EP2AGZ225HF40I3N - Arria II GZ FPGA, 224K LE, 1517-FBGA | Intel
MPN: EP2AGZ225HF40I3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 25 | $2480 | $62,000.00 |
| 100 | $2350 | $235,000.00 |
| 250 | $2210 | $552,500.00 |
EP2AGZ225HF40I3N Overview
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs allow hardware engineers to implement custom digital logic, signal-processing pipelines, and interface protocols by writing hardware description language (HDL) code rather than fabricating a custom silicon die. Arria II GZ parts in particular bridge the gap between the lower-cost Cyclone and high-end Stratix families, making them common in mid-range communications, broadcast, and ASIC prototyping workloads.
Key features of the EP2AGZ225HF40I3N include 8,960 LABs (Logic Array Blocks) and 736 embedded multipliers (18x18) for DSP, along with PCIe Gen1/Gen2 hard IP blocks, multiple PLLs, and high-speed transceivers capable of 6.375 Gbps operation. The 1517-FCBGA package uses flip-chip land-grid technology that supports the device's high I/O count and signal-integrity requirements for multi-gigabit interfaces. The "I3" speed grade and industrial temperature rating make it suitable for thermally and electrically demanding environments beyond standard commercial ranges.
Typical applications include high-speed serial protocol bridging, ASIC and ASSP prototyping, broadcast video processing, test and measurement instrumentation backplanes, and PCIe-based add-in cards. Engineers choose this device when they need more logic density than Cyclone V can offer but do not require the transponder counts and memory bandwidth of Stratix IV/V. The HF40 suffix designates a specific BGA package and pinout, which must be matched exactly when designing a PCB footprint.
When designing with this part, plan for multi-layer PCB stack-ups with controlled-impedance routing for the transceiver channels, multiple decoupling capacitors near the balls, and a robust thermal management strategy - the flip-chip BGA dissipates significant power under heavy utilization. Quartus II is the primary development environment; only specific Quartus versions support Arria II GZ, and the latest service packs should be installed before tape-out.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2AGZ225HF40I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ225HF40I3N (same form factor and footprint) — differing in Package, Logic Elements, Package Type, Embedded Memory Bits, Logic Elements (LE).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ225HF40I3G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2AGZ225HF40C4N
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$2410 / Unit
View Datasheet →EP2AGZ225HF40C3N
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$1820 / Unit
View Datasheet →EP2AGZ300HF40I3N
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$3820 / Unit
View Datasheet →EP2AGZ225HF40I3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements (LE) | 224,000 |
| Embedded Memory (bits) | 14,248,960 |
| User I/O | 734 |
| Logic Array Blocks (LABs) | 8,960 |
| Embedded Multipliers (18x18) | 736 |
| Transceiver Data Rate (max) | 6.375 Gbps |
| Speed Grade | I3 (industrial, -3) |
| Operating Temperature | -40C to +100C (industrial) |
| Package Type | 1517-BBGA, FCBGA (flip-chip BGA) |
| Mounting Type | Surface Mount |
| Process Technology | 40 nm TSMC |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) |
| PCIe Hard IP | PCIe Gen1/Gen2 |
EP2AGZ225HF40I3N 1517-bbga, fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP2AGZ225HF40I3N (1517-bbga, fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ225HF40I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ225HF40I3N is suitable for 6 applications: Telecom Backplane Protocol Bridging, ASIC and ASSP Prototyping, Broadcast Video Processing, PCIe Add-In Card and Acceleration, Test and Measurement Instrumentation, Industrial Automation and Machine Vision.
Telecom Backplane Protocol Bridging
The EP2AGZ225HF40I3N's 6.375 Gbps transceivers and PCIe Gen1/Gen2 hard IP make it ideal for telecom backplane protocol bridging between CPRI, OBSAI, Serial RapidIO, and 10 GbE XAUI domains. The 224K logic elements implement multi-protocol packet processing pipelines, while 14.25 Mbits of embedded memory handle cell buffering at line rate. Placed on a multi-layer backplane PCB with matched-length transceiver traces, it serves as the central interconnect device in LTE baseband, fronthaul aggregation, and central-office switching equipment.
Recommended
ASIC and ASSP Prototyping
With 224,000 logic elements, 14.25 Mbits of block RAM, and 736 DSP slices, the EP2AGZ225HF40I3N provides enough capacity to prototype mid-to-large ASIC and ASSP designs before taping out a custom silicon die. The Arria II GZ family shares ARM Cortex-A9 hard IP support, allowing embedded software co-development on the FPGA. The HF40 1517-ball BGA exposes the full I/O count needed to bring out wide custom peripherals. Engineers map the design with Quartus II, validate at speed using the embedded SignalTap logic analyzer, and then port the verified RTL to the production ASIC vendor with high confidence.
Recommended
Broadcast Video Processing
The 736 DSP slices in the EP2AGZ225HF40I3N deliver parallel processing bandwidth for broadcast video pipelines including HD-SDI/3G-SDI switching, video scaling, deinterlacing, and overlay composition. Its industrial I3 speed grade guarantees deterministic timing across video frame rates, while 14.25 Mbits of embedded RAM holds multiple video frames on chip. Used in professional studio equipment, broadcast routers, and IPTV head-end encoders, the device ingests multiple SDI streams, processes them in real time, and outputs clean HD/3G video with frame-sync and genlock.
Recommended
PCIe Add-In Card and Acceleration
The built-in PCIe Gen1/Gen2 hard IP block in the EP2AGZ225HF40I3N enables native 4-lane or 8-lane PCI Express connectivity without consuming logic resources, making the part ideal for high-throughput PCIe add-in cards and computational accelerators. With 224K LEs and 14.25 Mbits of block RAM, it can host complete data-plane engines (encryption, compression, signal processing, trading algorithms) that offload work from the host CPU. The 734 user I/Os expose DDR3 controller banks and high-speed external interfaces needed for frame buffers and external memory channels.
Recommended
Test and Measurement Instrumentation
In high-end oscilloscopes, logic analyzers, and protocol analyzers, the EP2AGZ225HF40I3N provides the DSP bandwidth and transceiver count needed for real-time signal capture, triggering, and protocol decoding. The 736 18x18 multipliers implement FIR/IIR filters, FFT engines, and channel-equalization algorithms at multi-Gsps rates, while the 14.25 Mbit on-chip buffer holds raw acquisition samples before host-side transfer. The industrial temperature range ensures reliable operation in lab and field environments with -40C to +100C ambient swings.
Recommended
Industrial Automation and Machine Vision
The EP2AGZ225HF40I3N's industrial -40C to +100C rating and 224K LEs suit factory-floor machine vision systems requiring deterministic image processing at production line speeds. The 734 user I/Os interface multiple GigE Vision, Camera Link, or CoaXPress cameras, while the 736 DSP slices handle Bayer demosaicing, edge detection, pattern matching, and barcode reading in real time. The high transceiver count enables Camera Link full/medium configurations and 10 GigE uplink to factory networks. Engineers use the Arria II GZ for both frame-grabber front-ends and inline QC processors in automated production lines.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ225HF40I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ225HF40I3G | EP2AGZ225HF40C4N | EP2AGZ225HF40C3N | EP2AGZ300HF40I3N | EP2AGZ225FF35I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FBGA (HF40) | 1517-FBGA (HF40) - same | 1517-FBGA (HF40) - same | 1517-FBGA (HF40) - same | 1517-FBGA (HF40) - same | 1152-FBGA (FF35) - different |
| Logic Elements | 224,000 LE | 224,000 LE - same | 224,000 LE - same | 224,000 LE - same | 300,000 LE - higher | 224,000 LE - same |
| Embedded Memory | 14,248,960 bits | 14,248,960 bits - same | 14,248,960 bits - same | 14,248,960 bits - same | 16,282,624 bits - higher | 14,248,960 bits - same |
| User I/O | 734 | 734 - same | 734 - same | 734 - same | 734 - same | 540 - lower |
| Speed Grade | I3 (industrial, -3) | I3 - same | C4 (commercial, -4) - slower | C3 (commercial, -3) - same Fmax | I3 - same | I3 - same |
| Operating Temperature | -40C to +100C industrial | -40C to +100C industrial - same | 0C to +85C commercial | 0C to +85C commercial | -40C to +100C industrial - same | -40C to +100C industrial - same |
| Transceiver Rate (max) | 6.375 Gbps | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same | 6.375 Gbps - same |
Key Differentiators
- Highest I/O count in the 225K-LE Arria II GZ family (vs EP2AGZ225FF35I3N)
- Industrial temperature rating for harsh environments (vs EP2AGZ225HF40C4N)
- Faster speed grade (-3) for higher Fmax operation (vs EP2AGZ225HF40C4N)
- Pb-free ball finish available for RoHS-compliant production (vs EP2AGZ225HF40I3G)
Design Notes
The EP2AGZ225HF40I3N's flip-chip BGA package dissipates 10-25 W under typical utilization, depending on clock rate and toggle density. Per the Arria II GZ datasheet, the HF40 package uses a heat-spreader lid; engineers must design a PCB thermal solution that mates to this lid via a thermal interface material (TIM) and either a passive heatsink or active airflow. Without forced airflow, sustained utilization above 60-70 percent can exceed the 100C junction limit. Estimated: assuming 18 W dissipation and the datasheet thermal resistance, an aluminum heatsink with thermal conductivity of 200 W/mK at minimum 1 mm thickness is recommended for industrial ambient environments.
The 1517-ball HF40 package uses 1.0 mm ball pitch with flip-chip land-pad construction. PCB fabrication must support microvia (HDI) technology with at least 1-2-n-1 build-up layers to fan out the inner balls. Per Arria II GZ datasheet Chapter 6, power-plane decoupling requires approximately 40-60 low-ESL capacitors within 5 mm of the BGA footprint, distributed across the VCCINT, VCCA, VCCD_PLL, and transceiver supply rails. Signal-via transitions should use back-drilling above 5 Gbps to reduce stub reflections.
Three common pitfalls when designing with the EP2AGZ225HF40I3N: (1) selecting the wrong configuration device - SRAM-based Arria II GZ requires an external serial flash or EPCQ configuration memory, not JTAG-only at production; (2) exceeding transceiver reference-clock jitter specs - each transceiver channel needs a clean jitter-cleaned reference at 100-156.25 MHz from a dedicated PLL; (3) misidentifying the 'I3' vs 'C3' suffix - I3 is industrial temperature and faster speed-grade tier than C3, so swapping them silently changes operating range and Fmax. Verify the full ordering code (HF40, I3/C3, N/G) against the part number key in the Arria II GZ datasheet before ordering.
Transceiver channels operating at 6.375 Gbps require controlled-impedance routing with differential impedance of 100 ohms +-10 percent and intra-pair skew below 5 mil per inch of trace length. Per the Arria II GZ datasheet, transceiver channels should be AC-coupled with 100 nF capacitors at the receiver input, and reference-clock routing must be isolated from data traces with ground guard traces. PCB stack-up should use low-loss dielectric (Df < 0.005 at 5 GHz) such as Megtron 6 or equivalent. Use 3D electromagnetic simulation (HFSS, ADS) on critical channels before tape-out.
Compliance Information
EP2AGZ225HF40I3N datasheet does not state RoHS explicitly; the 'N' suffix historically denotes Pb-containing ball finish (RoHS-exempt or non-compliant). Choose EP2AGZ225HF40I3G for RoHS-compliant Pb-free ball finish. Conflict-minerals compliance per Intel standard supplier declarations.
