EP2AGX65DF29C5G - Arria II GX FPGA 60K LE 780-FBGA | Intel
MPN: EP2AGX65DF29C5G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $360 | $3,600.00 |
| 100 | $320 | $32,000.00 |
| 500 | $285 | $142,500.00 |
| 1,000 | $245 | $245,000.00 |
EP2AGX65DF29C5G Overview
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP/Memory/Transceiver blocks, and I/O cells on a single die. Within the broader taxonomy, an FPGA is a type of programmable logic -> semiconductor -> integrated circuit. The Arria II GX family sits in the mid-density transceiver-equipped tier of Intel (formerly Altera) FPGAs, optimized for cost-effective serial connectivity up to 6.375 Gbps while retaining rich logic and on-chip memory resources.
Key features include 60,214 logic elements, 2,530 LABs, 5,371,904 RAM bits, 364 user I/O pins, integrated transceivers for high-speed serial protocols such as PCIe Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, and dedicated hardware DSP blocks for high-throughput signal processing. The 40 nm process delivers a strong power/performance trade-off, and the 780-FBGA package provides a high-density interconnect ceiling required for 364 I/O and multiple transceiver channels.
The architecture combines a logic fabric built from adaptive logic modules (ALMs) with embedded M9K memory blocks, MLABs, and 18x18 multipliers. Hard PCIe Gen2 IP blocks and 6.375 Gbps transceivers enable immediate deployment of high-speed serial interfaces without consuming fabric for soft SERDES, freeing logic for protocol stacks, packet processing, or DSP pipelines.
Typical applications include 4G/LTE baseband and backhaul cards, Serial RapidIO bridges, HD-SDI broadcast video processing, software-defined radio (SDR) platforms, PCIe Gen2 endpoint/root complex designs, test and measurement instrumentation, and radar/signal-intelligence front ends. The combination of mid-density logic and integrated transceivers is particularly well suited to wireline line cards and wireless base station designs where BOM consolidation and time-to-market are critical.
When designing with this device, allocate pins early to transceiver channels because they are bonded to specific balls in the 780-FBGA package. Use the Quartus II / Quartus Prime design suite, and validate signal-integrity with the IBIS models Intel publishes. The C5 speed grade trades a small amount of Fmax versus faster C6/I6 grades - consider whether a faster speed grade is required for your most demanding timing path.
Drop-in alternatives for EP2AGX65DF29C5G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29C5G (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.
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EP2AGX65DF29C4N
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View Datasheet βEP2AGX65DF29C4G
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View Datasheet βEP2AGX65DF29C3N
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View Datasheet βEP2AGX65DF29I5N
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View Datasheet βEP2AGX65DF29C6G
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View Datasheet βEP2AGX65DF29C5G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Logic Array Blocks (LABs) | 2,530 |
| Total RAM Bits | 5,371,904 |
| User I/O Pins | 364 |
| Package | 780-ball FCBGA (FineLine BGA, 29 mm) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) |
| Speed Grade | C5 |
| Temperature Range (Junction) | 0 Β°C to 85 Β°C (commercial) |
| Maximum Internal Clock Frequency | 500 MHz |
| Transceivers | Up to 12 (data rate up to 6.375 Gbps) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP2AGX65DF29C5G 780-ball fcbga (fineline bga, 29 mm) Pin Configuration Guide
Pin configuration for EP2AGX65DF29C5G (780-ball fcbga (fineline bga, 29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29C5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29C5G is suitable for 6 applications: 4G/LTE Baseband and Backhaul Cards, PCIe Gen2 Endpoint / Root Complex Cards, HD-SDI and 3G-SDI Broadcast Video Processing, Software-Defined Radio (SDR) Platforms, Test and Measurement Instrumentation, Serial RapidIO Bridges and Switches.
4G/LTE Baseband and Backhaul Cards
The EP2AGX65DF29C5G's 60,214 logic elements and up to 12 transceivers at 6.375 Gbps make it well suited for CPRI/OBSAI baseband processing cards, where 60K logic can implement MAC/PHY, scrambling, and front-haul aggregation. The 5,371,904 embedded RAM bits buffer CPRI antenna-carrier data between fronthaul and backhaul. Compared to ASIC plus companion FPGA, a single Arria II GX reduces BOM and enables late protocol changes; trade-off is higher unit cost versus fixed-function ASSP. Use 5 GB/s lanes for CPRI option 3, with the 0.9 V core and Intel PowerPlay early estimator guiding the power-tree design.
Recommended
PCIe Gen2 Endpoint / Root Complex Cards
The EP2AGX65DF29C5G includes hard PCIe Gen2 IP blocks configurable as endpoint or root port, supporting x1/x2/x4 at 5 Gbps without consuming fabric for soft SERDES. With 60K logic elements and 364 I/O, designers can implement the application layer (DMA, interrupt controller, protocol stack) plus glue logic on a single chip. The 780-FBGA DF29 package provides the BGA balls required for the transceiver channels; PCB layout must follow the PCIe CEM or SFF-8639 routing rules. Compared to a discrete PCIe switch plus MCU, this consolidates the design and reduces host-CPU load.
Recommended
HD-SDI and 3G-SDI Broadcast Video Processing
The EP2AGX65DF29C5G supports HD-SDI and 3G-SDI video at 1.485 Gbps and 2.97 Gbps per SMPTE standards, with on-chip transceivers handling the serial bit-clock recovery and the fabric handling de-interleaving, color-space conversion, and overlay composition. The 5,371,904 bits of embedded RAM absorb line buffers and frame stores, while the 364 I/O route parallel video, genlock, and ancillary data. The 0.9 V core and 40 nm process deliver a balance of performance and power for studio equipment; broadcast-grade designs typically pair the FPGA with a frame synchronizer and audio embedder.
Recommended
Software-Defined Radio (SDR) Platforms
The EP2AGX65DF29C5G's 60,214 logic elements, embedded 18x18 multipliers, and 5.4 Mbit RAM can implement digital down/up-conversion, channelization, and real-time DSP for narrowband SDRs. The 12 transceivers up to 6.375 Gbps enable direct ADC/DAC interfacing at JESD204B-class rates or via legacy LVDS, while the fabric handles the MAC/PHY. Compared to a DSP-plus-FPGA partition, a single Arria II GX simplifies board layout and reduces latency. The 0.9 V core and 40 nm process are appropriate for portable SDR form factors where power and weight matter.
Recommended
Test and Measurement Instrumentation
The EP2AGX65DF29C5G suits bench-top and PXI/PXIe instruments where reconfigurable fabric, multi-gigabit serial I/O, and a generous pin count are needed. With 60K logic and 364 I/O, the device can implement protocol-aware triggering, real-time signal processing, and front-panel glue logic, while the 12 transceivers up to 6.375 Gbps handle high-speed serial instrument busses (PXI Express, Serial RapidIO, 10 GigE via soft MAC). The 5,371,904 RAM bits buffer long acquisition captures. Designers should follow the Intel PCB layout guidelines for BGA breakout and the Quartus II / Prime Pin Planner early in the design cycle.
Recommended
Serial RapidIO Bridges and Switches
The EP2AGX65DF29C5G can implement Serial RapidIO Gen2 endpoints and small switches thanks to the 12 transceivers at up to 6.375 Gbps and the embedded M9K memory blocks that buffer SRIO transactions. With 60,214 logic elements, the device can implement the SRIO physical layer plus a small switch fabric or a translation bridge (for example, SRIO to Ethernet, PCIe, or Aurora). The 780-FBGA package supports the high I/O and channel count needed for 4x/8x SRIO link widths. Industrial-grade migration uses the I5N variant in the same DF29 footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29C5G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29C4N | EP2AGX65DF29C4G | EP2AGX65DF29C3N | EP2AGX65DF29I5N | EP2AGX65DF29C6G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (DF29) | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same |
| Logic Elements | 60,214 | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) |
| Speed Grade | C5 | C4 (slower) | C4 (slower) | C3 (slowest) | I5 (industrial, slightly slower) | C6 (faster) |
| Temperature Grade | Commercial (0C to 85C junction) | Commercial | Commercial | Commercial | Industrial (-40C to 100C) | Commercial |
| User I/O Pins | 364 | 364 | 364 | 364 | 364 | 364 |
| Total RAM Bits | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Transceivers (up to 6.375 Gbps) | 12 | 12 | 12 | 12 | 12 | 12 |
Key Differentiators
- Mid-density Arria II GX with 12 transceivers at 6.375 Gbps (vs EP2AGX45DF29C5G)
- Hard PCIe Gen2 IP block integrated (vs EP2A40F1020C7 (Stratix II / Arria earlier family))
- C5 speed grade balance of cost and Fmax (vs EP2AGX65DF29C6G (faster C6))
Design Notes
Estimated: The 780-FBGA DF29 package is a high-density BGA with multiple transceiver channels and a 0.9 V core; at full transceiver utilization (12 lanes at 6.375 Gbps) plus 60K logic at 70% toggle rate, total power can exceed 10 W. The package has a modest exposed-die top heat-spreader attach surface - use a heatsink with thermal interface material, and ensure the PCB has a continuous ground plane under the BGA for thermal spreading. Use the Intel PowerPlay early power estimator to size the thermal solution before PCB commitment.
BGA escape routing for the 780-FBGA DF29 package requires 4-6 layer PCB with fine-line/spacing (typically 4 mil/4 mil or better) and microvia stackups if you target standard FR-4. Use the Intel Arria II GX Pin Connection Guidelines and the Quartus II / Prime Pin Planner to lock the pin-out early; transceiver balls are bonded to specific positions and re-spins are expensive. Decoupling: place bulk ceramics within 100 mils of each power pin and use a power-plane stackup for the 0.9 V core, with separate analog supplies for the transceiver PLLs.
Do not mix I/O standards across banks without verifying the VCCIO levels - the EP2AGX65DF29C5G supports multiple I/O voltages (typically 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and groups pins into banks that must share a common VCCIO. For configuration, follow the recommended sequence in the Arria II GX Configuration Handbook; missing the early POR sequence or the proper MSEL[3:0] setting causes configuration failures that look like a bad part. Finally, verify last-time-buy status with Intel because Arria II GX is a mature family.
Compliance Information
RoHS and lead-free confirmed by the 'G' suffix in the ordering code (lead-free, Pb-free). Reach and conflict-minerals compliance per Intel program documentation. AEC-Q100 not applicable for a non-automotive FPGA; automotive-grade would be an Arria II GX-A variant if offered in the same family.
