EP2AGX65DF29C3N - 65K Arria II GX FPGA | Altera | Embedded Systems
MPN: EP2AGX65DF29C3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34866 | $34,866.00 |
| 10 | $3581 | $35,810.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2AGX65DF29C3N Overview
An FPGA is a semiconductor integrated circuit containing configurable logic blocks, programmable routing, embedded memory, and I/O resources. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing to implement digital circuits, interfaces, or processing pipelines. Within the component hierarchy, EP2AGX65DF29C3N is an FPGA, a programmable logic device, a digital integrated circuit, and ultimately a semiconductor. The architecture allows a board designer to update logic behavior without changing the silicon, while also providing many parallel I/O connections for system-level integration.
The principal verified capacity figures are 60,214 logic elements, 602,214 embedded memory bits, 364 user I/O pins, and a 572-pin FBGA package. These resources support datapaths, control logic, communications bridges, and memory-centric functions. The high pin count also makes package escape routing, power integrity, signal integrity, and ball assignment central parts of the board design. The available data does not verify logic-array dimensions, transceiver count, transceiver data rate, operating temperature, core voltage, or speed-grade timing values.
EP2AGX65DF29C3N belongs to the Arria II GX family, which is associated with integrated high-speed transceiver capability. However, the supplied search data does not provide a defensible transceiver count or maximum transceiver rate, so those values remain unstated rather than inferred from the family name. Design work should use the device handbook and pinout tables to confirm every ball function, bank voltage, configuration interface, power rail, differential-pair rule, and recommended decoupling network. Firmware and bitstream generation should likewise use the matching Altera toolchain and device support files.
Typical applications include communications equipment, industrial control, test and measurement, image processing, and embedded data acquisition. Its programmable architecture is useful when interfaces must be adapted between sensors, converters, processors, memory devices, and backplanes. The 364 user I/O pins can support many parallel connections, while the 602,214 embedded memory bits provide distributed storage for buffering and state. Board-level performance will depend on the selected configuration, clock resources, I/O bank settings, routing, and power implementation.
A key design consideration is complete package-level validation before release. Engineers should use the manufacturer’s 572-ball ball-map documentation rather than relying on a simplified symbol, preserve required power-plane continuity, and follow the recommended decoupling and high-speed layout guidance. Because the verified data does not include detailed timing, electrical, thermal, or absolute-maximum specifications, those parameters require confirmation from the official datasheet before schematic or PCB sign-off. This page combines verified search results, structured capacity fields, sourcing context, and practical design cautions; it does not infer undocumented specifications.
Drop-in alternatives for EP2AGX65DF29C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29C3N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF29C6G
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View Datasheet →EP2AGX45DF29C3N
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View Datasheet →EP2AGX45DF29C5N
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View Datasheet →EP2AGX45DF29C6N
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View Datasheet →EP2AGX65DF29C6G
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View Datasheet →EP2AGX65DF29C3N Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory | 602,214 bit |
| User I/O Pins | 364 |
| Package | FBGA-572 |
| Package Designation | DF29 |
| Total Pins or Balls | 572 |
| Supply Voltage | 0.9 V |
| Mounting Type | Surface Mount |
| Technology | 65 nm |
EP2AGX65DF29C3N df29 Pin Configuration Guide
Pin configuration for EP2AGX65DF29C3N (df29 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29C3N is suitable for 6 applications: Industrial Control and Automation, Communications and Protocol Bridging, Test and Measurement Equipment, Video and Image Processing, Embedded Data Acquisition, Legacy Platform Maintenance.
Industrial Control and Automation
EP2AGX65DF29C3N fits established industrial control platforms that need programmable logic for deterministic sequencing, machine communication, sensor aggregation, and custom timing. The device’s verified 60,214 logic elements provide a substantial configurable resource base, while 602,214 embedded memory bits can support state machines, FIFOs, lookup tables, and protocol buffering. Its 364 user I/O pins are useful for connecting digital sensors, actuators, encoders, control modules, and backplane interfaces. The FPGA would typically sit between field-level devices and a supervisory processor, handling parallel acquisition, real-time control, protocol conversion, or safety-related logic implementation. The 0.9 V supply entry in the indexed device data makes local power integrity important, especially when the FPGA is integrated with higher-voltage I/O banks. Designers must confirm the full bank-voltage and I/O electrical limits from the device handbook, because only the 0.9 V supply value is verified here. For a new product, the part is most compelling when an existing board already uses the DF29 FBGA-572 footprint and the required Altera toolchain is available. It is less attractive for a greenfield platform if lifecycle or supply continuity is uncertain. Before industrial qualification, test configuration loading, clock distribution, I/O timing, thermal behavior, and the exact transceiver or interface functions used by the application.
Recommended
Communications and Protocol Bridging
EP2AGX65DF29C3N is a candidate for communications infrastructure that requires configurable protocol bridging, packet handling, clock-domain conversion, or custom physical-layer support. Its 60,214 logic elements can implement serializers, parsers, error detection, routing logic, and control functions, while the 602,214 embedded memory bits can buffer traffic and store constants or state. The 364 user I/O pins provide substantial connectivity for parallel data paths and board-level interfaces. In a typical bridge, the FPGA would receive a stream from one interface, perform framing or rate adaptation, and present the converted data to a processor, memory subsystem, or another serial interface. The Arria II GX naming suggests potential high-speed transceiver relevance, but the supplied data does not verify the number of transceivers or their maximum rate. Those details must be obtained from the official device handbook and should not be inferred. Signal integrity is critical with a 572-ball package and many I/O resources. The board should preserve continuous reference planes, follow the documented escape rules, and control differential-pair length and impedance. Power, jitter, and clock distribution also require measured validation. A replacement part must be accepted only after bitstream, timing, pin, configuration, and interface-level comparisons.
Recommended
Test and Measurement Equipment
EP2AGX65DF29C3N can serve in test and measurement equipment where acquisition timing, deterministic processing, and flexible digital triggering are required. The verified 60,214 logic elements support parallel datapaths, trigger logic, counters, encoders, and instrument control, while 602,214 embedded memory bits can hold capture data, calibration values, and waveform tables. The 364 user I/O pins can connect converters, memory devices, front-panel controllers, and timing modules. A practical architecture may place the FPGA between an ADC or sensor interface and a host processor, performing sample formatting, decimation, feature extraction, timestamping, or buffer management. Its reconfigurable nature is valuable when measurement modes or communication protocols change. The design must still use the official device documentation to establish the actual supported I/O standards, clocking resources, transceiver characteristics, and timing limits; the verified web data does not provide those values. For measurement accuracy, treat the FPGA as part of the signal path rather than assuming its logic capacity alone determines performance. Define clock jitter, setup and hold margins, lane skew, and thermal drift at system level. The 0.9 V supply entry requires careful decoupling and plane design, and the 572-ball land pattern should be reviewed against manufacturing capabilities before prototype release.
Recommended
Video and Image Processing
EP2AGX65DF29C3N is suitable for image-processing systems that need parallel pixel manipulation, frame buffering, format conversion, or custom video timing. The verified 60,214 logic elements can support pixel pipelines, color-space conversion, filtering, region-of-interest processing, and timing generators, while 602,214 embedded memory bits provide line buffers, lookup tables, and small frame or coefficient stores. The 364 user I/O pins can connect image sensors, displays, converters, and memory interfaces. The FPGA may be used as a preprocessing stage between a camera sensor and a processor or display subsystem. In that role, it can combine pixels, generate synchronization, synchronize asynchronous domains, or reduce bandwidth before the next processing stage. The Arria II GX family’s high-speed-oriented positioning is not enough to establish a specific video interface capability; designers must verify transceiver, I/O, clock, and memory specifications from the manufacturer datasheet. Image systems are sensitive to clock jitter, deterministic latency, and thermal drift. Validate pixel-clock distribution, source-synchronous timing, output enable behavior, and frame-buffer throughput using the actual configuration. Because the supplied data does not provide operating temperature, thermal resistance, or timing tables, those values must be confirmed before production qualification. The existing DF29 footprint is the main reason to reuse this FPGA in a mature image platform.
Recommended
Embedded Data Acquisition
EP2AGX65DF29C3N fits embedded data-acquisition designs that combine parallel sensor inputs, timing control, local buffering, and custom digital processing. The verified 60,214 logic elements can implement acquisition sequencers, digital filters, encoders, trigger engines, and interface controllers, while 602,214 embedded memory bits can buffer burst data and store configuration coefficients. The 364 user I/O pins support multiple converters, sensors, memories, and host interfaces on one programmable device. A typical signal chain would use the FPGA to capture synchronized samples, normalize the data, perform front-end calculations, and transfer records to a host processor or storage device. The programmable architecture helps when channel counts, sample formats, or calibration algorithms differ between product variants. The indexed data does not include maximum operating frequency, I/O standard limits, or detailed timing, so those values must come from the official Arria II GX documentation before interface closure. Power integrity is especially important because the device is a 572-ball package and the verified listing gives a 0.9 V supply entry. Use the manufacturer’s decoupling guidance, provide a low-impedance distribution network, and verify the design with rail measurements. Validate clock trees, metastability controls, reset sequencing, and error handling in hardware. A new design should also compare the total cost of legacy-device sourcing against a modern FPGA redesign.
Recommended
Legacy Platform Maintenance
EP2AGX65DF29C3N is most useful for maintaining an existing Arria II GX platform rather than starting a new high-volume design. Its documented 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins may be sufficient to preserve established control, interface, and processing functions. The DF29 FBGA-572 package is especially important because it allows procurement teams to target an existing board footprint instead of redesigning the PCB around a different ball map. For legacy support, engineers should first confirm the exact orderable suffix, package marking, temperature grade, speed grade, and configuration files used by the installed design. The verified search results do not provide a complete ordering-code table or lifecycle statement. Compare supplier quotations against authorized distribution, inspect date codes and moisture-sensitive packaging, and validate incoming parts through electrical and boundary-scan procedures where available. If a substitute is proposed, do not assume that the same DF29 prefix guarantees compatibility. Require a manufacturer or authorized distributor cross-reference, then compare the full pinout, power sequencing, I/O banks, transceivers, timing, and toolchain support. If no qualified replacement exists, consider a board redesign using a current FPGA family. That path may cost more initially, but it can reduce long-term supply and obsolescence risk.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29C6G | EP2AGX45DF29C3N | EP2AGX45DF29C5N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | FBGA-572, DF29 | FBGA-572, DF29 | FBGA-572, DF29 | FBGA-572, DF29 |
| Device Family | Arria II GX | Arria II GX | Arria II GX | Arria II GX |
| Drop-in Status | Target MPN | Package family match; full equivalence not verified | Package family match; full equivalence not verified | Package family match; full equivalence not verified |
Key Differentiators
- Verified high-capacity Arria II GX resource listing (vs EP2AGX45DF29C3N)
- Documented 572-ball DF29 package context (vs EP2AGX65DF29C6G)
- Large verified user-I/O count for parallel systems (vs EP2AGX45DF29C5N)
Design Notes
Use the official Arria II GX power-design guidance before routing the EP2AGX65DF29C3N supply network. The verified data lists a 0.9 V supply, but it does not provide current consumption, rail tolerances, power sequencing, or I/O-bank voltage details. Separate core and I/O domains as required by the handbook, place local decoupling close to the associated balls, and maintain continuous low-impedance planes. Measure rail startup and steady-state voltage at the package under the expected configuration and load.
The 572-ball DF29 FBGA requires an escape strategy developed from the official ball map. Do not begin routing from a generic FPGA symbol because the verified web data does not provide a reliable individual pin list. Confirm the orientation of ball 1, confirm the power and ground assignments, and follow the manufacturer’s recommended via, fanout, and differential-pair rules. Keep high-speed routes over a continuous reference plane and verify layer transitions and return paths with the final stack-up.
Treat clocks, source-synchronous buses, and any high-speed links as controlled-impedance interfaces. The available data confirms 364 user I/O pins and identifies the Arria II GX family, but it does not confirm transceiver count, maximum I/O frequency, or supported I/O standards. Establish those values from the official datasheet, then constrain clock skew, differential-pair length, termination, and via count in the design. Prototype measurements should include eye diagrams, jitter, setup and hold margin, and error-rate testing where applicable.
Do not approve a drop-in replacement from the DF29 package code alone. The supplied alternatives are related package-code candidates, but the verified sources do not establish identical logic capacity, memory, I/O, transceiver, temperature, speed-grade, or configuration behavior. Obtain a manufacturer or authorized-distributor cross-reference and compare the complete ordering code and ball map. If no qualified replacement exists, plan a board and firmware redesign rather than silently changing device options.
Compliance Information
The verified data does not state RoHS, REACH, automotive, lead-free, halogen-free, or conflict-minerals compliance. AEC-Q100 is not stated and is treated as not_applicable only as a classification field, not as a compliance claim.