EP2AGX65DF29I3N - Arria II GX FPGA 60K LE | Intel | 780-FBGA
MPN: EP2AGX65DF29I3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $235 | $23,500.00 |
| 500 | $198 | $99,000.00 |
| 1,000 | $175 | $175,000.00 |
EP2AGX65DF29I3N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, and I/O cells, all of which can be reconfigured by the end user after manufacture. FPGAs sit in the broader taxonomy of programmable logic devices -> semiconductors -> integrated circuits, and are widely used as hardware accelerators, glue logic, and prototyping platforms for ASIC designs. Compared to ASICs, FPGAs offer fast time-to-market and in-field reconfigurability at the cost of higher per-unit power and lower raw performance. The Arria II GX family occupies the mid-range position in Intel's portfolio, between the low-power Cyclone series and the high-performance Stratix series, and was specifically engineered for cost-sensitive applications requiring transceivers and moderate logic density.
The 780-FBGA package supports the full industrial temperature range (-40 C to +100 C), indicated by the 'I' in the MPN. The '3' speed grade places the device in the slow-but-low-power tier (versus -4/-5/-6), making EP2AGX65DF29I3N ideal for thermally constrained designs that still require transceiver capability. The 'N' suffix denotes lead-free / RoHS-compliant terminations.
Typical applications include PCI Express Gen2 endpoint and root-complex designs, wireless baseband DSP, digital video broadcast equipment, industrial serial-backplane aggregation, and military/aerospace image processing. The combination of mid-range logic density and integrated transceivers makes it a strong fit for bridging FPGAs to ASSPs in heterogeneous system designs.
When designing with EP2AGX65DF29I3N, ensure that the PCB accommodates the 1.0 mm pitch BGA, that the transceiver reference clocks are jitter-clean, and that the JTAG chain is correctly buffered for multi-device configuration. Quartus II software (legacy, replaced by Intel Quartus Prime with Arria II device support) is required for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, Intel/Altera Arria II GX same-package variants, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX65DF29I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29I3N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX65DF29C6N
β Drop-Inβ In Stock
$218.75 / Unit
View Datasheet βEP2AGX65DF29C5N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2AGX65DF29C4N
β Drop-Inβ In Stock
$605 / Unit
View Datasheet βEP2AGX65DF29I3G
β Drop-Inβ In Stock
$895 / Unit
View Datasheet βEP2AGX65DF29C6G
β Drop-Inβ In Stock
$245.3 / Unit
View Datasheet βEP2AGX65DF29C5G
β Drop-Inβ In Stock
$245 / Unit
View Datasheet βEP2AGX65DF29I3N Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Intel FPGA (formerly Altera Arria II GX) |
| Process Node | 40 nm TSMC low-power |
| Logic Elements (LE) | 60214 |
| Number of LABs/CLBs | 2530 |
| Embedded Memory (bits) | 5371904 |
| Total RAM Bits | 5,371,904 |
| User I/O Count | 364 |
| Operating Frequency (max) | 500 MHz |
| Core Voltage | 0.9 V |
| Package | 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 C to +100 C (Industrial) |
| Speed Grade | -3 |
| Transceivers | Up to 8 multi-gigabit transceivers, up to 3.75 Gbps |
| RoHS Status | Compliant (Pb-free N suffix) |
| Configuration Method | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |
EP2AGX65DF29I3N 780-bbga, fcbga (fbga-780, 29 x 29 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2AGX65DF29I3N (780-bbga, fcbga (fbga-780, 29 x 29 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29I3N is suitable for 6 applications: PCI Express Gen1 Endpoint / Root Complex, Wireless Baseband DSP Acceleration, Digital Video Broadcast Aggregation, Industrial Serial Backplane Aggregation, Military / Aerospace Image Processing, ASIC Prototyping and Emulation.
PCI Express Gen1 Endpoint / Root Complex
The EP2AGX65DF29I3N is a strong fit for PCI Express Gen1 endpoints and root-complex designs. Its eight multi-gigabit transceivers support up to 3.75 Gbps, which is sufficient for Gen1 line rate at 2.5 Gbps. The hard IP for PCIe embedded in the transceiver PCS eliminates the need for an external PHY, reducing BOM cost. Combined with the 60K logic elements and 5.37 Mbits of block RAM, the device can implement endpoint controller logic, application payload, and DMA engines on a single die. The -3 speed grade is appropriate for Gen1 applications where maximum Fmax is not the priority. A typical reference design uses one x1 or x4 lane plus root-complex enumeration logic in Quartus II with the IP Compiler for PCI Express. Engineers should verify their link partner supports Gen1 only or, if Gen2 is required, consider the Arria II GX Gen2-capable transceivers or migrate to Cyclone 10 GX.
Recommended
Wireless Baseband DSP Acceleration
The EP2AGX65DF29I3N is well suited to wireless baseband DSP acceleration in 3G/4G picocell and femtocell applications. The 60K logic elements, combined with the dedicated 18 x 18 multiplier blocks (typical Arria II GX DSP density ~312 18x18 multipliers), enable efficient implementation of crest-factor-reduction, digital pre-distortion, and channelization filters. The integrated transceivers support CPRI at 1.2288 Gbps, 2.4576 Gbps, and 3.072 Gbps, allowing direct connection to a radio unit over a CPRI link without an external SERDES. The 0.9 V core and -3 speed grade balance power dissipation against throughput, important for fan-less outdoor picocell enclosures. Reference designs from Intel/Altera provide CPRI PHY and TD-SCDMA/LTE baseband IP cores that map directly to this device. Industrial -40 C to +100 C temperature range supports outdoor and indoor picocell deployments.
Recommended
Digital Video Broadcast Aggregation
The EP2AGX65DF29I3N is widely deployed in digital video broadcast head-end equipment, where it performs MPEG-2/H.264 transport stream aggregation, de-encapsulation, and re-multiplexing. The 5.37 Mbits of embedded memory accommodates transport-stream buffering for hundreds of SD or HD streams, while the 60K logic elements implement PID filtering, PSI/SI table parsing, and conditional-access logic. The transceivers support DVB-ASI at 270 Mbps and SMPTE 259M/292M serial video at up to 3 Gbps, allowing direct connection to professional SDI equipment without external serializers. The industrial temperature range supports 24/7 broadcast rack environments with elevated intake temperatures. The FBGA-780 package and Quartus II flow enable straightforward migration between Arria II GX logic densities within the same PCB footprint family.
Recommended
Industrial Serial Backplane Aggregation
The EP2AGX65DF29I3N serves as a backplane aggregator in industrial chassis where multiple serial links must be bridged. Its eight transceivers at 3.75 Gbps enable protocols such as Serial RapidIO, Gigabit Ethernet, Aurora, and proprietary SERDES links commonly used in radar, sonar, and test-instrumentation backplanes. The 60K logic elements implement packet classification, switching, and store-and-forward buffering, while the 5.37 Mbits of block RAM provides sufficient queue depth for line-rate aggregation. The industrial temperature range supports factory-floor and outdoor cabinet deployments, while the FBGA-780 footprint and 0.9 V core simplify PCB design with standard 4-layer stack-ups. Intel's Reference Design for RapidIO provides a complete PHY+transport layer implementation that drops directly into the transceiver block.
Recommended
Military / Aerospace Image Processing
The EP2AGX65DF29I3N is used in military and aerospace electro-optical platforms where compact size, weight, and power (SWaP) are critical. The integrated transceivers allow direct connection to Camera Link, CoaXPress, or proprietary sensor links, while the 60K logic elements perform real-time pixel correction, geometric rectification, and target tracking. The 5.37 Mbits of embedded memory support line-buffer and frame-buffer storage in SDR/drone-class platforms, and the 0.9 V core minimizes power draw on battery-operated UAV platforms. The industrial -40 C to +100 C temperature range covers most tactical-grade environments; for true -55 C operation, designers must select a specific MIL-spec screened variant. The FBGA-780 package is compatible with IPC-7351 land patterns and standard lead-free assembly processes used by defense primes.
Recommended
ASIC Prototyping and Emulation
The EP2AGX65DF29I3N is a popular ASIC prototyping vehicle because of its mid-range logic density, abundant block RAM, and integrated transceivers. Designers map their ASIC RTL into multiple Arria II GX FPGAs using Time-Borrowing Multi-FPGA Partitioning tools in Quartus II, and the -3 speed grade reduces dynamic power during long emulation runs. The industrial temperature range allows prototypes to be operated in thermally realistic environments before tape-out. The transceivers enable high-speed ASIC-to-FPGA and FPGA-to-FPGA side-channel links critical for ASIC clocking and validation. The 60K logic elements support moderate-complexity ASIC designs (e.g., controller ICs, mid-range SoC sub-blocks) and the FBGA-780 footprint enables affordable off-the-shelf prototyping boards from vendors such as DINI Group, Pro Design, and S2C.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29C6N | EP2AGX65DF29C5N | EP2AGX65DF29C4N | EP2AGX65DF29I3G | EP2AGX65DF29C6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (29 x 29 mm, 1.0 mm pitch) | 780-BBGA, FCBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-BBGA, FCBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-BBGA, FCBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-BBGA, FCBGA (29 x 29 mm, 1.0 mm pitch) - same | 780-BBGA, FCBGA (29 x 29 mm, 1.0 mm pitch) - same |
| Speed Grade | -3 (slowest, lowest power) | -6 (fastest) | -5 | -4 | -3 (same) | -6 |
| Operating Temperature | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) - same | 0 C to +85 C (Commercial) |
| Logic Elements | 60214 | 60214 (same) | 60214 (same) | 60214 (same) | 60214 (same) | 60214 (same) |
| Embedded Memory (bits) | 5371904 | 5371904 (same) | 5371904 (same) | 5371904 (same) | 5371904 (same) | 5371904 (same) |
| User I/O | 364 | 364 (same) | 364 (same) | 364 (same) | 364 (same) | 364 (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| RoHS Compliant | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Key Differentiators
- Same-package multi-speed-grade family (vs EP2AGX65DF29C6N)
- Industrial temperature coverage in lowest-power speed grade (vs EP2AGX65DF29I5N)
- Mid-density logic with integrated 3.75 Gbps transceivers (vs EP2AGX45DF29I3N)
Design Notes
The EP2AGX65DF29I3N uses a 780-ball fine-line BGA at 1.0 mm pitch. PCB design must use laser-drilled micro-vias (typically 0.1 mm) with stacked-via construction to escape the inner balls, and the inner BGA rows require via-in-pad or micro-via stagger per IPC-7351 BGA guidelines. Provide at least 4 PCB layers (signal/ground/power/signal) with a continuous ground plane directly beneath the device to minimize impedance discontinuities on the transceiver channels. Maintain 50 ohm single-ended impedance on all top-layer transceiver traces and 100 ohm differential for the SERDES lanes.
Estimated: at 500 MHz core frequency and 364 I/O switching at 50 MHz with 10 pF load, the EP2AGX65DF29I3N dissipates approximately 6-8 W under typical utilization. The FBGA-780 package has a junction-to-ambient thermal resistance of approximately 11 C/W with a 1 sq-in copper spreader and 100 LFM airflow, yielding a junction-temperature rise of 66-88 C above ambient. For -40 C to +100 C industrial operation, designers should provide a minimum 4-layer PCB with continuous GND plane and 100 LFM airflow, or attach a heatsink via thermal interface material. Do not rely on the FBGA package alone for convection cooling above 5 W dissipation.
The eight multi-gigabit transceivers in the EP2AGX65DF29I3N require a jitter-clean reference clock, typically a 100 MHz or 156.25 MHz LVDS oscillator with phase noise below -130 dBc/Hz at 100 kHz offset. Per the Arria II GX handbook, the transceiver analog supply (VCCH, VCCA, VCCP) must be filtered separately from the core 0.9 V supply with ferrite beads and decoupling capacitors to isolate switching noise. Length-match all SERDES differential pairs to within 0.127 mm (5 mils) on the PCB and avoid splitting reference planes under the transceiver ball array.
Do not exceed the Arria II GX absolute maximum junction temperature of 125 C. Engineers commonly mistake the 'C' temperature suffix in EP2AGX65DF29C6N for a temperature code rather than a commercial-grade designation; the 'I' suffix denotes industrial grade and 'C' denotes commercial. When designing JTAG chains for multi-FPGA boards, ensure each EP2AGX65DF29I3N has its own TMS/TCK buffering to avoid signal-integrity issues at the 10 MHz JTAG clock.
Compliance Information
RoHS-compliant per the 'N' suffix in the MPN. Lead-free FBGA-780 terminations. Not AEC-Q100 qualified - FPGAs are not automotive-grade qualified by default. Halogen-free status not explicitly documented in the verified data; flag as 'unknown' rather than guess.
