Altera

EP2AGX65DF29C3N - 65K Arria II GX FPGA | Altera | Embedded Systems

MPN: EP2AGX65DF29C3N ✗ End of Life
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0.9 V Vdss FBGA-572 Package 602,214 bit Memory
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Price updated: 2026-09-08
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10 $3581 $35,810.00
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EP2AGX65DF29C3N Overview

Altera EP2AGX65DF29C3N is a 65 nm Arria II GX field-programmable gate array (FPGA) with 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins, supplied in a 572-pin FBGA package. The verified result identifies the part as an Arria II GX programmable-logic device, making it suitable for configurable digital logic, high-speed interfacing, and embedded processing systems. Its package designation DF29 corresponds to the 572-ball FBGA land pattern shown in the available device-family documentation.

An FPGA is a semiconductor integrated circuit containing configurable logic blocks, programmable routing, embedded memory, and I/O resources. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing to implement digital circuits, interfaces, or processing pipelines. Within the component hierarchy, EP2AGX65DF29C3N is an FPGA, a programmable logic device, a digital integrated circuit, and ultimately a semiconductor. The architecture allows a board designer to update logic behavior without changing the silicon, while also providing many parallel I/O connections for system-level integration.

The principal verified capacity figures are 60,214 logic elements, 602,214 embedded memory bits, 364 user I/O pins, and a 572-pin FBGA package. These resources support datapaths, control logic, communications bridges, and memory-centric functions. The high pin count also makes package escape routing, power integrity, signal integrity, and ball assignment central parts of the board design. The available data does not verify logic-array dimensions, transceiver count, transceiver data rate, operating temperature, core voltage, or speed-grade timing values.

EP2AGX65DF29C3N belongs to the Arria II GX family, which is associated with integrated high-speed transceiver capability. However, the supplied search data does not provide a defensible transceiver count or maximum transceiver rate, so those values remain unstated rather than inferred from the family name. Design work should use the device handbook and pinout tables to confirm every ball function, bank voltage, configuration interface, power rail, differential-pair rule, and recommended decoupling network. Firmware and bitstream generation should likewise use the matching Altera toolchain and device support files.

Typical applications include communications equipment, industrial control, test and measurement, image processing, and embedded data acquisition. Its programmable architecture is useful when interfaces must be adapted between sensors, converters, processors, memory devices, and backplanes. The 364 user I/O pins can support many parallel connections, while the 602,214 embedded memory bits provide distributed storage for buffering and state. Board-level performance will depend on the selected configuration, clock resources, I/O bank settings, routing, and power implementation.

A key design consideration is complete package-level validation before release. Engineers should use the manufacturer’s 572-ball ball-map documentation rather than relying on a simplified symbol, preserve required power-plane continuity, and follow the recommended decoupling and high-speed layout guidance. Because the verified data does not include detailed timing, electrical, thermal, or absolute-maximum specifications, those parameters require confirmation from the official datasheet before schematic or PCB sign-off. This page combines verified search results, structured capacity fields, sourcing context, and practical design cautions; it does not infer undocumented specifications.

Drop-in alternatives for EP2AGX65DF29C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX65DF29C3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.

Altera
Package: FBGA-780 (DF29), 29x29 mm, 1.0 mm pitch
Speed Grade: C3 (commercial)
Operating Temperature: 0C to 85C (commercial C-grade)
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Altera
Speed Grade: -5 (C5)
RoHS Status: Compliant
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Intel
Package: 780-FBGA (DF29), 29 mm body
Speed Grade: C6
Operating Temperature: 0C to +85C (commercial)
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Intel
Package: 780-BBGA, FCBGA (29 mm)
Speed Grade: -4 (mid-speed)
Operating Temperature: 0C to +85C (commercial)
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Intel
Package: 780-BBGA, FCBGA, 29 x 29 mm
Operating Temperature: 0C to +85°C (Commercial)
RoHS Status: Lead Free
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Intel
Package: 780-ball FCBGA (FineLine BGA, 29 mm)
Speed Grade: C5
Mounting Type: Surface Mount (BGA)
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Intel
Package: 780-ball FC-FBGA (29x29 mm)
Speed Grade: 6 (C6)
Operating Temperature: Commercial (0C to +85C)
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Intel
Package: 780-pin FC-FBGA
Speed Grade: C6 (Commercial, mid-tier)
Mounting Type: Surface Mount (Flip-Chip BGA)
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Intel
Package: 780-FBGA, FCBGA (29 mm)
Speed Grade: 6 (C6)
Operating Temperature: 0C to +85C (commercial, C-grade)
Compare with EP2AGX65DF29C3N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2AGX65DF29C6G

✅ Drop-In
Intel
📦 FBGA-572
Arria II GX · 60,214 · 5,371,904 · 364 · 0.9 V

✓ In Stock

$245.3 / Unit

View Datasheet →

EP2AGX45DF29C3N

✅ Drop-In
Altera
📦 FBGA-572
Arria II GX · approximately 45,000 · 1,678 Kbits total · 36 · 8 (up to 6.375 Gbps) · Yes (Gen1/Gen2, x1/x2/x4) · 6

✓ In Stock

$178 / Unit

View Datasheet →

EP2AGX45DF29C5N

✅ Drop-In
Altera
📦 FBGA-572
Arria II GX · EP2AGX45 · FPGA - Field Programmable Gate Array · 42959 · 1805 · 18050 · 3517440 · 364

✓ In Stock

$510 / Unit

View Datasheet →

EP2AGX45DF29C6N

✅ Drop-In
Intel
📦 FBGA-572
Arria II GX · 45,000 · 1,805 · 3,517,440 bits · 364 · 6.375 Gbps

✓ In Stock

$175 / Unit

View Datasheet →

EP2AGX65DF29C6G

✅ Drop-In
Intel
📦 FBGA-572
Arria II GX · 60,214 · 5,371,904 · 364 · 0.9 V

✓ In Stock

$245.3 / Unit

View Datasheet →

EP2AGX65DF29C3N Maximum Ratings & Electrical Characteristics

Device Type Field Programmable Gate Array (FPGA)
Product Family Arria II GX
Logic Elements 60,214
Embedded Memory 602,214 bit
User I/O Pins 364
Package FBGA-572
Package Designation DF29
Total Pins or Balls 572
Supply Voltage 0.9 V
Mounting Type Surface Mount
Technology 65 nm

EP2AGX65DF29C3N df29 Pin Configuration Guide

Pin configuration for EP2AGX65DF29C3N (df29 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

df29 package pinout diagram for EP2AGX65DF29C3N

No detailed pinout data available for EP2AGX65DF29C3N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2AGX65DF29C3N is suitable for 6 applications: Industrial Control and Automation, Communications and Protocol Bridging, Test and Measurement Equipment, Video and Image Processing, Embedded Data Acquisition, Legacy Platform Maintenance.

🏭

Industrial Control and Automation

EP2AGX65DF29C3N fits established industrial control platforms that need programmable logic for deterministic sequencing, machine communication, sensor aggregation, and custom timing. The device’s verified 60,214 logic elements provide a substantial configurable resource base, while 602,214 embedded memory bits can support state machines, FIFOs, lookup tables, and protocol buffering. Its 364 user I/O pins are useful for connecting digital sensors, actuators, encoders, control modules, and backplane interfaces. The FPGA would typically sit between field-level devices and a supervisory processor, handling parallel acquisition, real-time control, protocol conversion, or safety-related logic implementation. The 0.9 V supply entry in the indexed device data makes local power integrity important, especially when the FPGA is integrated with higher-voltage I/O banks. Designers must confirm the full bank-voltage and I/O electrical limits from the device handbook, because only the 0.9 V supply value is verified here. For a new product, the part is most compelling when an existing board already uses the DF29 FBGA-572 footprint and the required Altera toolchain is available. It is less attractive for a greenfield platform if lifecycle or supply continuity is uncertain. Before industrial qualification, test configuration loading, clock distribution, I/O timing, thermal behavior, and the exact transceiver or interface functions used by the application.

🌐

Communications and Protocol Bridging

EP2AGX65DF29C3N is a candidate for communications infrastructure that requires configurable protocol bridging, packet handling, clock-domain conversion, or custom physical-layer support. Its 60,214 logic elements can implement serializers, parsers, error detection, routing logic, and control functions, while the 602,214 embedded memory bits can buffer traffic and store constants or state. The 364 user I/O pins provide substantial connectivity for parallel data paths and board-level interfaces. In a typical bridge, the FPGA would receive a stream from one interface, perform framing or rate adaptation, and present the converted data to a processor, memory subsystem, or another serial interface. The Arria II GX naming suggests potential high-speed transceiver relevance, but the supplied data does not verify the number of transceivers or their maximum rate. Those details must be obtained from the official device handbook and should not be inferred. Signal integrity is critical with a 572-ball package and many I/O resources. The board should preserve continuous reference planes, follow the documented escape rules, and control differential-pair length and impedance. Power, jitter, and clock distribution also require measured validation. A replacement part must be accepted only after bitstream, timing, pin, configuration, and interface-level comparisons.

🔬

Test and Measurement Equipment

EP2AGX65DF29C3N can serve in test and measurement equipment where acquisition timing, deterministic processing, and flexible digital triggering are required. The verified 60,214 logic elements support parallel datapaths, trigger logic, counters, encoders, and instrument control, while 602,214 embedded memory bits can hold capture data, calibration values, and waveform tables. The 364 user I/O pins can connect converters, memory devices, front-panel controllers, and timing modules. A practical architecture may place the FPGA between an ADC or sensor interface and a host processor, performing sample formatting, decimation, feature extraction, timestamping, or buffer management. Its reconfigurable nature is valuable when measurement modes or communication protocols change. The design must still use the official device documentation to establish the actual supported I/O standards, clocking resources, transceiver characteristics, and timing limits; the verified web data does not provide those values. For measurement accuracy, treat the FPGA as part of the signal path rather than assuming its logic capacity alone determines performance. Define clock jitter, setup and hold margins, lane skew, and thermal drift at system level. The 0.9 V supply entry requires careful decoupling and plane design, and the 572-ball land pattern should be reviewed against manufacturing capabilities before prototype release.

📷

Video and Image Processing

EP2AGX65DF29C3N is suitable for image-processing systems that need parallel pixel manipulation, frame buffering, format conversion, or custom video timing. The verified 60,214 logic elements can support pixel pipelines, color-space conversion, filtering, region-of-interest processing, and timing generators, while 602,214 embedded memory bits provide line buffers, lookup tables, and small frame or coefficient stores. The 364 user I/O pins can connect image sensors, displays, converters, and memory interfaces. The FPGA may be used as a preprocessing stage between a camera sensor and a processor or display subsystem. In that role, it can combine pixels, generate synchronization, synchronize asynchronous domains, or reduce bandwidth before the next processing stage. The Arria II GX family’s high-speed-oriented positioning is not enough to establish a specific video interface capability; designers must verify transceiver, I/O, clock, and memory specifications from the manufacturer datasheet. Image systems are sensitive to clock jitter, deterministic latency, and thermal drift. Validate pixel-clock distribution, source-synchronous timing, output enable behavior, and frame-buffer throughput using the actual configuration. Because the supplied data does not provide operating temperature, thermal resistance, or timing tables, those values must be confirmed before production qualification. The existing DF29 footprint is the main reason to reuse this FPGA in a mature image platform.

📡

Embedded Data Acquisition

EP2AGX65DF29C3N fits embedded data-acquisition designs that combine parallel sensor inputs, timing control, local buffering, and custom digital processing. The verified 60,214 logic elements can implement acquisition sequencers, digital filters, encoders, trigger engines, and interface controllers, while 602,214 embedded memory bits can buffer burst data and store configuration coefficients. The 364 user I/O pins support multiple converters, sensors, memories, and host interfaces on one programmable device. A typical signal chain would use the FPGA to capture synchronized samples, normalize the data, perform front-end calculations, and transfer records to a host processor or storage device. The programmable architecture helps when channel counts, sample formats, or calibration algorithms differ between product variants. The indexed data does not include maximum operating frequency, I/O standard limits, or detailed timing, so those values must come from the official Arria II GX documentation before interface closure. Power integrity is especially important because the device is a 572-ball package and the verified listing gives a 0.9 V supply entry. Use the manufacturer’s decoupling guidance, provide a low-impedance distribution network, and verify the design with rail measurements. Validate clock trees, metastability controls, reset sequencing, and error handling in hardware. A new design should also compare the total cost of legacy-device sourcing against a modern FPGA redesign.

🛠️

Legacy Platform Maintenance

EP2AGX65DF29C3N is most useful for maintaining an existing Arria II GX platform rather than starting a new high-volume design. Its documented 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins may be sufficient to preserve established control, interface, and processing functions. The DF29 FBGA-572 package is especially important because it allows procurement teams to target an existing board footprint instead of redesigning the PCB around a different ball map. For legacy support, engineers should first confirm the exact orderable suffix, package marking, temperature grade, speed grade, and configuration files used by the installed design. The verified search results do not provide a complete ordering-code table or lifecycle statement. Compare supplier quotations against authorized distribution, inspect date codes and moisture-sensitive packaging, and validate incoming parts through electrical and boundary-scan procedures where available. If a substitute is proposed, do not assume that the same DF29 prefix guarantees compatibility. Require a manufacturer or authorized distributor cross-reference, then compare the full pinout, power sequencing, I/O banks, transceivers, timing, and toolchain support. If no qualified replacement exists, consider a board redesign using a current FPGA family. That path may cost more initially, but it can reduce long-term supply and obsolescence risk.

What are the key specifications engineers should know about EP2AGX65DF29C3N?
EP2AGX65DF29C3N is an Altera Arria II GX FPGA with 60,214 logic elements, 602,214 bits of embedded memory, and 364 user I/O pins in a 572-pin FBGA package. According to the indexed EP2AGX65DF29 device information, the DF29 package has 572 pins and the listed supply voltage is 0.9 V. Transceiver count, maximum I/O frequency, operating temperature, and thermal resistance are not present in the verified data and must be confirmed from the manufacturer documentation before design sign-off.
What is EP2AGX65DF29C3N?
EP2AGX65DF29C3N is an Altera Arria II GX field-programmable gate array, or FPGA, used to implement configurable digital logic. The verified data identifies 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins. The device is packaged as FBGA-572 under the DF29 package code. Because it is programmable after manufacturing, engineers can use it for protocol bridging, control logic, signal processing, and other functions that may evolve during product development.
How much logic and embedded memory does EP2AGX65DF29C3N provide?
EP2AGX65DF29C3N provides 60,214 logic elements and 602,214 bits of embedded memory. According to the indexed Arria II GX device information, these resources make the part appropriate for designs requiring both configurable logic and distributed on-chip storage. The exact usable capacity can be lower after synthesis, timing closure, routing, and implementation constraints, so engineers should validate the final utilization report in the appropriate Altera design tool rather than treating 60,214 logic elements as available gates.
What package does EP2AGX65DF29C3N use?
EP2AGX65DF29C3N uses a 572-pin FBGA package identified by the DF29 package designation. The verified source states 572 pins, an FBGA-572 package type, and 364 user I/O pins. The remaining package connections are not equivalent to user I/O and may include power, configuration, clocking, transceiver, or other device-specific functions. Board designers must consult the complete 572-ball map before assigning schematic symbols, power rails, or PCB escape routes.
Where can I download the EP2AGX65DF29C3N datasheet PDF?
The EP2AGX65DF29C3N datasheet can be located through the verified source at https://www.digchip.com/datasheets/parts/datasheet/033/EP2AGX65DF29.php, which identifies the document as Arria II GX device information. The source also references the Arria II Device Handbook. For procurement, https://www.jotrin.com/product/parts/EP2AGX65DF29C3N provides product-family and documentation links. Because no official manufacturer-hosted PDF URL was supplied, confirm the document revision and authenticity through an authorized Altera or Intel FPGA documentation source before using it for release.
Where can I find the EP2AGX65DF29C3N pinout?
The EP2AGX65DF29C3N pinout is contained in the Arria II GX package and ball-map documentation, not in the limited indexed result. The verified data confirms a DF29 FBGA-572 package with 572 pins and 364 user I/O pins, but it does not provide the individual 1-through-572 ball names. A complete 572-pin pinout is therefore not published here to avoid errors. Use the official package diagram and ball-assignment tables to identify every power, configuration, I/O, clock, and transceiver connection.
What is the price of EP2AGX65DF29C3N as of 2026-09-08?
EP2AGX65DF29C3N had listed market values of 34,866 USD in one indexed result and 3,581 USD in another as of 2026-09-08. Those figures are not standardized distributor quantity pricing, so they should be treated as indicative supplier listings rather than a reliable unit price. Current inventory, condition, currency normalization, order quantity, and warranty can materially change the actual transaction price. Request a dated quotation from the supplier and verify that the quoted device is the exact FBGA-629 package before purchase.
Where to buy EP2AGX65DF29C3N online?
EP2AGX65DF29C3N can be searched through Jotrin Electronics at https://www.jotrin.com/product/parts/EP2AGX65DF29C3N, FMall at https://www.fmall.uk/product/altera/ep2agx65df29c3n, and the other indexed suppliers listed on the product page. The verified data does not establish authorized distribution or live stock for the target MPN. Before ordering, confirm the manufacturer marking, package code, date code, traceability, export status, warranty, and test documentation. A supplier listing alone should not be interpreted as proof of current factory stock.
Is EP2AGX65DF29C3N in stock?
EP2AGX65DF29C3N stock status is not confirmed by the verified web data. FMall describes an in-stock-related product page, while other search results are generic catalog or pricing pages. Because the target MPN and the related FBGA-629 variant must not be conflated, ask each supplier for a live inventory response tied to the exact orderable number. For production planning, treat availability as unconfirmed until a distributor provides a current stock code, shipment date, and lot-identification record.
What is the lead time for EP2AGX65DF29C3N?
The lead time for EP2AGX65DF29C3N is not stated in the verified sources as of 2026-09-08. The device is an older Altera Arria II GX FPGA package, so new or obsolete-market inventory may be limited, brokered, or available in mixed conditions. A distributor may offer immediate shipment, a scheduled delivery, or a quote-only allocation. Request a written lead-time commitment that identifies whether the material is new, refurbished, or surplus, and include inspection and acceptance criteria in the purchase order.
Can EP2AGX65DF29C3N replace EP2AGX45DF29C3N directly?
No drop-in replacement is established between EP2AGX65DF29C3N and EP2AGX45DF29C3N from the verified data. Although both names appear in the Arria II GX family, the numbers 65 and 45 are not evidence of identical resources, and the package information must be compared ball by ball. A replacement also requires matching logic capacity, memory, I/O, transceivers, power domains, configuration, timing, and thermal requirements. Treat this as a new design or requalification unless an authorized cross-reference explicitly confirms equivalence.
Is EP2AGX65DF29C3N the same as EP2AGX65DF29C6G?
EP2AGX65DF29C3N is not verified as the same ordering option as EP2AGX65DF29C6G. The suffixes encode device options that may affect grade, temperature, packaging, or qualification, while the verified data does not provide a complete option cross-reference. Do not substitute one suffix for another based only on the shared EP2AGX65DF29 prefix. Compare the full ordering code, package marking, speed grade, environmental requirements, and datasheet ordering information before approving a replacement.
What is the best cross-brand equivalent for EP2AGX65DF29C3N?
No verified cross-brand drop-in equivalent for EP2AGX65DF29C3N is present in the supplied web results. The targeted search returned generic cross-reference tools and product-support pages but no manufacturer-confirmed part with matching package, pinout, capacity, memory, and electrical behavior. A different FPGA family should therefore not be presented as a drop-in replacement. If sourcing continuity is required, ask authorized suppliers for a manufacturer-approved migration path, or select a new package and complete a full PCB and firmware redesign.
When should I choose EP2AGX65DF29C3N for a new design?
Choose EP2AGX65DF29C3N only when the design is tied to the DF29 FBGA-572 package and requires the documented 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins. The part may fit established Arria II GX platforms, legacy communications hardware, or designs already using its power and ball map. It is not an automatic choice for a new platform because lifecycle, availability, tooling, and complete electrical data are not confirmed. Evaluate the total cost of requalification and supply risk before freezing the design.
What design tools are compatible with EP2AGX65DF29C3N?
EP2AGX65DF29C3N requires the Altera FPGA design flow associated with the Arria II GX device family, including device support, synthesis, place-and-route, simulation, and configuration files appropriate to that family. The verified data does not identify a specific software version, supported operating system, or current maintenance status. Use the tool version named by the device documentation and validate bitstream generation, configuration interface operation, timing analysis, and programmer support on the actual hardware. Do not assume that the newest FPGA tool supports an older Arria II GX device.

Engineering reference data for EP2AGX65DF29C3N — comparison, design guidance, and compliance information.

Selection Guide

Choose EP2AGX65DF29C3N when maintaining or completing an existing design that already uses the DF29 FBGA-572 package and needs the verified Arria II GX resource set of 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins. It is particularly appropriate for legacy industrial, communications, test, and data-acquisition systems where PCB and firmware changes are undesirable. Confirm the full ordering code, package marking, temperature grade, speed grade, and configuration requirements before procurement. Do not select it for a new high-volume platform until lifecycle, authorized availability, and complete electrical data are established. Related EP2AGX65DF29 and EP2AGX45DF29 package candidates may support migration studies, but the supplied evidence does not prove drop-in equivalence. A different FPGA family should be considered only through a full redesign and qualification process.

Comparison with Alternatives

Parameter This Product EP2AGX65DF29C6G EP2AGX45DF29C3N EP2AGX45DF29C5N
Brand Altera Altera Altera Altera
Package FBGA-572, DF29 FBGA-572, DF29 FBGA-572, DF29 FBGA-572, DF29
Device Family Arria II GX Arria II GX Arria II GX Arria II GX
Drop-in Status Target MPN Package family match; full equivalence not verified Package family match; full equivalence not verified Package family match; full equivalence not verified

Key Differentiators

  • Verified high-capacity Arria II GX resource listing (vs EP2AGX45DF29C3N)
  • Documented 572-ball DF29 package context (vs EP2AGX65DF29C6G)
  • Large verified user-I/O count for parallel systems (vs EP2AGX45DF29C5N)

Design Notes

Use the official Arria II GX power-design guidance before routing the EP2AGX65DF29C3N supply network. The verified data lists a 0.9 V supply, but it does not provide current consumption, rail tolerances, power sequencing, or I/O-bank voltage details. Separate core and I/O domains as required by the handbook, place local decoupling close to the associated balls, and maintain continuous low-impedance planes. Measure rail startup and steady-state voltage at the package under the expected configuration and load.

The 572-ball DF29 FBGA requires an escape strategy developed from the official ball map. Do not begin routing from a generic FPGA symbol because the verified web data does not provide a reliable individual pin list. Confirm the orientation of ball 1, confirm the power and ground assignments, and follow the manufacturer’s recommended via, fanout, and differential-pair rules. Keep high-speed routes over a continuous reference plane and verify layer transitions and return paths with the final stack-up.

Treat clocks, source-synchronous buses, and any high-speed links as controlled-impedance interfaces. The available data confirms 364 user I/O pins and identifies the Arria II GX family, but it does not confirm transceiver count, maximum I/O frequency, or supported I/O standards. Establish those values from the official datasheet, then constrain clock skew, differential-pair length, termination, and via count in the design. Prototype measurements should include eye diagrams, jitter, setup and hold margin, and error-rate testing where applicable.

Do not approve a drop-in replacement from the DF29 package code alone. The supplied alternatives are related package-code candidates, but the verified sources do not establish identical logic capacity, memory, I/O, transceiver, temperature, speed-grade, or configuration behavior. Obtain a manufacturer or authorized-distributor cross-reference and compare the complete ordering code and ball map. If no qualified replacement exists, plan a board and firmware redesign rather than silently changing device options.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

The verified data does not state RoHS, REACH, automotive, lead-free, halogen-free, or conflict-minerals compliance. AEC-Q100 is not stated and is treated as not_applicable only as a classification field, not as a compliance claim.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera EP2AGX65DF29C3N Arria II GX FPGA Field Programmable Gate Array programmable logic device digital integrated circuit semiconductor 60,214 logic elements 602,214 embedded memory bits 364 user I/O pins 572-pin FBGA DF29 package surface mount 0.9 V supply industrial control communications equipment test and measurement embedded data acquisition image processing signal integrity power integrity legacy platform maintenance Altera FPGA design flow
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