EP2AGX65CU17I5G - 60K Logic FPGA, 156 I/O | Intel
MPN: EP2AGX65CU17I5G ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
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| 1,000 | $0 | $0.00 |
EP2AGX65CU17I5G Overview
An FPGA, or field-programmable gate array, is a semiconductor device whose digital logic functions are defined after manufacturing through configuration rather than fixed mask-programmed circuitry. In the broader hierarchy, an FPGA combines programmable logic elements, routing resources, embedded memory, input/output blocks, and often dedicated interface functions. Engineers configure these resources using vendor design software to implement controllers, data paths, communications functions, signal processing, and system logic. Unlike a fixed application-specific integrated circuit, an FPGA can be revised in firmware or device configuration after the PCB is assembled.
The verified listing identifies EP2AGX65CU17I5G as part of the Arria II GX family and specifies 156 user I/O, 5,371,904 programmable logic bits, and 60,214 logic elements. Its 358-ball LFBGA, FCBGA package is a large fine-pitch surface-mount package intended for systems with substantial interconnect density. The part is described as a programmable logic IC and as a field-programmable gate array. A distributor result also states RoHS compliant status, but no separate REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 claim was verified.
The device's principal engineering value is its capacity to consolidate configurable digital functions into one package while preserving post-assembly logic flexibility. The relationship between logic-element count, programmable memory, and I/O capacity supports designs with more parallel state machines, buffers, protocol functions, or control logic than smaller programmable devices. Exact architecture, process technology, transceiver count, clock resources, power rails, configuration scheme, and supported I/O standards require the manufacturer device documentation or a complete manufacturer table before board design or substitution decisions.
Typical applications include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and embedded computing systems. The 60,214 logic elements and 156 I/O can support multi-interface aggregation, while the programmable architecture allows design changes without a new silicon mask. Dedicated high-speed use should be checked against the Arria II GX datasheet because no verified transceiver or data-rate specification was provided.
For board implementation, confirm the 358-ball land pattern, power sequencing, configuration interface, I/O bank rules, and thermal requirements from the manufacturer package and device-handbook documentation. Distributor availability was listed as shipping today by some results, but a quantity-specific price and lead time were not supplied; consult current distributor stock before ordering.
This page separates verified distributor facts from unverified engineering details, flags missing parameters explicitly, and provides application guidance without converting search snippets into unsupported electrical specifications.
Drop-in alternatives for EP2AGX65CU17I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65CU17I5G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP2AGX65CU17C5N
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View Datasheet →EP2AGX65CU17C5G
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View Datasheet →EP2AGX65CU17C4N
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View Datasheet →EP2AGX65CU17I5G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Arria II GX |
| Logic Elements | 60,214 |
| Programmable Logic Bits | 5,371,904 |
| User I/O Count | 156 |
| Package | 358-ball LFBGA, FCBGA |
| Number of Terminals | 358 |
| Terminal Form | Ball |
| Package Code | LFBGA |
| Package Shape | Square |
| Mounting Type | Surface Mount |
| Logic Cell Count | 60,214 |
| I/O Count | 156 |
| RoHS Status | Compliant |
| Lead Free Status | Not stated in verified data |
EP2AGX65CU17I5G square Pin Configuration Guide
Pin configuration for EP2AGX65CU17I5G (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65CU17I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65CU17I5G is suitable for 6 applications: Industrial Automation Controllers, Communications Interface Equipment, Video and Imaging Processing, Test and Measurement Equipment, Embedded Computing Systems, Medical and Diagnostic Monitoring Equipment.
Industrial Automation Controllers
EP2AGX65CU17I5G can support industrial automation controllers that require configurable logic for sequencing, sensor aggregation, motor-control interfacing, and real-time data handling. Its verified 60,214 logic elements and 156 user I/O provide more design capacity than a small fixed-logic device, while the FPGA architecture permits post-assembly logic revisions without changing the silicon mask. The 358-ball LFBGA, FCBGA package is appropriate for a dense controller board, but the exact industrial temperature range and I/O-bank limits are not provided in the verified data. Confirm the Arria II GX device handbook, power rails, termination, and configuration interface before release.
Recommended
Communications Interface Equipment
EP2AGX65CU17I5G is relevant to communications interface equipment requiring parallel protocol processing, packet handling, buffering, and adaptable interconnect. The verified 60,214 logic elements, 5,371,904 programmable logic bits, and 156 I/O support systems in which several digital functions must be coordinated in one programmable device. The Arria II GX family name suggests communications applicability, but the supplied data does not verify transceiver count, maximum data rate, supported protocols, or clock resources. Do not assign a high-speed lane based on family naming alone. Review the official device handbook, signal-integrity guidance, and package ball map before selecting this FPGA for a communications product.
Recommended
Video and Imaging Processing
EP2AGX65CU17I5G can be evaluated for video and imaging systems that combine pixel processing, frame buffering, timing generation, sensor-interface control, and image-format conversion. Its 60,214 logic elements and 5,371,904 programmable logic bits provide substantial configurable capacity, while 156 user I/O can support multiple external control and data interfaces. The verified package is 358-ball LFBGA, FCBGA, so a production imaging design must account for fine-pitch routing, controlled-impedance signals, power integrity, and thermal performance. No verified embedded-memory size, maximum clock, video standard, or I/O voltage is supplied; obtain those parameters from the manufacturer documentation before implementation.
Recommended
Test and Measurement Equipment
EP2AGX65CU17I5G is suitable in principle for test and measurement equipment that needs configurable acquisition control, timing, stimulus generation, result aggregation, and instrument interfacing. The verified 60,214 logic elements and 156 I/O can accommodate multiple coordinated digital functions, while FPGA programmability helps accommodate evolving measurement modes and interface updates. A successful design must still verify clocking, timing closure, I/O standards, power integrity, and the 358-ball LFBGA, FCBGA land pattern. The provided data does not state the maximum operating frequency, transceiver capability, memory resources, or temperature range, so those details are intentionally not inferred.
Recommended
Embedded Computing Systems
EP2AGX65CU17I5G can serve as a configurable processing and control fabric in embedded computing systems. Its 60,214 logic elements, 5,371,904 programmable logic bits, and 156 I/O support hardware accelerators, interface bridges, custom memory controllers, and glue logic, while configuration can be updated as firmware evolves. The 358-ball LFBGA, FCBGA package demands careful escape routing and power distribution, and the verified evidence does not include core voltage, I/O voltages, package dimensions, embedded memory, or configuration-memory details. Use the official Intel device handbook and package drawing to establish the electrical and mechanical constraints before selecting it for an embedded design.
Recommended
Medical and Diagnostic Monitoring Equipment
EP2AGX65CU17I5G may be considered for medical or diagnostic monitoring equipment when a design needs configurable data acquisition, filtering, timing, and system-control functions. The verified 60,214 logic elements and 156 I/O offer a substantial programmable resource base, and FPGA configurability can assist with design iteration during equipment development. However, the supplied data does not establish medical-grade certification, AEC-Q100 qualification, safety certification, operating temperature, or reliability standards. Those requirements are system-level and regulatory matters that must be validated separately. Confirm electrical limits, package drawing, configuration scheme, and quality documentation with Intel before any medical design use.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65CU17I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65CU17I3G | EP2AGX65CU17C6G | EP2AGX65CU17C5N | EP2AGX65CU17C5G | EP2AGX65CU17C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 358-ball LFBGA, FCBGA | 358-ball LFBGA, FCBGA | 358-ball LFBGA, FCBGA | 358-ball LFBGA, FCBGA | 358-ball LFBGA, FCBGA | 358-ball LFBGA, FCBGA |
Key Differentiators
- Higher listed logic capacity (vs EP2AGX45CU17I5G)
- Large external interface capacity (vs EP2AGX45DF29I5G)
- Arria II GX family positioning (vs EP2AGX45CU17I3G)
Design Notes
Use the official Intel 358-ball LFBGA, FCBGA package drawing as the only source for pad geometry, ball numbering, and thermal-land details. The verified search data confirms 358 terminals and a square LFBGA package but does not provide dimensions or a complete ball map. Before layout, confirm escape routing for the BGA, via-in-pad policy, solder-mask definition, and the required thermal-pad geometry. A search snippet's package name is not sufficient to release production artwork.
Design the power tree from the official Arria II GX documentation. Core voltage, I/O voltages, rail tolerances, current consumption, ramp requirements, and decoupling values are not present in the verified web data and are marked [DATA_NEEDED]. Do not copy voltages or capacitor values from another FPGA family. Validate regulator transient response, sequencing, power-good behavior, and thermal limits using the selected ordering code's datasheet and device-handbook guidance.
Plan signal integrity around the actual 156 available I/O and the selected I/O bank assignments. The supplied data does not verify supported I/O standards, differential-pair limits, transceiver count, or maximum data rate. Use controlled impedance for high-speed routes, provide appropriate return paths, and verify all timing constraints in the Intel design flow. Confirm the configuration interface and configuration-device connections in the device handbook rather than inferring them from the FPGA family name.
The 358-ball LFBGA, FCBGA package requires a controlled thermal design, but verified thermal resistance, junction-temperature limits, and power-consumption values are unavailable. Calculate an estimated junction temperature only after obtaining total power and the package thermal data; label any such result as an estimate. Use the official thermal model and PCB guidance to define copper spreading, vias, airflow, and ambient operating conditions. The exact industrial temperature range must be confirmed rather than inferred from the I5G suffix.
Compliance Information
The verified distributor result states RoHS compliant. REACH, lead-free, halogen-free, conflict-minerals, and AEC-Q100 information was not provided. Obtain the current manufacturer declaration for the exact ordering code and lot.
