EP2AGX65DF29I5G - Arria II GX FPGA 60K LE, 780-FCBGA | Intel
MPN: EP2AGX65DF29I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $840.84 | $840.84 |
| 10 | $798.8 | $7,988.00 |
| 100 | $756.76 | $75,676.00 |
| 500 | $722.32 | $361,160.00 |
| 1,000 | $689.49 | $689,490.00 |
EP2AGX65DF29I5G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing fabric that the user defines after manufacture via a hardware description language (HDL). FPGAs sit in the broader hierarchy of programmable logic -> semiconductor IC -> integrated circuit, and are typically chosen over ASSPs when time-to-market, parallel processing, or interface customization are paramount. The Arria II GX family targets the mid-range "sweet spot" between Cyclone (cost-optimized) and Stratix (high-performance) families, balancing transceiver speed with low static power.
Key features of the EP2AGX65DF29I5G include eight 6.3125 Gbps multi-gigabit transceivers, two hard PCIe Gen2 controllers with x1/x2/x4 endpoint and root-port support, 17 DSP blocks, 2530 LABs (Logic Array Blocks), and on-chip termination (OCT) calibration. The device also offers configuration via fast passive parallel (FPP), active serial (AS), and JTAG modes, plus dedicated security features (AES-256 bitstream encryption) for IP protection. Operating from a 0.9 V core and 1.5 V/2.5 V/3.3 V I/O banks, the EP2AGX65DF29I5G consumes substantially less power than its Stratix IV predecessor while delivering comparable logic and transceiver performance.
Architecturally, the device employs an adaptive logic module (ALM) - an 8-input fracturable LUT - which can be split into two independent 4-input LUTs for higher effective utilization in mixed arithmetic/control designs. The transceiver PMA layer supports multiple protocols including PCIe Gen1/2, XAUI, GbE, SATA, CPRI, and Serial RapidIO through PCS hardening, while the hard PCIe block offloads transaction layer complexity from soft logic. The 780-FCBGA package integrates the flip-chip die on an organic substrate with an integrated heat spreader, enabling 17 mm x 17 mm board-level designs.
Typical applications include wireless basestation fronthaul CPRI links, broadcast video processing and bridging, high-speed serial protocol bridging (PCIe-to-GbE, XAUI repeaters), industrial imaging and machine vision, and military/aerospace signal processing. The combination of transceivers, PCIe hard IP, and mid-density logic makes it especially suited for designs migrating from ASIC to FPGA or upgrading from Cyclone IV.
When designing with this device, pay close attention to transceiver reference clock routing, PCB-controlled impedance for 100-ohm differential pairs, and proper decoupling on the 0.9 V core rail. Quartus II Prime software (or the newer Quartus Prime Lite) is required for place-and-route and timing closure, with the device supported in Quartus versions 13.0 and later.
This page synthesizes distributor pricing as of 2026-09-08, drop-in alternative MPNs from the Site MPN list, and practical PCB design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX65DF29I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29I5G (same form factor and footprint) — differing in Package, Speed Grade, Mounting Type, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF29I5
✅ Drop-In✓ In Stock
$1980 / Unit
View Datasheet →EP2AGX65DF29I3G
✅ Drop-In✓ In Stock
$895 / Unit
View Datasheet →EP2AGX65DF29I3N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2AGX65DF29C6G
✅ Drop-In✓ In Stock
$245.3 / Unit
View Datasheet →EP2AGX65DF29C5G
✅ Drop-In✓ In Stock
$245 / Unit
View Datasheet →EP2AGX65DF29C6N
✅ Drop-In✓ In Stock
$218.75 / Unit
View Datasheet →EP2AGX65DF29I5G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Arria II |
| Logic Elements (LE) | 60,214 |
| Embedded Memory | 5,371,904 bits |
| Logic Array Blocks (LABs) | 2,530 |
| User I/O Count | 364 |
| DSP Blocks | 17 (18x18 multipliers) |
| Multi-Gigabit Transceivers | 8 channels up to 6.3125 Gbps |
| Hard PCIe Controllers | 2 (Gen1/Gen2, endpoint + root port) |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVDS, LVTTL, LVCMOS) |
| Package | 780-ball FCBGA (Flip-Chip BGA), 29 mm x 29 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Modes | FPP, AS, JTAG, PS |
| Security | AES-256 bitstream encryption |
| RoHS Status | Compliant |
EP2AGX65DF29I5G 780-ball fcbga (flip-chip bga), 29 mm x 29 mm Pin Configuration Guide
Pin configuration for EP2AGX65DF29I5G (780-ball fcbga (flip-chip bga), 29 mm x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29I5G is suitable for 7 applications: Wireless Basestation CPRI Fronthaul, Broadcast Video Processing and Bridging, Industrial Imaging and Machine Vision, High-Speed Serial Protocol Bridging, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Medical Imaging and Diagnostic Equipment.
Wireless Basestation CPRI Fronthaul
The EP2AGX65DF29I5G is well-suited to wireless basestation CPRI (Common Public Radio Interface) fronthaul links in LTE/5G NR small-cell and macro-cell base stations. Its 8 multi-gigabit transceivers running up to 6.3125 Gbps natively support CPRI line bit rates from 1.228 Gbps (option 1) through 6.144 Gbps (option 7) and 9.830 Gbps (option 8 with oversampling). The 60K logic elements provide ample capacity for IQ data compression, Ethernet packetization, and physical-layer framer state machines without taxing the FPGA fabric. Two hard PCIe Gen2 controllers enable direct connection to a baseband SoC over PCIe x2 or x4 lanes. Compared to a discrete SERDES approach, the integrated PMA layer saves ~30% PCB area and reduces BOM cost by $15-25 per board. Engineers should note that CPRI jitter compliance requires careful reference-clock routing (differential 100 ohm, <0.3 ps RMS jitter).
Recommended
Broadcast Video Processing and Bridging
The EP2AGX65DF29I5G is ideal for broadcast video processing, format conversion, and SDI-to-IP bridging in professional video equipment. Its 8 transceivers support 3G-SDI (SMPTE 424M, 2.97 Gbps) and dual-link 6G-SDI as well as HDMI 1.4 over multiple TMDS lanes through soft PCS. The 5,371,904 bits of embedded memory serve as line/frame buffers for video scaling, de-interlacing, and color-space conversion, eliminating the need for external DDR2 in many single-channel designs. Hard PCIe Gen2 enables direct connection to a host CPU or GPU for live-edit workflows. Compared to ASIC-based broadcast platforms, the FPGA approach lets broadcast OEMs support evolving standards like SMPTE ST 2110 (IP-based video) via firmware updates rather than silicon respins. Power dissipation at full 3G-SDI processing is typically 4-5 W, manageable with the FCBGA's integrated heat spreader.
Recommended
Industrial Imaging and Machine Vision
The EP2AGX65DF29I5G fits high-speed industrial camera and machine vision systems that aggregate multiple CoaXPress, Camera Link, or GigE Vision channels. Its 8 transceivers support CoaXPress (up to 6.25 Gbps per lane) for up to 4 simultaneous camera inputs, or 8 channels of GigE Vision via tri-speed MAC soft cores. The 17 DSP blocks provide real-time image preprocessing - convolution, thresholding, and Bayer demosaicing - at line rates above 100 MHz. Industrial-grade temperature rating (-40C to +100C) enables deployment in unconditioned factory environments. Compared to a discrete DSP + PHY approach, the FPGA reduces BOM cost by ~$40 per camera and simplifies PCB layout. Industrial designers should specify an extended-temperature (-40C to +100C) variant and use conformal coating given the industrial environment exposure.
Recommended
High-Speed Serial Protocol Bridging
The EP2AGX65DF29I5G excels at protocol bridge applications that convert between PCIe, Gigabit Ethernet, SATA, XAUI, and Serial RapidIO in storage and telecom equipment. Its 2 hard PCIe Gen2 endpoints and root ports enable direct PCIe-to-Ethernet bridges for network-attached storage (NAS) and software-defined networking (SDN) appliances. The 8 transceivers support 4 lanes of PCIe x2 plus 4 GbE, or 2 SATA ports plus 2 PCIe x2, with remaining channels available for management Ethernet. The 5.3 Mbit embedded memory handles packet buffering for cut-through switching, and the AES-256 bitstream encryption protects OEM firmware IP. Compared to ASSP bridge chips (e.g., PEX chips), the FPGA approach supports evolving protocols and custom headers without a respin. Power consumption of 4-6 W requires moderate PCB thermal management.
Recommended
Military and Aerospace Signal Processing
The EP2AGX65DF29I5G (industrial grade) and its cousins support defense electronics applications including radar signal preprocessing, electronic warfare (EW) subsystems, and secure communications. The 60K logic elements and 17 DSP blocks handle basic digital down-conversion (DDC), pulse compression, and adaptive beamforming at IF sample rates up to 200 MHz. 8 transceivers support digital IF links to RF front-ends, while hard PCIe interfaces connect to GPGPU co-processors for AI/ML-based signal classification. The AES-256 bitstream encryption meets ITAR/EAR requirements for controlled cryptographic equipment. The industrial temperature grade (-40C to +100C) handles most MIL-STD-810 environments. For MIL-PRF-38535 Class B qualified parts, Intel offers MIL-STD-883 screened variants through authorized defense distributors. Designers should plan for extended screening and derating per MIL-HDBK-454.
Recommended
Test and Measurement Instrumentation
The EP2AGX65DF29I5G enables high-performance test and measurement instruments - protocol analyzers, BERT (bit error rate testers), and compliance test fixtures - that require flexible multi-standard serial connectivity. Its 8 transceivers simultaneously monitor 8 lanes of PCIe, USB 3.0, SATA, or XAUI for protocol analysis at line rate, with the 5.3 Mbit embedded memory buffering captured frames for host-side decoding. The 364 user I/Os interface to high-speed ADCs and DACs for stimulus/response generation in mixed-signal test. Compared to fixed-protocol ASICS, the FPGA approach lets T&M OEMs support new standards (e.g., USB4, PCIe Gen4 via soft PCS) via firmware updates. Industrial temperature rating is suitable for lab environments and field test gear. Designers should budget 2-3 W for the FPGA core plus 1-2 W for transceiver channels during continuous BERT operation.
Recommended
Medical Imaging and Diagnostic Equipment
The EP2AGX65DF29I5G supports medical imaging modalities including ultrasound beamforming, endoscopy image processing, and MRI gradient control. Its 17 DSP blocks enable real-time delay-and-sum beamforming across 32-64 channels at ultrasound sample rates up to 40 MHz. The 8 transceivers support high-speed digitizer interfaces to ADCs (e.g., 12-bit/250 MSPS) over JESD204B subclass 1 (via soft PCS), eliminating the need for external clock chips. Industrial temperature rating supports clinical environments. The FPGA's deterministic latency (no OS jitter) is critical for ultrasound time-of-flight accuracy. Compared to DSP + MCU architectures, the FPGA approach enables 4-8x channel count at similar cost. Compliance considerations: IEC 60601-1 isolation and IEC 62304 software lifecycle require additional PCB isolation barriers beyond the FPGA itself.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29I5 | EP2AGX65DF29I3G | EP2AGX65DF29I3N | EP2AGX65DF29C6G | EP2AGX65DF29C5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA (29x29 mm) | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Speed Grade | -5 | -5 | -3 | -3 | -6 | -5 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Ball Metallurgy | Lead-free (G) | Tin-lead (no G) | Lead-free (G) | Tin-lead (no G) | Lead-free (G) | Lead-free (G) |
| Transceivers | 8 @ 6.3125 Gbps | 8 @ 6.3125 Gbps | 8 @ 6.3125 Gbps | 8 @ 6.3125 Gbps | 8 @ 6.3125 Gbps | 8 @ 6.3125 Gbps |
| Hard PCIe Gen2 Blocks | 2 | 2 | 2 | 2 | 2 | 2 |
| Embedded Memory | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits | 5,371,904 bits |
Key Differentiators
- Higher Fmax in same package and die (vs EP2AGX65DF29I3G)
- Industrial temperature for harsh environments (vs EP2AGX65DF29C5G)
- Lead-free RoHS compliance (vs EP2AGX65DF29I5)
- Best transceiver-per-dollar in mid-density Arria II (vs EP2AGX260EF29I5G)
Design Notes
Estimated: The EP2AGX65DF29I5G requires 4 separate power rails - 0.9 V VCC (core), 1.5 V/1.8 V/2.5 V/3.3 V VCCIO (I/O banks), 2.5 V VCCAUX (PLL/JTAG), and 1.0 V VCCPD (power-on discharge). The 0.9 V core rail can draw up to 4-6 A under full utilization (60K LE + 8 transceivers active). Use a 4-layer PCB and place low-ESR ceramic decoupling (10 x 22 uF + 20 x 100 nF) within 5 mm of the package. Reference the Arria II GX PowerPlay Early Power Estimator (EPE) spreadsheet for board-level budgeting.
Estimated: Transceiver channels require 100-ohm differential microstrip or stripline routing on the top layer over a continuous ground plane. Maintain length matching within 0.127 mm (5 mil) within each transceiver pair and within 6.4 mm (250 mil) across pairs of the same channel. The reference clock input must be AC-coupled and routed with 50-ohm controlled impedance. Crossover vias should be minimized on high-speed paths; use a stitched ground via fence every 2 mm along the differential pair to suppress common-mode radiation.
Estimated: At full transceiver and 80% logic utilization, the EP2AGX65DF29I5G dissipates 4-6 W. The FCBGA package's integrated heat spreader provides a junction-to-ambient thermal resistance of approximately 12-15 C/W with 200 LFM airflow. For fanless designs, route thermal vias (0.3 mm pitch) directly under the heat spreader to a large copper plane on the bottom layer. Monitor the on-die temperature diode via the internal TSE block (TDI/TDO pins) for production thermal validation.
Estimated: Arria II GX transceivers achieve 6.3125 Gbps compliance only when the reference clock jitter is below 0.3 ps RMS (12 kHz-20 MHz). Use a dedicated low-jitter oscillator such as the Silicon Labs Si5351A or Skyworks SKY72310 driving the REFCLK differential pair. Place 0.1 uF AC-coupling capacitors within 5 mm of the REFCLK pins. For multi-board systems, consider TX/RX pre-emphasis and de-emphasis settings per the Arria II GX Transceiver User Guide to compensate for FR-4 channel loss at 6+ Gbps.
Common mistakes to avoid: (1) configuring MSEL pins incorrectly for the chosen configuration mode (AS vs FPP), causing the device to fail to configure; (2) leaving JTAG TCK floating (must be pulled high or low with 1-10 kohm); (3) failing to assert nCONFIG and nSTATUS via 10 kohm pull-ups to VCCPD before power-up, causing power-on-reset failures; (4) not running the Quartus II SignalTap II logic analyzer with the correct .sof/.stp pair, which generates misleading timing; (5) selecting -3 or -6 speed grade when the design has critical paths failing at -5 - upgrading is cheaper than redesign.
Compliance Information
RoHS compliant per 'G' suffix (lead-free BGA). Halogen-free per JEDEC JS709. Not AEC-Q100 qualified - FPGAs are typically not in AEC-Q100 scope. For defense/aerospace SnPb variants, see EP2AGX65DF29I5.
