EP2AGZ225HF40C4N - Arria II GZ FPGA 224K LE 1517-FCBGA | Intel
MPN: EP2AGZ225HF40C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 50 | $2895 | $144,750.00 |
| 100 | $2745 | $274,500.00 |
| 500 | $2580 | $1,290,000.00 |
| 1,000 | $2410 | $2,410,000.00 |
EP2AGZ225HF40C4N Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that the designer configures after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which are a sub-category of digital integrated circuits. The Arria II GZ family adds dedicated transceiver and DSP blocks on top of standard FPGA fabric, placing it at the intersection of programmable logic and high-speed serial signal processing.
Key features include 8,960 LABs (Logic Array Blocks), embedded transceivers supporting multi-gigabit serial protocols, DSP blocks for high-throughput fixed- and floating-point arithmetic, and a rich clock network with PLLs for multi-domain designs. The 40 nm process node combined with on-chip hard IP blocks gives the GZ family a favorable performance-per-watt ratio relative to older Arria generations.
Technical depth: the Arria II GZ architecture pairs a logic fabric tuned for high register counts with up to 12.5 Gbps transceivers, hardened PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM II), and dedicated DSP slices optimized for FFTs, FIR filters, and baseband modulation. The 1517-FCBGA (HF40) package exposes the full 734-pin user I/O, allowing designs to use all available transceiver and memory channels without package bottlenecks.
Typical applications include wireless baseband processing, high-end video broadcast infrastructure, radar signal processing, medical imaging accelerators, and ASIC prototyping. Its combination of logic density and 6.375 Gbps transceivers makes it a strong fit for designs previously reserved for more expensive Stratix devices.
Design consideration: the FCBGA-1517 package requires a multi-layer PCB with microvia technology, controlled-impedance routing for transceiver channels, and careful power-plane design to meet the 0.9 V core / 1.1 V transceiver supply sequencing requirements spelled out in the Arria II Device Handbook.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria II GZ family, and practical design notes not collected in the manufacturer datasheet, giving engineers a single reference for sourcing, second-source planning, and PCB bring-up decisions.
Drop-in alternatives for EP2AGZ225HF40C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ225HF40C4N (same form factor and footprint) β differing in Speed Grade, Package, Package Type, Logic Elements, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ225HF40C3N
β Drop-Inβ In Stock
$1820 / Unit
View Datasheet βEP2AGZ225HF40C4G
β Drop-Inβ In Stock
$835 / Unit
View Datasheet βEP2AGZ225HF40C3G
β Drop-Inβ In Stock
$1450 / Unit
View Datasheet βEP2AGZ225FF35I4N
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2AGZ225HF40C4N Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements | 224,000 |
| Logic Array Blocks (LABs) | 8,960 |
| Adaptive Logic Modules (ALMs) | 89,600 |
| Embedded Memory Bits | 14,248,960 |
| User I/O Pins | 734 |
| Number of Package Pins | 1517 |
| Package Type | FBGA (FineLine BGA) |
| Package Code | HF40 |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Temperature Range | -40C to +85C |
| Process Node | 40 nm |
| Transceiver Data Rate | Up to 6.375 Gbps |
| DSP Blocks | Yes (18x19 multiplier mode) |
| Mounting Type | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant |
EP2AGZ225HF40C4N hf40 Pin Configuration Guide
Pin configuration for EP2AGZ225HF40C4N (hf40 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ225HF40C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ225HF40C4N is suitable for 6 applications: Wireless Baseband Processing, ASIC Prototyping, High-End Video Broadcast Infrastructure, Radar Signal Processing, Medical Imaging Accelerator, Test & Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGZ225HF40C4N's 224,000 logic elements and embedded DSP blocks make it well-suited for wireless baseband signal processing such as LTE and 5G NR channel cards. With 14.25 Mbit of on-chip memory and 734 user I/O pins, the device can hold entire baseband symbol buffers and parallel antenna streams without external SRAM. The 6.375 Gbps transceivers interface directly to CPRI or OBSAI fronthaul links to remote radio heads. Engineers typically pair this FPGA with ADI AD9122 high-speed DACs and TI LMK04828 clock conditioners for a complete baseband card.
Recommended
ASIC Prototyping
With 224K logic elements the EP2AGZ225HF40C4N can host multi-million-gate ASIC prototypes for hardware-software co-validation before tape-out. The 734 user I/O count lets the prototype map large ASIC pad counts 1:1 to FPGA pins, simplifying testbench development. Multiple FPGAs can be chained through the 6.375 Gbps transceivers to build modular prototype systems. Typical companions are DDR3 SODIMM daughter cards and high-pin-count logic analyzers for ASIC bring-up.
Recommended
High-End Video Broadcast Infrastructure
The EP2AGZ225HF40C4N's 734 user I/O and embedded transceivers are well matched to broadcast video routers, format converters, and contribution encoders for SDI and SMPTE 2110 IP video. The 224K LE supports multi-stream HEVC/H.264 encoding at broadcast resolutions, while 14.25 Mbit on-chip RAM enables line, frame, and motion-vector buffering. Typical companions are high-speed SDI equalizers and SFP/9600 modules for SMPTE 2110 IP video transport.
Recommended
Radar Signal Processing
The EP2AGZ225HF40C4N delivers the DSP throughput and transceiver bandwidth required for phased-array radar front-end processing. Its 18x19 multiplier DSP blocks accelerate pulse-Doppler FFTs and adaptive beamforming, while 6.375 Gbps transceivers handle digitized antenna data streams to backend processors. The 14.25 Mbit on-chip memory supports range-Doppler map buffering across multiple coherent processing intervals. The 1517-FCBGA HF40 package's high pin count exposes all transceiver channels needed for multi-element arrays.
Recommended
Medical Imaging Accelerator
The EP2AGZ225HF40C4N supports CT, MRI, and ultrasound image-reconstruction pipelines that demand both DSP horsepower and fast off-chip memory access. Its 224K LE handles back-projection and iterative reconstruction algorithms, while 14.25 Mbit on-chip RAM stages sinogram slices before volume rendering. The 6.375 Gbps transceivers link to high-speed ADC front ends and PCIe Gen2 host interfaces. Typical companions are TI ADC32RF45 dual-channel RF-sampling ADCs and Xilinx-compatible fiber-channel links for DICOM export.
Recommended
Test & Measurement Instrumentation
The EP2AGZ225HF40C4N's logic density, on-chip memory, and high-speed transceivers make it a strong fit for protocol-aware test instruments - BERT, protocol analyzers, and high-speed oscilloscope acquisition ASICs. The 734 user I/O supports wide parallel acquisition buses, while 6.375 Gbps transceivers handle USB 3.0, SATA, or PCIe Gen2 protocol triggering. Engineers typically pair it with TI ADC32RF80 RF-sampling ADCs and LTM2884 isolated USB transceivers for instrument front-end designs.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ225HF40C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ225HF40C3N | EP2AGZ225HF40C4G | EP2AGZ225HF40C3G | EP2AGZ225FF35I4N |
|---|---|---|---|---|---|
| Package | 1517-FCBGA (HF40) | 1517-FCBGA (HF40) - same | 1517-FCBGA (HF40) - same | 1517-FCBGA (HF40) - same | 1152-FCBGA (FF35) - different, PCB rework required |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 224,000 | 224,000 | 224,000 | 224,000 | 224,000 |
| Embedded Memory (bits) | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 | 14,248,960 |
| User I/O | 734 | 734 | 734 | 734 | 544 |
| Speed Grade | C4 (commercial) | C3 (faster) | C4 (commercial) | C3 (faster) | I4 (industrial) |
| Packing Option | Tape & Reel (N) | Tape & Reel (N) | Tray (G) | Tray (G) | Tape & Reel (N) |
| RoHS Compliance | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant |
| Pin-to-pin drop-in | Reference | Yes (same HF40) | Yes (same HF40) | Yes (same HF40) | No (FF35 vs HF40) |
Key Differentiators
- Maximum 734 user I/O count in the Arria II GZ 225K LE tier (vs EP2AGZ225FF35I4N)
- Speed grade C4 balances cost and timing margin (vs EP2AGZ225HF40C3N)
- Tape-and-reel packing for high-volume assembly (vs EP2AGZ225HF40C4G)
Design Notes
Estimated: the EP2AGZ225HF40C4N in a 1517-FCBGA HF40 package requires a high-density PCB with laser-drilled microvias, 0.4 mm ball pitch, and at least an 8-layer stack-up. Power-plane resonance below 100 MHz must be suppressed with decoupling capacitor placement - place 0402-size 100 nF X7R ceramics every 5 mm along the BGA periphery and add bulk polymer-aluminum capacitors (e.g., TDK C-PLQ series) at each supply pin cluster. Per the Arria II Device Handbook, the 0.9 V core, 1.1 V transceiver, and 2.5 V auxiliary supplies each require independent decoupling schemes.
Estimated: the EP2AGZ225HF40C4N dissipates approximately 8-12 W under typical load (based on the Arria II GZ family power estimator for ~70% utilization at 6.375 Gbps transceiver activity). The HF40 FCBGA exposes a thermal pad array on the package underside - the PCB must include a thermal via farm of at least 0.3 mm pitch vias under the die, with copper-filled or plugged plating to conduct heat to internal ground planes. Junction-to-ambient thermal resistance is typically around 12-15 C/W with proper via farm and 2 oz copper outer layers; without it, expect 25-30 C/W and derate the design accordingly.
Transceiver channels on the Arria II GZ demand 100-ohm differential routing with intra-pair skew below 1 ps and inter-pair skew below 5 ps for 6.375 Gbps operation. Reference planes must be continuous under the entire transceiver route; any split in the reference plane causes return-path discontinuities that show up as eye-diagram closure. Length-matching at the TX and RX pairs should be done before the AC-coupling capacitors. Use the Intel-provided Arria II GZ PCB design guidelines for via-stitching pattern, antipad clearance, and break-out via placement.
Common pitfalls with the EP2AGZ225HF40C4N include: (1) failing to power-sequence the 0.9 V core before the 1.1 V transceiver supply - the Arria II Device Handbook mandates a 0-200 ms monotonic ramp; (2) leaving JTAG TCK floating, which can latch the device into a configuration state on power-up; (3) ignoring the MSEL pin strap on the HF40 package, which selects AS, PS, JTAG, or fast passive parallel configuration modes; (4) assuming all 734 user I/Os are general-purpose - several are multiplexed with configuration / JTAG / clock pins and need careful bank assignment in the Quartus pin planner.
Compliance Information
Lead Free / RoHS Compliant per Altera / Intel PSG product page. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC. Halogen-free status not stated on the verified product page.
