EP2AGX65DF29C6G - Arria II GX FPGA 60K LE 780-FBGA | Altera / Intel
MPN: EP2AGX65DF29C6G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $305.5 | $3,055.00 |
| 100 | $289 | $28,900.00 |
| 500 | $268.75 | $134,375.00 |
| 1,000 | $245.3 | $245,300.00 |
EP2AGX65DF29C6G Overview
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and I/O pads that can be reconfigured by the customer after manufacturing to implement custom digital logic. FPGAs occupy a unique position in the system hierarchy: they sit between fixed-function ASICs (high NRE cost, low unit cost) and microcontrollers (lower performance, software-driven). Within Intel's programmable logic lineup, the Arria II GX family is positioned between the lower-cost Cyclone series and the high-performance Stratix series, targeting mid-range applications that require transceivers, moderate logic density, and a balance between cost and performance.
Key features of the EP2AGX65DF29C6G include 60,214 logic elements, 5,371,904 bits of embedded SRAM, 12 dedicated 18x18 multipliers, 12 full-duplex multi-gigabit transceivers (C6 speed grade, 6 Gbps maximum data rate), and 364 user I/O pins. The device supports high-speed external memory interfaces including DDR3, DDR2, and QDR II+/QDR II SRAM. It is built on TSMC's 40 nm low-power process, balancing performance with power efficiency.
Architecturally, the Arria II GX combines a logic fabric based on 8-input adaptive logic modules (ALMs), embedded memory blocks (M9K/M144K), variable-precision DSP blocks, and a transceiver tile array. The 6-speed-grade (-C6) designation indicates a commercial temperature range and a mid-tier speed bin. The 780-BGA package uses flip-chip technology to minimize inductance and support the multi-gigabit transceiver signaling integrity required for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI.
Typical applications include wireless baseband processing, radar signal processing, video broadcast equipment, software-defined radio (SDR) platforms, military secure communications, and high-speed serial interface bridging. The integrated transceivers make it particularly well-suited for designs that require multi-gigabit serial I/O without an external PHY.
When designing with the EP2AGX65DF29C6G, allocate adequate PCB layers (typically 8 to 14) to maintain signal integrity on the multi-gigabit transceiver lanes, follow Intel/Altera's power distribution and decoupling guidelines, and use the Quartus II design software (version 13.0 or compatible) for synthesis, place-and-route, and timing closure. The 780-FBGA package has a 1.0 mm or finer pitch and requires advanced assembly techniques including X-ray inspection of solder joints.
This page consolidates distributor pricing, same-family Arria II GX drop-in alternatives, and practical design considerations beyond what is found in the manufacturer datasheet.
Drop-in alternatives for EP2AGX65DF29C6G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29C6G (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX65DF29C6N
β Drop-Inβ In Stock
$218.75 / Unit
View Datasheet βEP2AGX65DF29C5G
β Drop-Inβ In Stock
$245 / Unit
View Datasheet βEP2AGX65DF29C4G
β Drop-Inβ In Stock
$219 / Unit
View Datasheet βEP2AGX65DF29C6
β Drop-Inβ In Stock
$440 / Unit
View Datasheet βEP2AGX65DF29C5N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2AGX65DF29C4N
β Drop-Inβ In Stock
$605 / Unit
View Datasheet βEP2AGX65DF29C3N
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2AGX65DF29C6G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory Bits | 5,371,904 |
| Number of I/O | 364 |
| Core Voltage | 0.9 V |
| Number of Transceivers | 12 |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) |
| Number of PLLs | 12 |
| Number of 18x18 Multipliers | 12 |
| Process Technology | 40 nm |
| Package | 780-pin FC-FBGA |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Operating Temperature Range | 0C to +85C (Commercial) |
| Speed Grade | C6 (Commercial, mid-tier) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2AGX65DF29C6G 780-pin fc-fbga Pin Configuration Guide
Pin configuration for EP2AGX65DF29C6G (780-pin fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29C6G is suitable for 7 applications: Wireless Baseband Processing, Software Defined Radio (SDR) Platforms, Video Broadcast and Studio Equipment, Radar Signal Processing, High-Speed Serial Interface Bridging, Medical Imaging Systems, Industrial Automation and Machine Vision.
Wireless Baseband Processing
The EP2AGX65DF29C6G is well-suited for wireless baseband signal processing, where its 60,214 logic elements and 12 multi-gigabit transceivers (6 Gbps per channel, C6 speed grade) provide ample resources for FFT/iFFT engines, channel coding, and digital up/down conversion. Placed on the baseband card between the RF front-end and the host processor, it enables CPRI/OBSAI fronthaul connectivity to remote radio units. The 5,371,904 embedded memory bits are sufficient for symbol-rate buffers and channel state tables, while 12 PLLs handle the multiple clock domains required by radio ASIC interfaces. Compared to a DSP-only architecture, the Arria II GX offers deterministic latency and parallel processing capability at the cost of higher per-unit price.
Recommended
Software Defined Radio (SDR) Platforms
In software defined radio platforms, the EP2AGX65DF29C6G provides the reconfigurable fabric that adapts to evolving waveform standards. Its 12 transceivers operating at up to 6 Gbps support wide-bandwidth ADC/DAC interfacing (JESD204B-style) and high-speed digital data exchange. The 60K logic elements and dedicated DSP blocks handle FFT, channelization, and demodulation in military, public-safety, and test-and-measurement SDR applications. Placed between the RF digitizer ASIC and the host CPU, it functions as a programmable coprocessor. The 780-FBGA flip-chip package preserves signal integrity on multi-GHz analog interfaces, while 0.9 V core voltage on the 40 nm process keeps power within thermal envelope for portable form factors.
Recommended
Video Broadcast and Studio Equipment
The EP2AGX65DF29C6G addresses broadcast video applications including SDI routers, format converters, and multiviewers. Its 6 Gbps transceivers directly support 3G-SDI, 6G-SDI, and emerging 12G-SDI/Quad-link 3G-SDI interfaces via multiple bonded channels. The 60,214 logic elements handle video scaling, color-space conversion, and audio embedding/de-embedding at full raster rates. The 5,371,904 bits of embedded SRAM serve as line buffers for scaling and frame stores. Placed at the crosspoint of a broadcast router, it processes uncompressed video streams in real time with deterministic latency - a critical requirement for live production workflows. Compared to ASIC solutions, the FPGA's reconfigurability accommodates new codec standards.
Recommended
Radar Signal Processing
For radar signal processing, the EP2AGX65DF29C6G delivers the compute density and I/O bandwidth required by phased-array and synthetic-aperture radar (SAR) front-ends. The 60,214 logic elements combined with 12 dedicated 18x18 multipliers enable pulse compression, MTI filtering, and CFAR detection in real time across hundreds of antenna channels. Its 12 transceivers connect to high-speed ADC and DAC devices (such as the ADC-2 family) digitizing IF signals at multi-gigasample rates. Placed between the RF digitizer and the radar processor, the FPGA pre-processes raw samples to reduce downstream bandwidth. The C6 commercial speed grade supports deterministic timing closure on high-speed datapaths.
Recommended
High-Speed Serial Interface Bridging
The EP2AGX65DF29C6G functions as a protocol-bridging FPGA between incompatible high-speed serial standards. With 12 transceivers at 6 Gbps each, it can simultaneously host PCI Express Gen2 x4 endpoints, multiple Gigabit Ethernet ports, Serial RapidIO links, and Aurora channels - all in a single device. The 60K logic elements handle protocol state machines, DMA controllers, and PCIe transaction layers. Placed on adapter cards connecting legacy backplanes to modern serial fabrics, it eliminates the need for multiple discrete bridge chips. Compared to ASSP bridge solutions, the Arria II GX offers protocol flexibility and field-upgradeable firmware, trading off BOM integration for design adaptability.
Recommended
Medical Imaging Systems
In medical imaging equipment such as ultrasound, CT, and MRI systems, the EP2AGX65DF29C6G performs real-time beamforming, image reconstruction, and DICOM interfacing. The 60,214 logic elements handle channel summation and apodization across 64 to 128 ultrasound channels, while the 12 transceivers aggregate high-speed digitized RF data from multi-element probe heads. The 5,371,904 embedded memory bits buffer raw scan lines before image formation. Placed between the analog front-end ASICs and the host processor, it provides deterministic latency essential for echo timing. Compared to GPU-based processing, the FPGA achieves lower power per channel and predictable real-time response required by diagnostic equipment.
Recommended
Industrial Automation and Machine Vision
For industrial machine vision systems, the EP2AGX65DF29C6G interfaces high-resolution Camera Link, CoaXPress, or GigE Vision cameras at line rates exceeding 1 GB/s. Its 12 transceivers accept multi-lane CoaXPress v1.1 or v2.0 connections from machine vision cameras, while the 60,214 logic elements run image preprocessing, defect detection, and barcode/OCR algorithms in real time. The 5,371,904 embedded memory bits hold frame buffers and pattern templates. Placed between the industrial camera and the PLC or robot controller, the FPGA reduces network traffic by pre-processing image streams. The C6 commercial speed grade meets 0C to +85C industrial temperature requirements, and the 780-FBGA package is rated for vibration environments when properly PCB-mounted.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29C6G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29C6N | EP2AGX65DF29C5G | EP2AGX65DF29C4G | EP2AGX65DF29C6 | EP2AGX65DF29C5N | EP2AGX65DF29C4N | EP2AGX65DF29C3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (DF29) | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Embedded Memory (bits) | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Number of Transceivers | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| Speed Grade | C6 | C6 | C5 (~15% slower) | C4 (~25% slower) | C6 | C5 (~15% slower) | C4 (~25% slower) | C3 (~30% slower) |
| RoHS Compliance | Yes (G suffix) | No (N suffix - lead-bearing) | Yes (G suffix) | Yes (G suffix) | Standard commercial | No (N suffix - lead-bearing) | No (N suffix - lead-bearing) | No (N suffix - lead-bearing) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- RoHS lead-free compliance on G suffix (vs EP2AGX65DF29C6N)
- Highest speed grade in the DF29 family (vs EP2AGX65DF29C5G)
- Full 6 Gbps transceiver operation across all 12 channels (vs EP2AGX65DF29C4G)
- Mid-tier price-performance in Arria II GX family (vs EP2AGX125DF25C6G)
Design Notes
The 780-FBGA flip-chip package requires a multilayer PCB (typically 8 to 14 layers) with controlled-impedance routing for the multi-gigabit transceiver channels. Follow Intel/Altera's recommended stackup with continuous ground planes adjacent to signal layers for the 6 Gbps SERDES channels. Use 1.0 mm pitch BGA fanout with microvia-in-pad or dog-bone escape routing, and add X-ray inspection during PCBA to detect flip-chip solder joint defects (head-in-pillow, non-wet opens).
The EP2AGX65DF29C6G requires multiple supply rails (0.9 V core, 1.1 V/1.2 V/1.5 V auxiliary, 2.5 V/3.3 V I/O) with strict sequencing requirements. Decouple each rail with a combination of bulk tantalum or polymer capacitors and 0402/0201 ceramic capacitors placed within 100 mils of the BGA balls. Power estimation in Quartus II PowerPlay should be run with post-place-and-route switching activity to confirm rail current before finalizing the power supply design.
A common pitfall is using the wrong Quartus II version: Arria II GX device support was dropped after Quartus II version 13.0 (the 13.0sp1 web edition is the last fully compatible release for this device). Newer Quartus versions do NOT support Arria II GX, and design files targeting newer versions will fail synthesis. Also ensure the configuration scheme (AS, AP, JTAG, or FPP) is selected correctly during early board bring-up; misconfigured MSEL pins are a leading cause of failed initial configuration on first-power-up boards.
The 780-FBGA package has a typical theta_JA of approximately 12 C/W with adequate PCB thermal vias and airflow. At maximum logic utilization and 6 Gbps transceiver activity, junction temperature can approach 90Β°C in an enclosed chassis. Use the thermal models available in the Altera Arria II GX Thermal Model Library (provided as a FloTHERM/ANSYS Icepak-compatible file) to validate thermal design before PCB layout freeze.
Multi-gigabit transceiver channels at 6 Gbps require careful signal-integrity design including AC-coupling capacitors (100 nF X7R 0402) on each transmit/receive pair, controlled 100-ohm differential impedance, and pre-emphasis/de-emphasis settings configured via the Altera Transceiver Toolkit. Reference Intel Application Note AN571 for PCIe Gen2 channel compliance and AN558 for general SERDES link-margin validation procedures.
Compliance Information
RoHS compliance is denoted by G suffix per Altera/Intel nomenclature. Lead-bearing N suffix variant is non-RoHS and intended for legacy applications only. Not AEC-Q100 qualified (FPGAs are not automotive-qualified in the Arria II GX family).
