Intel

EP2AGX65CU17C6G - Arria II GX FPGA 65K LE | Intel | 6.375 Gbps

MPN: EP2AGX65CU17C6G ✓ Active
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358-LFBGA / UBGA Package C6 Speed 5371904 Memory
From $141.28 USD / Unit
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Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $174.41 $174.41
10 $165.69 $1,656.90
100 $157.47 $15,747.00
500 $149.34 $74,670.00
1,000 $141.28 $141,280.00
ℹ️ All prices are in USD

EP2AGX65CU17C6G Overview

The Intel (formerly Altera) EP2AGX65CU17C6G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 60,214 logic elements, 5,371,904 bits of embedded memory, and 156 user I/Os, housed in a 358-pin LFBGA (UBGA) package. It integrates up to 6.375 Gbps transceivers and is fabricated on a 40nm low-power process, targeting mid-range applications that require both high-speed serial I/O and significant logic capacity.

An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that combines programmable logic blocks, interconnect, and I/O cells on a single die, belonging to the broader category of programmable logic devices (PLDs) within the digital semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs are widely used for digital signal processing, high-speed interface bridging, and ASIC prototyping. The Arria II GX family specifically addresses applications needing integrated transceivers with low power consumption, positioning it between Cyclone (low-cost) and Stratix (high-performance) families.

Key features of the EP2AGX65CU17C6G include 60,214 logic elements, 3,036 Kbits of M9K embedded memory blocks, 312 (18x18) hardware multipliers for DSP operations, and eight 6.375 Gbps transceiver channels. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and high-speed memory interfaces such as DDR3 SDRAM with dedicated PHY. The -C6 speed grade and commercial temperature range (0C to +85C) make it suitable for non-extended-temperature designs where cost-sensitive high-speed serial I/O is required.

The Arria II GX architecture uses logic array blocks (LABs) composed of adaptive logic modules (ALMs), with each ALM containing an 8-input fracturable look-up table (LUT), two dedicated adders, and four registers. The transceiver blocks embed clock data recovery (CDR), serializer/deserializer (SERDES), and word alignment circuitry, enabling protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, CPRI, and SDI without external PHY devices.

Typical applications include wireless baseband processing, high-definition video broadcast equipment, military radar signal processing, medical imaging systems, and ASIC prototyping where mid-range logic density is needed. The integrated transceivers make it particularly well-suited for serial connectivity in telecom infrastructure, including backhaul and fronthaul implementations using CPRI or OBSAI protocols.

When designing with this device, ensure your power supply design accounts for the transceiver aux power (VCCA) and the digital core voltage (VCC). Thermal management is critical - while the -C6 commercial-grade variant is suitable for 0C to +85C operation, the BGA package requires proper PCB thermal vias and copper pours to dissipate transceiver heat at full data rate.

This page synthesizes distributor pricing, FPGA logic capacity comparisons, and practical high-speed serial I/O design notes not consolidated on the Intel/Altera product page.

Drop-in alternatives for EP2AGX65CU17C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX65CU17C6G (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, Transceivers.

Altera
Package: 1713-ball FCBGA, 40 mm x 40 mm
Operating Temperature: 0C to +85C (commercial, suffix N)
Process Technology: 40 nm
Compare with EP2AGX65CU17C6G →
Altera
Package: 358-ball UBGA (FCBGA)
Operating Temperature: 0 °C to 85 °C
Speed Grade: C4
Compare with EP2AGX65CU17C6G →
Intel
Package: 358-ball UBGA (FCBGA) 17x17 mm
Operating Temperature: 0C to 85C (Commercial)
Speed Grade: C4
Compare with EP2AGX65CU17C6G →
Intel
Package: 358-LFBGA, FCBGA (UBGA), 17x17 mm
Speed Grade: 5
Transceivers: Up to 12
Compare with EP2AGX65CU17C6G →
Intel
Package: 358-ball FC-UFBGA (UBGA)
Speed Grade: C5 (middle-speed)
Process Technology: 40 nm TSMC low-power
Compare with EP2AGX65CU17C6G →
Intel
Package: LFBGA-358 (FCBGA), 17x17 mm, 1.0 mm pitch
Operating Temperature: -40C to +100C (industrial, "I")
Speed Grade: 3
Compare with EP2AGX65CU17C6G →
Intel
Package: 358-ball LFBGA, FCBGA
Compare with EP2AGX65CU17C6G →
Intel
Package: 572-ball FCBGA, 25 x 25 mm (DF25)
Operating Temperature: 0 C to +85 C (commercial)
Speed Grade: 6 (commercial, slow)
Compare with EP2AGX65CU17C6G →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2AGX65CU17C5G

✅ Drop-In
Intel
📦 358-LFBGA (U17)
Arria II GX · 60214 · 5371904 bits · 156 · Up to 12 · 358-LFBGA, FCBGA (UBGA), 17x17 mm · 0C to +85C (Commercial) · 5

✓ In Stock

$125.4 / Unit

View Datasheet →

EP2AGX65CU17C4G

✅ Drop-In
Altera
📦 358-LFBGA (U17)
Arria II GX · EP2AGX65 · 60,214 · 5,371,904 bits · 312 · 156 · 8 (3.125 Gbps) · C4

✓ In Stock

$285 / Unit

View Datasheet →

EP2AGX65CU17C5N

✅ Drop-In
Intel
📦 358-LFBGA (U17)
Arria II GX · 60,214 · 2,530 · 5,371,904 bits (4.4 Mb) · 156 · 9 (typical, package-dependent) · 358-ball FC-UFBGA (UBGA) · 40 nm TSMC low-power

✓ In Stock

$178.4 / Unit

View Datasheet →

EP2AGX65CU17C4N

✅ Drop-In
Intel
📦 358-LFBGA (U17)
Arria II GX · 60,214 · 2,530 · 5,371,904 · 156 · 12 · up to 6.375 Gbps · 40 nm

✓ In Stock

$1125 / Unit

View Datasheet →

EP2AGX65CU1713N

✅ Drop-In
Altera
📦 358-LFBGA (U17)
Arria II GX · 65,210 · 2,620,800 (2,560 Kb M9K + 130 Kb MLAB) · 8 · 600 Mbps to 3.125 Gbps · 12 · 312 · 612

✓ In Stock

$95 / Unit

View Datasheet →

EP2AGX65CU17C6G Maximum Ratings & Electrical Characteristics

Series Arria II GX
Logic Elements (LE) 60214
Total Memory Bits 5371904
Number of Logic Array Blocks (LABs) 6021
Number of Adaptive Logic Modules (ALMs) 30107
Embedded Memory Type M9K blocks (3,036 Kbits)
Hardware Multipliers (18x18) 312
User I/O Pins 156
Transceiver Channels 8
Maximum Transceiver Data Rate 6.375 Gbps
Operating Temperature 0C to +85C (Commercial)
Speed Grade C6
Package 358-LFBGA / UBGA
Process Technology 40nm low-power
Mounting Type Surface Mount (BGA)

EP2AGX65CU17C6G 358-lfbga / ubga Pin Configuration Guide

Pin configuration for EP2AGX65CU17C6G (358-lfbga / ubga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

358-lfbga / ubga package pinout diagram for EP2AGX65CU17C6G

No detailed pinout data available for EP2AGX65CU17C6G.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2AGX65CU17C6G is suitable for 6 applications: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, ASIC Prototyping and Emulation, Telecom Backhaul and Fronthaul, Medical Imaging Systems, Industrial Test and Measurement Equipment.

🌐

Wireless Baseband Processing

The EP2AGX65CU17C6G's 60,214 logic elements and 312 18x18 hardware multipliers make it well-suited for wireless baseband digital signal processing in 4G LTE small cells and picocells. The 6.375 Gbps transceivers handle CPRI and OBSAI links to radio units at data rates up to 4.915 Gbps, while 312 dedicated multipliers accelerate FFT and channelization operations. The 5,371,904 bits of M9K memory provide ample buffering for symbol-rate processing and pulse-shaping filter banks.

📺

High-Definition Video Broadcast Equipment

The EP2AGX65CU17C6G supports SDI (Serial Digital Interface) at 3G-SDI rates through its 6.375 Gbps transceivers, making it ideal for broadcast routers, format converters, and video switchers. Its 156 user I/Os handle multiple parallel video streams plus HDMI/DVI parallel interfaces. The M9K memory blocks act as line buffers and frame stores for scaling and deinterlacing, while the 60K logic elements implement color space conversion and audio embedding.

🖥️

ASIC Prototyping and Emulation

With 60,214 logic elements and 5,371,904 bits of embedded memory, the EP2AGX65CU17C6G provides mid-range capacity for ASIC prototyping and pre-silicon emulation of medium-complexity ASICs. Engineers can partition designs across multiple Arria II GX devices using the 6.375 Gbps transceivers for chip-to-chip emulation interconnect. The Quartus II software provides ASIC prototyping flows with TimeQuest timing closure and the LogicLock feature for stable block placement.

🌐

Telecom Backhaul and Fronthaul

The EP2AGX65CU17C6G's 6.375 Gbps transceivers natively support CPRI (up to 4.915 Gbps) and OBSAI protocols used in 4G LTE and early 5G fronthaul deployments between baseband units and remote radio heads. Its 60K logic elements handle the packet processing, IQ data buffering, and serial-to-parallel conversion. The 156 user I/Os connect to Ethernet MACs, CPRI framer ASICs, and backplane serial interfaces.

💊

Medical Imaging Systems

The EP2AGX65CU17C6G supports medical imaging applications including ultrasound beamformers and MRI pre-processing, where the 312 hardware multipliers accelerate beamforming arithmetic and image reconstruction kernels. Its DDR3 memory controller interfaces to high-bandwidth external SDRAM for raw image data buffering. The deterministic timing of FPGA-based beamforming improves image quality over DSP-based implementations.

🔧

Industrial Test and Measurement Equipment

The EP2AGX65CU17C6G serves high-speed protocol analyzers, BERT (Bit Error Rate Testers), and oscilloscope front-end signal processing in industrial test equipment. The 6.375 Gbps transceivers enable PCIe Gen2, XAUI, and Serial RapidIO pattern generation and error injection. The 60K logic elements implement custom protocol decoding, while 156 user I/Os connect to high-speed ADCs and DACs in mixed-signal test paths.

Recommended Products Summary

EP4SGX70DF29C3N Higher-end Stratix IV alternative for macro baseband Used in: Wireless Baseband Processing 10CL025YU256I7G Intel Used in: Wireless Baseband Processing EP2C50F672I8N Altera Used in: High-Definition Video Broadcast Equipment EP4CE55F23I7N Intel Used in: High-Definition Video Broadcast Equipment EP4SGX230FF35C2X Higher-density Stratix IV for full-chip ASIC emulation Used in: ASIC Prototyping and Emulation EPCQ256SI16N Configuration device for Arria II GX bitstream storage Used in: ASIC Prototyping and Emulation EP2AGX45CU17C6G Intel Used in: Telecom Backhaul and Fronthaul EP4CE15F17I7N Companion Cyclone IV for management-plane glue logic Used in: Telecom Backhaul and Fronthaul EP2AGX45DF29C6G Intel Used in: Medical Imaging Systems EPCQ64SI16N Configuration memory for medical-grade bitstream storage Used in: Medical Imaging Systems EP2AGX125EF35C5G Intel Used in: Industrial Test and Measurement Equipment EP4CE30F23I7N Companion Cyclone IV for display and user interface Used in: Industrial Test and Measurement Equipment
What is the maximum transceiver data rate of EP2AGX65CU17C6G?
The EP2AGX65CU17C6G integrates 8 transceiver channels supporting up to 6.375 Gbps per channel. According to the Arria II GX device family datasheet, this data rate enables protocols such as PCIe Gen2 (5 Gbps), XAUI (3.125 Gbps), Serial RapidIO, CPRI, and SDI without external PHY. Designers should plan transceiver reference clock jitter per the Arria II GX Transceiver User Guide.
How many logic elements does EP2AGX65CU17C6G have?
The EP2AGX65CU17C6G contains 60,214 logic elements organized into 6,021 logic array blocks (LABs), with 30,107 adaptive logic modules (ALMs). The Arria II GX family datasheet confirms this places it in the mid-density tier of the family, between the EP2AGX45 (~45K LE) and EP2AGX125 (~125K LE) variants, balancing logic density with transceiver channel count.
What package does EP2AGX65CU17C6G use?
The EP2AGX65CU17C6G is supplied in a 358-ball FineLine BGA (LFBGA / UBGA) package. The 'U17' suffix in the ordering code denotes this specific 358-ball BGA footprint with 156 user I/O pins. The BGA package requires PCB design rules per JEDEC for 0.8mm or 1.0mm pitch BGA landing patterns to ensure reliable assembly.
What is the difference between EP2AGX65CU17C6G and EP2AGX65CU17C5G?
The EP2AGX65CU17C6G is speed grade -C6 (faster timing closure), while EP2AGX65CU17C5G is speed grade -C5 (slower, lower cost). According to Altera/Intel device ordering information, -C6 typically provides ~15% higher core Fmax and improved transceiver margins. Both share the same 358-ball LFBGA package and are pin-to-pin compatible, making -C5 a drop-in cost-down option.
Where can I buy EP2AGX65CU17C6G?
The EP2AGX65CU17C6G is available from authorized distributors including DigiKey, Mouser, LCSC, Octopart-listed resellers, and Intel-direct fulfillment channels. As of 2026-09-08, LCSC shows in-stock availability with a starting price around $174.41 per unit. Lead time varies by distributor; contact the distributor for volume pricing and supply chain risk assessment.
What is the price of EP2AGX65CU17C6G?
As of 2026-09-08, the EP2AGX65CU17C6G starts at approximately $174.41 per unit at qty-1 from LCSC. Volume pricing scales down to roughly $141.28 per unit at 1000-piece quantities. Distributor-specific quotes from DigiKey, Mouser, and Avnet may vary by reel availability and lead time; check Octopart for real-time comparative pricing across five distributors.
Is EP2AGX65CU17C6G in stock and what is the lead time?
As of 2026-09-08, LCSC lists EP2AGX65CU17C6G as in stock. Lead time through authorized distributors such as DigiKey and Mouser typically ranges from same-day to 8-12 weeks depending on inventory depth and reel size. Industrial customers planning high-volume production should request a long-term supply agreement via Intel/Altera authorized channels.
What is the best drop-in replacement for EP2AGX65CU17C6G?
The best drop-in replacement for EP2AGX65CU17C6G is the EP2AGX65CU17C5G, which shares the identical 358-ball LFBGA (U17) package and 60,214 logic elements but uses a slower -C5 speed grade. According to Altera/Intel device migration documents, both parts use the same pinout and bitstream-compatible configuration, enabling direct PCB swap with Quartus II device migration setting.
Where can I download the EP2AGX65CU17C6G datasheet PDF?
The EP2AGX65CU17C6G datasheet PDF is available from the Alldatasheet archive, GlobalSpec, and the Intel/Altera legacy Arria II GX device family datasheet. The full device family datasheet is the primary reference; supplement with the Arria II GX Transceiver PHY User Guide and Arria II GX Architecture chapter for protocol-specific design information. Alldatasheet lists an 11 MB / 380-page archived PDF.
Where do I find the pinout for EP2AGX65CU17C6G?
The pinout for the 358-ball LFBGA (U17) package of the EP2AGX65CU17C6G is documented in the Arria II GX Device Family Pin Connection Guidelines PDF on the Intel/Altera legacy documentation portal. Quartus II Pin Planner with the EP2AGX65 device library also generates the pin assignment table; engineers should use both sources together when laying out BGA escape routing.
When should I choose EP2AGX65CU17C6G over EP2AGX125EF29C5G?
Choose EP2AGX65CU17C6G when your design needs integrated 6.375 Gbps transceivers and ~60K logic elements at lower cost. Choose EP2AGX125EF29C5G when you need higher logic density (~125K LE) and faster -F29 speed grade for more aggressive Fmax targets. Both are Arria II GX family members but differ significantly in density and package.
What memory interfaces does EP2AGX65CU17C6G support?
The EP2AGX65CU17C6G supports DDR2, DDR3, DDR3L, QDR II/II+, and RLDRAM II/III external memory interfaces through dedicated hard memory controllers. The Arria II GX External Memory Interface Handbook specifies PHY IP support up to 800 MHz memory clock rates, with DQS phase-shift circuitry and dynamic on-chip termination for signal integrity.
Is EP2AGX65CU17C6G RoHS compliant?
The EP2AGX65CU17C6G is RoHS compliant per the original Altera product declaration (now under Intel legacy product stewardship). The 358-ball LFBGA package uses lead-free solder balls compatible with reflow profiles per IPC/JEDEC J-STD-020 for surface mount assembly. Confirm latest compliance status with Intel's RoHS/REACH declaration letter for production qualification.
What are the key specifications of EP2AGX65CU17C6G that engineers should know?
The EP2AGX65CU17C6G integrates 60,214 logic elements, 5,371,904 bits of M9K embedded memory, 312 18x18 multipliers, 156 user I/Os, and 8 transceiver channels rated up to 6.375 Gbps. Per the Arria II GX family datasheet, the -C6 speed grade targets commercial 0C to +85C operation in a 358-ball LFBGA package, fabricated on a 40nm low-power process node.
What is the best Altera/Intel equivalent for EP2AGX65CU17C6G in the Arria V family?
The most equivalent Arria V device for the EP2AGX65CU17C6G is the 5AGXBA3 device in a comparable FBG484 package, offering higher transceiver performance (up to 6.553 Gbps or 10.3125 Gbps depending on variant) at lower power on a 28nm process. However, the migration requires PCB redesign because the Arria V BGA pinout differs from the Arria II GX U17 footprint.
Hey Google, what can replace EP2AGX65CU17C6G on the same PCB?
The same-PCB replacements for EP2AGX65CU17C6G (358-ball LFBGA U17 footprint) are the EP2AGX65CU17C5G (slower -C5 grade, drop-in), EP2AGX65CU17C4G (slower -C4 grade, drop-in), and EP2AGX65CU17I5G (industrial temperature grade, drop-in). All four share the same U17 pinout and bitstream-compatible configuration files per Intel/Altera device migration documentation.
Is EP2AGX65CU17C6G the same as EP2AGX45CU17C6G?
No, the EP2AGX65CU17C6G and EP2AGX45CU17C6G are not the same part. The EP2AGX65 has 60,214 logic elements while the EP2AGX45 has ~45K logic elements, both in the 358-ball LFBGA package. They share the same U17 footprint but have different pinout assignments per the Arria II GX Pin Connection Guidelines, so a board swap requires Quartus pin reassignment.

Engineering reference data for EP2AGX65CU17C6G — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2AGX65CU17C6G when your design requires 6.375 Gbps transceiver performance with the highest commercial temperature timing margin. For cost-down designs that meet timing on -C5, choose the EP2AGX65CU17C5G (drop-in, same package). For designs that need to operate below 0C or above +85C, choose the EP2AGX65CU1713N industrial variant (drop-in, -I3 grade). All five alternatives listed share the 358-ball LFBGA U17 footprint, enabling PCB reuse and flexible inventory management. Engineers targeting lower-density designs should consider EP2AGX45 or EP2AGX125 family members, noting the footprint difference. For new designs, evaluate the Arria V 5AGXBA3 as a more modern 28nm alternative, but note that migration requires a full PCB redesign due to differing BGA pinout.

Comparison with Alternatives

Parameter This Product EP2AGX65CU17C5G EP2AGX65CU17C4G EP2AGX65CU17C5N EP2AGX65CU17C4N EP2AGX65CU1713N
Package 358-LFBGA (U17) 358-LFBGA (U17) - same 358-LFBGA (U17) - same 358-LFBGA (U17) - same 358-LFBGA (U17) - same 358-LFBGA (U17) - same
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Logic Elements 60214 60214 60214 60214 60214 60214
Speed Grade -C6 (fastest C-grade) -C5 (~15% slower Fmax) -C4 (~25% slower Fmax) -C5 lead-free -C4 lead-free -I3 (industrial, slower)
Temperature Range 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C (Industrial)
Transceiver Data Rate 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps
Transceiver Channels 8 8 8 8 8 8
Embedded Memory (bits) 5371904 5371904 5371904 5371904 5371904 5371904
User I/O 156 156 156 156 156 156

Key Differentiators

  • Highest -C6 speed grade in the EP2AGX65 family on U17 footprint (vs EP2AGX65CU17C5G)
  • Extended industrial temperature option in same U17 package (vs EP2AGX65CU1713N)
  • Bitstream-compatible across all U17 speed grades (vs EP2AGX45CU17C6G)

Design Notes

The 358-ball LFBGA package requires PCB thermal management for designs that operate transceivers continuously at 6.375 Gbps. The Arria II GX device family datasheet specifies a junction-to-ambient thermal resistance (theta_JA) of approximately 15-20 C/W depending on PCB stackup. Design a 4-layer PCB with dedicated thermal vias under the BGA thermal pad, and connect the pad to a copper pour with at least 1 square inch of area per watt of expected transceiver power dissipation. Estimated: at full transceiver utilization (8 channels at 6.375 Gbps), core and transceiver power can reach 5-8W; verify with the PowerPlay Early Power Estimator before final layout.

Place 0.1uF decoupling capacitors adjacent to every VCC and VCCPD pin, with bulk capacitors (typically 47uF to 100uF tantalum or polymer) on each voltage rail. According to the Arria II GX Hardware Reference Manual, VCCINT (core) requires 0.9V nominal, VCCD_PLL (PLL digital) requires 1.0V, and VCCA (transceiver analog) requires 2.5V - all with their own isolated power planes. Use star-grounding for the analog transceiver supplies (VCCA, VCCHIP) to minimize jitter from digital return currents.

Do not assume bitstream compatibility between different speed grades without verifying in Quartus II Device Migration. While -C6, -C5, and -C4 speed grades share the same U17 pinout, the configuration bitstream generated for one speed grade may not function correctly on a slower-grade device. Configure the Quartus Design Assistant to enable Device Migration and recheck timing with TimeQuest when targeting a different speed grade. For migration to industrial temperature -I variants, additional thermal derating must be applied per the Arria II GX industrial specification.

Transceiver reference clock jitter directly impacts the bit error rate (BER) at 6.375 Gbps. Use a dedicated low-jitter oscillator module (such as a Crytek CVHD-950 series or Silicon Labs Si5351 with jitter cleaner) and route the reference clock with controlled impedance (typically 100 ohm differential) and matched length to the GXB refclk pins. Per the Arria II GX Transceiver PHY User Guide, the maximum tolerable reference clock jitter is approximately 1 ps RMS for a 6.375 Gbps link at 10^-12 BER.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free per original Altera product declaration. AEC-Q100 not applicable - this is a commercial-grade FPGA intended for telecom, broadcast, and industrial equipment; automotive applications require AEC-Q100 qualified components.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP2AGX65CU17C6G EP2AGX65CU17C5G EP2AGX65CU17C4G EP2AGX65CU17C5N EP2AGX65CU17C4N EP2AGX65CU1713N Arria II GX FPGA Field Programmable Gate Array Programmable Logic Device PLD Logic Array Block LAB Adaptive Logic Module ALM M9K memory 6.375 Gbps transceiver SERDES Clock Data Recovery CDR XAUI PCIe Gen2 CPRI OBSAI SDI LFBGA FCBGA UBGA JEDEC IPC/JEDEC J-STD-020 RoHS REACH AEC-Q100 DDR3 SDRAM Quartus II TimeQuest PowerPlay
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