EP2AGZ225HF40I3G - 224K-Cell 500 MHz FPGA | Altera
MPN: EP2AGZ225HF40I3G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2AGZ225HF40I3G Overview
An FPGA is a semiconductor containing configurable logic blocks, routing resources, memory, and programmable I/O. In the hierarchy of electronic components, an FPGA sits between conventional programmable logic and higher-density application-specific system integration. Engineers configure these resources to implement processors, interface bridges, signal-processing datapaths, and control logic, then revise the design after fabrication without replacing the entire IC.
The EP2AGZ225HF40I3G headline parameters are 224,000 cells, 500 MHz operation, and 734 I/O. Its 1517-pin FC-FBGA package supports the large number of external connections required by data-intensive systems. The 0.9 V core-voltage entry and 40 nm process indicate the process node and nominal operating point available from the verified product listing. The I3G suffix is reported as the industrial ordering option, while the exact associated temperature rating and speed-grade limits require manufacturer documentation before production use.
Technically, the device combines a substantial programmable fabric with hundreds of general-purpose I/O. That combination allows parallel protocol handling, custom arithmetic, state-machine control, and data-format conversion within the same device. Board-level power integrity becomes important because a large BGA has many simultaneous switching outputs, short return paths, controlled impedance traces, and local decoupling must be designed together. Configuration storage, clock distribution, and I/O-bank planning also affect deterministic behavior.
Typical applications include telecommunications switching and protocol conversion, industrial imaging and machine-vision processing, test and measurement equipment, high-performance networking equipment, digital-signal-processing systems, and aerospace or defense prototyping. Its 734 I/O and 224,000-cell capacity make it relevant when fixed-function controllers lack required parallelism or when system requirements are expected to evolve.
The principal trade-off is integration and flexibility versus design complexity, power, pin escape, and verification effort. A 1517-pin FC-FBGA requires a carefully planned multilayer PCB, complete ball assignment, signal-integrity review, robust power delivery, thermal analysis, and an appropriate device-programming flow. The 500 MHz figure should not be treated as a guarantee for every user design because actual performance depends on routing, logic utilization, timing constraints, and the selected configuration.
This page combines the verified manufacturer-family parameters, current distributor availability, explicit data gaps, and drop-in screening rules to support engineering research. It distinguishes searchable facts from parameters that must be confirmed from the complete manufacturer datasheet or device documentation before schematic sign-off, PCB release, or substitution approval.
Drop-in alternatives for EP2AGZ225HF40I3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ225HF40I3G (same form factor and footprint) β differing in Package, Speed Grade, Logic Elements, Package Type, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ225HF40C3G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1450 / Unit
View Datasheet βEP2AGZ225HF40C3N
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$1820 / Unit
View Datasheet βEP2AGZ225HF40C4N
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$2410 / Unit
View Datasheet βEP2AGZ225HF40C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$835 / Unit
View Datasheet βEP2AGZ225HF40I3G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Arria II GZ |
| Logic Cell Count | 224000 cells |
| Maximum Device Frequency | 500 MHz |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| User I/O Count | 734 I/O |
| Package Pin Count | 1517 pins |
| Package Type | FC-FBGA |
| Packaging Format | Tray |
| Ordering Grade Suffix | I3G |
| Operating Temperature Grade | Industrial |
| Programmability | SRAM-configurable FPGA |
| Mounting Type | Surface Mount |
EP2AGZ225HF40I3G fc-fbga Pin Configuration Guide
Pin configuration for EP2AGZ225HF40I3G (fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ225HF40I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ225HF40I3G is suitable for 6 applications: Industrial Control and Automation, Telecommunications Protocol Conversion, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, High-Performance Networking Equipment, Digital Signal Processing Systems.
Industrial Control and Automation
EP2AGZ225HF40I3G fits industrial control systems that combine sensor acquisition, motion sequencing, protocol conversion, and deterministic parallel logic. Its 224,000 logic cells provide capacity for multiple control domains, while 734 user I/O can interface with encoders, actuators, analog-to-digital converters, digital-to-analog converters, and industrial communication links. The I3G ordering context identifies an industrial option, but the exact temperature range must be confirmed from manufacturer documentation. Use the FPGA between field-level I/O and a supervisory processor to aggregate data, perform filtering, and maintain real-time control without loading the main processor. The 0.9 V core supply and 1517-pin FC-FBGA package require a carefully engineered power distribution network and multilayer PCB. The 500 MHz listed device frequency supports substantial datapath capability, although actual timing depends on the selected configuration and routing.
Recommended
Telecommunications Protocol Conversion
EP2AGZ225HF40I3G is well matched to telecommunications equipment that must translate high-speed streams between interface formats while retaining timing control and data integrity. The 734 user I/O provide a large interface envelope for parallel buses, serializer/deserializer connections, clock distribution, and status monitoring. With 224,000 logic cells, the fabric can host framing, packet buffering, error handling, and protocol-specific state machines in one programmable device. Its 500 MHz listed frequency supports high-throughput digital blocks, but designers must apply the actual Arria II GZ timing models and constraints. The 1517-pin FC-FBGA package supports the required signal count but makes controlled impedance, layer transitions, and return paths critical. The 40 nm process and 0.9 V core supply should be incorporated into the system power, thermal, and signal-integrity analysis. A configuration-management plan is also necessary to support field updates.
Recommended
Industrial Imaging and Machine Vision
EP2AGZ225HF40I3G can serve as a high-density image-processing and camera-interface controller in industrial imaging systems. The 224,000 logic cells support pixel formatting, line buffers, thresholding, color-space conversion, and multi-stage preprocessing, while 734 user I/O accommodate camera data, frame synchronization, memory buses, and control signals. A listed 500 MHz device frequency enables parallel datapath implementation, although camera throughput, memory bandwidth, and timing closure must be evaluated together. The industrial ordering context is useful for equipment deployed outside controlled environments, but the exact operating temperature and reliability values remain manufacturer documentation items. The 1517-pin FC-FBGA package offers extensive connectivity while requiring a dense multilayer board and deliberate escape strategy. The 0.9 V core supply should be delivered with low-noise regulation and local decoupling. An FPGA also permits post-deployment algorithm revisions, reducing the need for a new board spin when imaging requirements change.
Recommended
Test and Measurement Instrumentation
EP2AGZ225HF40I3G suits test and measurement platforms that need simultaneous capture, conditioning, analysis, and control of many signals. Its 224,000 logic cells allow custom trigger logic, correlation, filtering, waveform analysis, and instrument-state sequencing, while 734 user I/O can connect to converters, memory, front-panel controls, and data-export interfaces. The listed 500 MHz device frequency is useful for demanding digital processing, but measurement accuracy depends on clock quality, I/O timing, board layout, and calibration. The 0.9 V core supply and 40 nm process support a high-density implementation, but power integrity and thermal performance require validation. The 1517-pin FC-FBGA package provides broad I/O access at the cost of complex escape routing and assembly control. The I3G ordering context is relevant to industrial equipment, but the exact environmental limits must be confirmed. Reconfigurability allows the instrument to support new measurement modes without changing the base hardware.
Recommended
High-Performance Networking Equipment
EP2AGZ225HF40I3G is applicable to networking equipment requiring packet processing, traffic management, interface adaptation, and hardware-accelerated state control. The 224,000 logic cells can implement forwarding tables, statistics counters, classifiers, queue-management logic, and protocol-aware processing. Its 734 user I/O support multiple data paths, memory channels, management buses, and status signals. The listed 500 MHz frequency provides a substantial performance target, but real throughput depends on the designβs clock domains, I/O standards, memory architecture, and placement constraints. The 1517-pin FC-FBGA package supports a large pin count, so the PCB needs careful signal-integrity planning, continuous reference planes, and controlled-impedance routing. The 0.9 V core supply requires low-noise power distribution and sequencing analysis. The FPGAβs reconfigurability helps networking products adapt to evolving standards and customer features, while configuration security and update control should be addressed in the system design.
Recommended
Digital Signal Processing Systems
EP2AGZ225HF40I3G can provide configurable digital signal processing for communications, instrumentation, and scientific equipment. The 224,000 logic cells allow parallel FIR filters, FFT stages, modulation functions, adaptive control, and custom data reduction without consuming a fixed-function processor. Its 734 user I/O support sample-data interfaces, memory, clocks, and control channels. The listed 500 MHz device frequency is useful for aggressive datapaths, but achievable sample rate depends on bit width, arithmetic utilization, routing, and timing closure. The 0.9 V core supply and 40 nm process should be modeled in the system power budget, while the 1517-pin FC-FBGA package requires a dense, high-quality PCB implementation. The FPGA can combine several processing stages and deterministic control functions in one device, reducing inter-chip latency. For production, verify DSP resource availability, maximum clock constraints, I/O-bank compatibility, and the exact industrial temperature range from the manufacturer documentation.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ225HF40I3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ225HF40C3G | EP2AGZ225HF40C3N | EP2AGZ225HF40C4N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | FC-FBGA-1517 | FC-FBGA-1517 | FC-FBGA-1517 | FC-FBGA-1517 |
| Family | Arria II GZ | EP2AGZ225 Arria II GZ family | EP2AGZ225 Arria II GZ family | EP2AGZ225 Arria II GZ family |
| Logic Cell Count | 224000 cells | 224000 cells family match | 224000 cells family match | 224000 cells family match |
| User I/O | 734 I/O | 734 I/O family match | 734 I/O family match | 734 I/O family match |
| Core Voltage | 0.9 V | 0.9 V family match | 0.9 V family match | 0.9 V family match |
| Process Technology | 40 nm | 40 nm family match | 40 nm family match | 40 nm family match |
| Ordering Grade | I3G industrial code | C3G commercial code | C3N commercial code | C4N commercial code |
Key Differentiators
- I3G industrial ordering context (vs EP2AGZ225HF40C3G)
- Large verified logic capacity (vs EP2AGZ225HF40C4N)
- High external-interface count (vs EP2AGZ225HF40C3N)
- High-density FC-FBGA implementation (vs EP2AGZ225HF40C4G)
Design Notes
Treat the 0.9 V core supply as a high-current, low-noise distribution requirement rather than a simple rail connection. Place bulk and local ceramic decoupling at the package power-entry regions, keep high-current loops short, and separate noisy I/O returns from sensitive core returns. Verify regulator transient response, sequencing, and allowable ripple against the complete manufacturer power-supply guidance; the verified data does not provide current limits, tolerances, or power-up timing.
The 1517-pin FC-FBGA package requires a controlled-impedance multilayer PCB with a complete package ball map before escape routing. Maintain continuous reference planes through via transitions, use short and symmetrical escape structures, and verify pad geometry against the selected land pattern. Because 734 user I/O are available, reserve routing layers and check simultaneous-switching-noise effects during placement rather than after layout. Use the manufacturer package drawing, not the MPN alone, for land dimensions and ball numbering.
EP2AGZ225HF40I3G uses a 40 nm process and a 0.9 V core supply, but the verified sources do not provide junction-to-ambient resistance, maximum junction temperature, or a thermal derating curve. Estimate enclosure and board thermal performance only after the complete power budget and airflow conditions are known. Use the manufacturer thermal model for package-specific calculations, and check industrial-grade limits before operation at elevated ambient temperature.
Do not treat 500 MHz as a guaranteed application clock for every logic function. The listed value is a verified device-level frequency entry, not a substitute for timing closure with the selected I/O standards, clock resources, placement, and configuration. Before release, confirm Arria II GZ device support in the installed design software, preserve the configuration image, validate I/O-bank voltage compatibility, and retain a recovery method for failed field updates.
Compliance Information
The verified web data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 declarations. Industrial ordering context is not an AEC-Q100 qualification claim.
