet βEP2AGX260EF29C6N Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Logic Elements | 244188 |
| Total Memory Bits | 12038144 |
| Number of LABs/CLBs | 10260 |
| Number of I/O | 372 |
| Voltage - Supply | 0.9 V core |
| Operating Temperature | 0C to +85C (commercial, C6 speed grade) |
| Mounting Type | Surface Mount (BGA) |
| Package / Case | 780-BBGA, FCBGA (29 x 29 mm) |
| Lead Free | Yes |
| MSL Level | 3 |
| JEDEC Standard | MS-034 |
| Process Technology | 40 nm CMOS |
| Maximum Operating Frequency | 500 MHz |
| Transceivers | Up to 16 GXB channels at 6.375 Gbps |
| Memory Type | M9K + MLAB (mixed) |
| Hard IP | PCIe Gen2 x1/x2/x4, DDR3 PHY |
| Supplier Device Package | 780-FBGA (FC-FBGA) |
EP2AGX260EF29C6N 780-fbga (fc-fbga) Pin Configuration Guide
Pin configuration for EP2AGX260EF29C6N (780-fbga (fc-fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX260EF29C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX260EF29C6N is suitable for 6 applications: Wireless Base Station Baseband, Broadcast Video Routing / SDI Switching, Medical Imaging Pipeline (CT/MRI/Ultrasound), Defense Signal Intelligence Front End, Industrial High-Speed Data Acquisition, ASIC Prototyping for Networking Line Cards.
Wireless Base Station Baseband
The EP2AGX260EF29C6N's 244,188 logic elements, dedicated 6.375 Gbps CPRI/OBSAI transceivers, and PCIe Gen2 hard IP make it ideal for LTE/WiMAX baseband processing and backhaul links. Placed between the RF frontend and baseband DSP, it performs FFT/iFFT pre/post-processing, rate adaptation, and serial-link aggregation with sub-microsecond latency. The 16 transceivers enable up to 16 CPRI links at 3.072 Gbps, sufficient for multi-sector 4x4 MIMO macro base stations, while 12 Mbits of on-chip memory eliminates external SRAM for small RACH windows.
Recommended
Broadcast Video Routing / SDI Switching
The EP2AGX260EF29C6N's high LE count and embedded memory suit SMPTE 259M/292M/424M serial digital interface routers where many parallel inputs need large crosspoint switch matrices. Using 6.375 Gbps transceivers, the device supports 3G-SDI (2.97 Gbps) with significant overhead for reclocking and embedded audio demux. Designers instantiate multi-port RX/TX SDI IP cores that leverage the integrated PCS blocks, eliminating external reclocker ASICs. The 372 user I/Os are sufficient to implement full-size 144 x 144 HD-SDI routers with 1-to-1 redundancy paths.
Recommended
Medical Imaging Pipeline (CT/MRI/Ultrasound)
The EP2AGX260EF29C6N's high logic density, 12 Mbits of on-chip memory, and high-throughput PCIe Gen2 interface suit medical imaging preprocessing where raw data rates exceed several Gbps. Deployed between the front-end ADC bank and the host workstation, the device performs beamforming for ultrasound arrays or back-projection preprocessing for CT reconstructions, offloading the host CPU and reducing overall scan time. The DDR3 PHY interface allows direct connection to high-bandwidth external memory required for image buffer storage, while the low 0.9 V core reduces thermal output in compact cart-based systems.
Recommended
Defense Signal Intelligence Front End
The EP2AGX260EF29C6N's 6.375 Gbps transceivers and 244K logic elements support digital RF memory (DRFM) and channelized EW receiver subsystems. Multi-gigabit analog-to-digital converter data is funneled through GXB transceivers into the FPGA fabric for digital down-conversion, channelization, and pulse parameter extraction. The C6N commercial grade is suitable for ground-mobile applications; air-cooled platforms with -40C to +100C requirements should select the EP2AGX260EF29I5N industrial grade.
Recommended
Industrial High-Speed Data Acquisition
The EP2AGX260EF29C6N provides a flexible preprocessor platform for industrial data acquisition backplanes that aggregate multiple ADC/DAC channels at hundreds of MSPS. Its 16 transceivers support multiple Aurora or Serial RapidIO lanes to backhaul processed data to a host controller, while 12 Mbits of on-chip memory absorb burst traffic. Industrial environments can use the EP2AGX260EF29I5N industrial speed grade to operate from -40C to +100C, sharing the same 780-FCBGA layout for design reuse between factory-floor and outdoor deployments.
Recommended
ASIC Prototyping for Networking Line Cards
The EP2AGX260EF29C6N functions as a high-density prototyping vehicle for networking ASIC designs that need PCIe Gen2, multiple SerDes channels, and large memory. Engineering teams validate RTL and gate-level netlists against realistic SerDes behavior before committing to ASIC mask costs, with the 6.375 Gbps GXB channels emulating final ASIC SERDES performance. The FC-FBGA footprint provides a familiar BGA escape for high-speed signal routing, and the Quartus Prime ASIC prototyping flow supports seamless migration from FPGA validation to ASIC tape-out.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX260EF29C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX260EF29C6G | EP2AGX260EF29C5N | EP2AGX260EF29C5G | EP2AGX260EF29C4N | EP2AGX260EF29C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (FC-FBGA, 29x29 mm) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Speed Grade | C6 (commercial, slowest) | C6 | C5 (faster) | C5 (faster) | C4 | C4 |
| Logic Elements | 244188 | 244188 | 244188 | 244188 | 244188 | 244188 |
| User I/O | 372 | 372 | 372 | 372 | 372 | 372 |
| Embedded Memory (bits) | 12038144 | 12038144 | 12038144 | 12038144 | 12038144 | 12038144 |
| Pb-free / RoHS | C6N (non-G suffix) | Yes (G suffix) | No (N suffix) | Yes (G suffix) | No (N suffix) | Yes (G suffix) |
| Transceiver Rate (max) | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
Key Differentiators
- Hard PCIe Gen2 x1/x2/x4 endpoints (vs EP2AGX190EF29C6G (lower-density))
- Pin-compatible speed grade options across C4/C5/C6 (vs EP2AGX260EF29C5N (faster speed grade))
- Pb-free BGA finish variants for global compliance (vs EP2AGX260EF29C5N (N suffix, SnPb ball finish))
Design Notes
The EP2AGX260EF29C6N can dissipate 8-15 W typical under full transceiver utilization. Use the FC-FBGA thermal ball pattern to attach a heatsink via a thermal interface material, and provide at least 4 oz copper on the top-side thermal escape layer. Estimate (TJ = TA + PD * theta_JA): at 85C ambient and 10 W with theta_JA of 6 C/W (heatsink), TJ = 145C, within spec but demanding margin. Provide forced-air cooling when 75% of transceiver channels operate at full rate.
Maintain 100-ohm differential impedance on GXB transceiver channels with up to 4.5 inches of stripline routing and 0.5 inch via stub limit. Use AC-coupling capacitors (100 nF) at every transmitter pin pair with 0201 footprint; series caps are required between TX and RX of adjacent chips. Place 0.1 uF + 10 uF + 47 uF bulk capacitors within 100 mil of each power ball cluster; the 0.9 V VCC core is sensitive to impedance discontinuities.
Allocate PCIe Gen2 hard IP for x1/x2/x4 modes via Quartus Prime IP catalog to use the integrated PCS/PMA. Reference clock jitter must be under 100 fs RMS for 6 Gbps operation; use a dedicated LVDS crystal oscillator with series AC-coupling. For multi-link designs, keep reference clock traces length-matched and away from switching power supply inductors to avoid spur injection into the CDR.
Do not connect transceiver pins to LVTTL/LVCMOS - GXB channels must be AC-coupled to standard SERDES signals. Validate bank voltage compatibility (3.3 V LVCMOS vs 1.5 V LVDS); the Arria II GX user I/O banks do NOT support 2.5 V LVCMOS legacy levels without level shifters. JTAG chains must include TCK pull-down and TMS pull-up resistors per IEEE 1149.1 boundary scan specification.
Compliance Information
The 'N' suffix indicates SnPb ball finish and is NOT RoHS-compliant - select the 'G' suffix variant (e.g., EP2AGX260EF29C6G) for RoHS-compliant assemblies. AEC-Q100 is not applicable to FPGAs. Reach and halogen-free status should be confirmed against the latest Intel material declaration (MDDS).
