EP2AGX65DF29C6N - Arria II GX 65K LE FPGA, 780-FBGA | Intel
MPN: EP2AGX65DF29C6N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248.5 | $24,850.00 |
| 250 | $232 | $58,000.00 |
| 500 | $218.75 | $109,375.00 |
EP2AGX65DF29C6N Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceiver slices that can be re-programmed post-manufacturing. FPGAs sit at the apex of digital logic integration, between fixed-function ASICs and software-driven processors, providing hardware-timed parallel processing at nanosecond latency. The Arria II GX family is positioned as the mid-density, transceiver-rich member of Intel's programmable logic portfolio, balancing cost, power, and high-speed serial I/O for mainstream applications.
Key features of the EP2AGX65DF29C6N include 2,530 LABs/CLBs, dedicated 18x18 multipliers, hard PCI Express Gen2 controller cores, and support for DDR3 SDRAM interfaces with on-chip termination. The 780-FBGA (29 mm x 29 mm) package includes an exposed die pad for thermal dissipation and supports the industrial operating range when ordered with the I-temperature suffix. The EP2AGX65DF29C6N variant specifies the C6 speed grade (commercial, -6) for cost-sensitive deployments where maximum transceiver reach is not required.
Architecturally, the device uses a 40nm low-leakage CMOS process with on-die decoupling, clock networks with up to 16 PLLs, and adaptive logic modules (ALMs) that can implement 6-input look-up tables. The hard transceiver macros support multiple serial protocols without consuming soft logic resources, which preserves fabric utilization for the application payload.
Typical applications include wireless baseband processing, video broadcast and image processing, military secure communications, and high-speed serial protocol bridging. Its combination of moderate logic density, embedded transceivers, and cost-effective packaging makes it well-suited for production deployments where the higher-end Arria V or Stratix families would be over-specified.
Design considerations include PCB layout for the FBGA package (requires microvia stack-up and matched-length routing for transceiver channels), power sequencing for the 0.9V core and 1.8V/2.5V/3.3V I/O rails, and thermal management via the exposed pad. Quartus II software provides the development environment for HDL synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in speed-grade alternatives from the Arria II GX family, and practical design guidance not consolidated in the Intel datasheet.
Drop-in alternatives for EP2AGX65DF29C6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29C6N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX65DF29C6G
β Drop-Inβ In Stock
$245.3 / Unit
View Datasheet βEP2AGX65DF29C5N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2AGX65DF29C4N
β Drop-Inβ In Stock
$605 / Unit
View Datasheet βEP2AGX65DF29C3N
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2AGX65DF29I3N
β Drop-Inβ In Stock
$175 / Unit
View Datasheet βEP2AGX65DF29I5N
β Drop-Inβ In Stock
$1015 / Unit
View Datasheet βEP2AGX65DF29C6N Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LE) | 60,214 |
| Embedded Memory | 5,371,904 bits |
| Logic Array Blocks (LABs) | 2,530 |
| User I/Os | 364 |
| Package | 780-FBGA, FCBGA (29 mm) |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Transceiver Count | 12 (max) |
| Transceiver Data Rate | Up to 3.75 Gbps |
| Number of Pins/ Balls | 780 |
| Operating Temperature | 0C to +85C (commercial, C-grade) |
| Speed Grade | 6 (C6) |
| Mounting Type | Surface Mount (FBGA) |
| RoHS Status | Compliant |
| Embedded Multipliers | Yes (18x18) |
| Hard PCIe Controller | PCI Express Gen2 (x1/x4/x8) |
EP2AGX65DF29C6N 780-fbga, fcbga (29 mm) Pin Configuration Guide
Pin configuration for EP2AGX65DF29C6N (780-fbga, fcbga (29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29C6N is suitable for 6 applications: Wireless Baseband Processing, PCI Express Gen2 Endpoint Card, Broadcast Video Processing and SDI Interfaces, Industrial Serial Protocol Bridging, Military Secure Communications, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX65DF29C6N fits wireless baseband processing where its 60,214 logic elements, 12 transceivers up to 3.75 Gbps, and hard CPRI support deliver real-time digital up/down-conversion and fronthaul links. Compared with software-only DSPs, this FPGA executes baseband at nanosecond latency while the transceivers carry CPRI Option 5 (4.9152 Gbps) to remote radio heads. With 5,371,904 bits of embedded memory the device buffers symbol-rate data between DSP pipelines and external DDR3.
Recommended
PCI Express Gen2 Endpoint Card
The EP2AGX65DF29C6N is well matched to PCI Express Gen2 endpoint applications because of its hard PCIe Gen2 controller (x1/x4/x8) and integrated transceivers up to 5 Gbps raw line rate. Designers route only 2.5/5 Gbps lanes to the edge connector while the fabric handles DMA engines, protocol stacks, and optional NVMe storage logic. The 780-FBGA package supports the BGA-down PCIe card layout typical in x8 edge cards.
Recommended
Broadcast Video Processing and SDI Interfaces
For SD/HD/3G-SDI broadcast video routers and embedders, the EP2AGX65DF29C6N provides 12 transceivers at rates that cover SMPTE 424M (2.97 Gbps) with margin. The 60K LE fabric implements audio embed/de-embed, ancillary data processing, and genlock logic while the transceiver macros drive or receive SDI coax directly with proper external connectors. The commercial 0C to +85C temperature range is sufficient for studio installations.
Recommended
Industrial Serial Protocol Bridging
Industrial gateways using the EP2AGX65DF29C6N benefit from the combination of protocol-flexible transceivers (RapidIO, GbE, Aurora) and abundant soft-logic resources for legacy serial interfaces such as UART, SPI, I2C, and Modbus bridging. The exposed-die FBGA package supports industrial -40C to +85C mounting when the I-grade speed options are selected. The fabric handles 32-bit or 64-bit protocol translation at wire speed with deterministic latency.
Recommended
Military Secure Communications
The Arria II GX family including EP2AGX65DF29C6N is widely used in tactical radios and secure communication links where the transceivers support proprietary waveforms up to 3.75 Gbps. For -40C to +100C operation, the I-suffix speed grades provide drop-in compatibility in the same 780-FBGA footprint. The 40 nm low-leakage process reduces idle power consumption important in battery-powered manpack radios.
Recommended
Test and Measurement Instrumentation
Automated test equipment (ATE) and protocol analyzers use the EP2AGX65DF29C6N for its 12 multi-rate transceivers that simultaneously capture or generate lanes at differing rates for protocols like PCIe, SATA, and GbE. The 5,371,904-bit embedded memory supports deep trace buffers at full line rate, while the FPGA fabric implements pattern generators, error injectors, and protocol decoders in real time. The commercial temperature range suits bench and laboratory environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29C6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29C6G | EP2AGX65DF29C5N | EP2AGX65DF29C4N | EP2AGX65DF29C3N | EP2AGX65DF29I3N | EP2AGX65DF29I5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) 29 mm | 780-FBGA (F29) 29 mm - same | 780-FBGA (F29) 29 mm - same | 780-FBGA (F29) 29 mm - same | 780-FBGA (F29) 29 mm - same | 780-FBGA (F29) 29 mm - same | 780-FBGA (F29) 29 mm - same |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Speed Grade | C6 (fastest commercial) | C6 (fastest) | C5 (~10% slower than C6) | C4 (~20% slower) | C3 (~30% slower) | I3 (industrial, ~25% slower) | I5 (industrial, ~15% slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Embedded Memory | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceivers | 12 @ up to 3.75 Gbps | 12 @ up to 3.75 Gbps | 12 @ up to 3.75 Gbps | 12 @ up to 3.75 Gbps | 12 @ up to 3.75 Gbps | 12 @ up to 3.75 Gbps | 12 @ up to 3.75 Gbps |
| Process Technology | 40 nm CMOS | 40 nm CMOS | 40 nm CMOS | 40 nm CMOS | 40 nm CMOS | 40 nm CMOS | 40 nm CMOS |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Highest commercial speed grade in Arria II GX 60K-LE family (vs EP2AGX65DF29C5N)
- Commercial temperature grade (lower cost than industrial) (vs EP2AGX65DF29I3N)
- 60,214 LE in 780-FBGA - mid-density sweet spot (vs EP2AGX125EF35C6N)
Design Notes
The 780-FBGA package includes an exposed die-attach pad that must be soldered to the PCB ground pour for both electrical ground return and thermal dissipation. The Intel datasheet specifies that without this solder connection the junction-to-ambient thermal resistance degrades by 30-50%, leading to thermal shutdown under heavy transceiver utilization. Use an array of thermal vias (0.3 mm diameter, 1.0 mm pitch) under the die pad to a large inner copper plane to achieve the published theta_JA.
PCB layout for the 780-FBGA F29 package at 1.0 mm ball pitch requires a microvia (laser-drilled) stack-up - standard 0.4 mm mechanical vias are not routable between balls. Use 4-2-4 or 6-layer stack-up with sequential lamination, and escape each ball on the top layer through one microvia. Match transceiver lane length within 150 microns (about 1 ps skew at 6 Gbps) and route differential pairs to 100 ohm +/- 10% impedance. Reference the Arria II GX handbook's PCB layout checklist.
Power sequencing is required: all 1.8V, 2.5V, and 3.3V I/O/aux rails must reach regulation before or simultaneously with the 0.9V core to prevent latch-up. Designers commonly use a sequencer IC such as the LTC2923 or TI UCD90120A. Per the Arria II GX handbook, the inrush current on the 0.9V rail can exceed 6A at power-up, so the regulator must support soft-start or be sized for that transient.
Do not confuse speed grade ordering: EP2AGX65DF29C6N (C6, fastest) vs C5/C4/C3 (slower but cheaper). Selecting a slower grade that fails timing closure after PCB fab wastes $1000+ in board rework. Always run Quartus II timing analysis with the chosen speed grade BEFORE finalizing the PCB BOM. Also note: I3 and I5 industrial parts share the F29 package and pinout with C6 but are tested for industrial temperature; do not use them in commercial-only environments to avoid unnecessary cost.
Compliance Information
RoHS and REACH compliant per Intel product environmental documentation. Halogen-free status not explicitly listed in the verified data; C6 speed grade is lead-free (Pb-free) per the datasheet ordering code. AEC-Q100 does not apply (FPGA not designed per automotive AEC standards).
