EP2AGX65DF29I5 - Arria II GX 65K LE FPGA, 364 I/O | Intel
MPN: EP2AGX65DF29I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2640 | $26,400.00 |
| 100 | $2395 | $239,500.00 |
| 500 | $2185 | $1,092,500.00 |
| 1,000 | $1980 | $1,980,000.00 |
EP2AGX65DF29I5 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnects, and embedded memory and DSP resources on a single semiconductor die. FPGAs occupy the top of the programmable-logic hierarchy, above CPLDs and below ASICs, and are used to implement custom digital signal processing, high-speed serial interfaces, and glue logic without the NRE cost of an ASIC. The Arria II GX family specifically targets mid-range transceiver-based applications, bridging between Cyclone (low-cost) and Stratix (high-performance) families.
Key features of the EP2AGX65DF29I5 include up to 8 high-speed transceivers supporting data rates up to 3.75 Gbps (PCIe Gen1/Gen2 capable), dedicated DSP blocks for high-throughput signal processing, embedded memory up to 4.5 Mbits of M9K blocks, and hardened PCIe and memory controllers. The 0.9 V core voltage combined with 1.2 V/1.5 V/2.5 V/3.3 V I/O standards minimizes power while maintaining 780-ball BGA compatibility with Altera's 40nm Arria II toolchain.
The 40nm process delivers an optimal balance of performance and static power versus earlier 65nm/90nm nodes, and the Arria II GX architecture includes partial reconfiguration support for runtime logic swapping. The transceiver PHY supports multiple protocols including CPRI, OBSAI, SATA, and XAUI, making the family suitable for wireless backhaul and storage.
Typical applications include wireless baseband and backhaul (LTE, WiMAX, CPRI), broadcast video processing, high-speed serial protocol bridging, PCIe Gen1/Gen2 endpoint or root complex designs, and military/aerospace signal processing. Industrial temperature grade (-40C to +100C ambient) is supported per the I5 speed grade suffix.
When designing with the EP2AGX65DF29I5, ensure the PCB uses a minimum 1 mm pitch BGA land pattern with proper microvia stack-up and matched-length transceiver traces for 3.75 Gbps operation. Reference Altera AN 558 and AN 593 transceiver layout guidelines for the 780-BGA footprint. JTAG and active serial configuration should use the dedicated MSEL[3..0] pins; verify mode selection in Quartus II pin-planner before layout.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical layout guidance not found on any single distributor page.
Drop-in alternatives for EP2AGX65DF29I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF29I5 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Family, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX65DF29I5N
✅ Drop-In✓ In Stock
$1015 / Unit
View Datasheet →EP2AGX65DF29C6N
✅ Drop-In✓ In Stock
$218.75 / Unit
View Datasheet →EP2AGX65DF29C5N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2AGX65DF29I3N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2AGX45DF29I5
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP2AGX65DF29I5 Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| Family | Arria II GX |
| Logic Elements (LE) | 60,214 |
| Logic Array Blocks (LABs) | 2,530 |
| Embedded Memory (bits) | 5,371,904 |
| User I/Os | 364 |
| Package | 780-BBGA, FCBGA (29 x 29 mm) |
| Package Code | DF29 |
| Supply Voltage - Core | 0.9 V |
| Supply Voltage - I/O | 1.2 V / 1.5 V / 2.5 V / 3.3 V |
| Process Technology | 40 nm |
| Maximum Operating Frequency | 500 MHz |
| High-Speed Transceivers | Up to 8 channels, 3.75 Gbps |
| Speed Grade | I5 (Industrial) |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2AGX65DF29I5 df29 Pin Configuration Guide
Pin configuration for EP2AGX65DF29I5 (df29 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF29I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF29I5 is suitable for 6 applications: Wireless Baseband & Backhaul, Broadcast Video Processing, PCIe Gen1/Gen2 Endpoint Designs, High-Speed Protocol Bridging, Industrial Automation Controllers, Aerospace & Defense Signal Processing.
Wireless Baseband & Backhaul
The EP2AGX65DF29I5 fits wireless baseband and backhaul designs because its 8 high-speed transceivers deliver up to 3.75 Gbps per lane with hardened CPRI/OBSAI support, while its 60,214 logic elements and dedicated DSP blocks provide the processing headroom for LTE/WiMAX PHY-layer algorithms. Placed between the radio front-end and baseband processor, the FPGA performs digital up/down-conversion, channelization, and crest-factor reduction. Compared with an ASIC, the Arria II GX offers the flexibility to support evolving 3G/4G standards without respin. The I5 industrial temperature grade covers outdoor cell-tower deployment. Trade-off: at full transceiver utilization, power dissipation can reach 8-10 W, requiring thermal via arrays under the 780-BGA.
Recommended
Broadcast Video Processing
The EP2AGX65DF29I5 fits broadcast video applications because its 5,371,904 bits of embedded memory and high logic density enable multi-stream SD/HD-SDI processing, color-space conversion, and frame-rate conversion in a single device. The 3.75 Gbps transceivers handle 3G-SDI and emerging UHD-SDI links, while the DSP blocks accelerate deinterlacing and scaling. Placed on a video processing card, it replaces multiple DSP chips in a single FPGA. Unlike a CPU/GPU, the FPGA delivers deterministic latency critical for live broadcast. The I5 industrial temperature grade supports outdoor studio and head-end environments. Trade-off: when transcoding 4K streams, ensure the 780-BGA has adequate PCB thermal vias to handle sustained throughput.
Recommended
PCIe Gen1/Gen2 Endpoint Designs
The EP2AGX65DF29I5 fits PCIe Gen1/Gen2 endpoint designs because it integrates hardened PCIe IP blocks (x1/x4 Gen1 and Gen2) directly in silicon, freeing logic resources for application-layer functions. Its 60,214 LEs support DMA engines, custom protocol stacks, and FPGA co-processing fabrics, while the 3.75 Gbps transceivers connect to the PCIe lanes without external PHY. Placed on a host bus adapter or accelerator card, it appears as a standard PCIe device. The I5 industrial temperature grade enables deployment in factory-floor and outdoor systems. Trade-off: for Gen3 designs, a newer Arria 10 or Stratix 10 family member is required.
Recommended
High-Speed Protocol Bridging
The EP2AGX65DF29I5 fits high-speed serial protocol bridging because its 8 transceivers (3.75 Gbps each) and 60,214 LEs can implement CPRI, OBSAI, SATA, XAUI, Serial RapidIO, and custom serial protocols in a single device. The transceiver PHY supports multiple data rates and reference clocks, enabling flexible bridging between backhaul, storage, and telecom interfaces. Placed between a baseband ASIC and a framer chip, the FPGA handles rate-matching and protocol adaptation. The I5 industrial temperature grade covers outdoor telecom cabinets. Trade-off: bridging multiple full-rate protocols simultaneously may require the EP2AGX125 for additional transceiver and logic headroom.
Recommended
Industrial Automation Controllers
The EP2AGX65DF29I5 fits industrial automation controllers because its I5 industrial temperature grade (-40C to +100C) handles factory-floor thermal swings, and its 60,214 LEs provide the deterministic real-time response needed for servo control, EtherCAT, PROFINET, and machine-vision preprocessing. The 364 user I/Os interface to encoders, sensors, and motor drivers directly. Placed on a machine-controller mainboard, it executes motion profiles, safety logic, and high-speed I/O in parallel. Unlike a microcontroller, the FPGA delivers deterministic multi-axis synchronization. Trade-off: industrial environments may require conformal coating; the 780-BGA package complicates conformal-coat inspection and rework.
Recommended
Aerospace & Defense Signal Processing
The EP2AGX65DF29I5 fits aerospace and defense signal processing because its industrial temperature grade, 60,214 LEs, and 3.75 Gbps transceivers support radar front-end processing, electronic-warfare digital receivers, and secure-communication modems in a single device. The 780-BGA DF29 package is drop-in compatible with EP2AGX65 speed-grade variants, simplifying BOM across multiple defense SKUs. Placed between an antenna down-converter and a signal processor, the FPGA performs channelization, beamforming, and demodulation. The I5 grade supports avionics-bay and ground-mobile environments. Trade-off: defense/aerospace programs must source from AS9100-certified brokers; verify up-screen lot traceability before deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF29I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF29I5N | EP2AGX65DF29C6N | EP2AGX65DF29C5N | EP2AGX65DF29I3N | EP2AGX45DF29I5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BGA (DF29) | 780-BGA (DF29) - same | 780-BGA (DF29) - same | 780-BGA (DF29) - same | 780-BGA (DF29) - same | 780-BGA (DF29) - same |
| Logic Elements | 60,214 | 60,214 (same) | 60,214 (same) | 60,214 (same) | 60,214 (same) | 41,950 (-30%) |
| LABs | 2,530 | 2,530 (same) | 2,530 (same) | 2,530 (same) | 2,530 (same) | 1,755 (-31%) |
| User I/Os | 364 | 364 (same) | 364 (same) | 364 (same) | 364 (same) | 364 (same) |
| Speed Grade | I5 (Industrial) | I5 (Industrial) | C6 (Commercial) | C5 (Commercial) | I3 (Industrial) | I5 (Industrial) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V (same) | 40 nm / 0.9 V (same) | 40 nm / 0.9 V (same) | 40 nm / 0.9 V (same) | 40 nm / 0.9 V (same) |
| Transceivers / Max Rate | 8 ch / 3.75 Gbps | 8 ch / 3.75 Gbps (same) | 8 ch / 3.75 Gbps (same) | 8 ch / 3.75 Gbps (same) | 8 ch / 3.75 Gbps (same) | 8 ch / 3.75 Gbps (same) |
| Unit Price (qty-1, USD) | ~$2,850 | ~$2,850 (same) | ~$2,400 | ~$2,200 | ~$2,800 | ~$2,300 |
Key Differentiators
- Industrial temperature grade at the I5 speed grade (vs EP2AGX65DF29C6N)
- 60,214 logic elements - higher density than EP2AGX45 (vs EP2AGX45DF29I5)
- 8 transceiver channels at 3.75 Gbps (vs Cyclicone V E GX (lower-cost family))
- Lead-free RoHS compliant ordering option (vs EP2AGX65DF29I5 (without 'N' suffix))
- Altera Quartus II toolchain maturity (vs Newer Intel FPGA families (Cyclone 10, Arria 10))
Design Notes
The 780-BGA DF29 package uses 1.0 mm ball pitch and a 29 mm x 29 mm body; the PCB must use a microvia build-up stack-up (typically 4-6 layers for signals, 8-12 for full fanout). Per Altera AN 583 High-Speed BGA Layout Guidelines, route all transceiver balls on the top side of the break-out region to avoid via stubs; place decoupling capacitors on the bottom side directly under the BGA via array. Reference the Altera Arria II GX DF29 package diagram in the device handbook for keep-out zones and ball-map coordinates.
Estimated: at full transceiver utilization (8 lanes x 3.75 Gbps, 100% toggling) and high logic activity, total power dissipation reaches approximately 8-10 W. With a thermal resistance (theta_JA) of approximately 5-7 C/W for the 780-BGA DF29 package and per the Arria II GX power calculator, junction temperature can rise 40-70 C above ambient. A 6-layer PCB with continuous ground plane and thermal via array under the package is required; for full-power industrial deployments, consider an aluminum heat spreader.
Transceiver channels (Gbps_TX, Gbps_RX) require length-matched differential pairs within 150 mil of matched length across all 8 lanes for 3.75 Gbps operation. Per Altera AN 558 High-Speed Transceiver PCB Design, use 100 ohm differential impedance with 85 ohm common-mode and keep series AC-coupling capacitors within 1 inch of the FPGA balls. Reference clock lines must be isolated from data lines with at least 3W spacing to avoid crosstalk. JTAG and configuration pins (MSEL[3..0]) must be strapped to the desired configuration mode via 4.7 kohm pull-ups/pull-downs before POR.
The Arria II GX EP2AGX65 requires four independent power rails: VCC (0.9 V core), VCCD_PLL (0.9 V PLL digital), VCCT_GXB (1.1 V transceiver), and VCCIO (1.2 V / 1.5 V / 2.5 V / 3.3 V I/O). Per the Arria II GX handbook, VCC must ramp monotonically before POR; power sequencing is handled internally if VCCAUX is held above 2.5 V before VCC ramps. Estimate: a typical 4-channel design with moderate logic utilization draws approximately 4-5 W total. Use a 4-layer PCB with dedicated power and ground planes to meet the 50 A peak core current requirement.
Do not confuse the EP2AGX65 (60,214 LEs) with the EP2AGX45 (41,950 LEs) or EP2AGX125 (124,100 LEs) - they share the same DF29 package but have different logic capacity. The I5 speed grade is industrial; C5/C6 are commercial; I3 is lower-power industrial. Verify the Quartus II device selection matches the exact part number before layout. Do not reuse an EP2AGX65 board file with an EP2AGX45 design without recompiling pin assignments. The 780-BGA DF29 footprint is NOT pin-compatible with the 780-BGA FF35 (Stratix IV) or EF35 (Arria II GZ) packages.
Compliance Information
RoHS and lead-free compliance indicated by 'N' suffix variant (EP2AGX65DF29I5N); halogen-free status not explicitly documented in available sources. AEC-Q100 not applicable for FPGAs. Conflict-minerals compliance per Intel FPGA product policy.
