EP2AGZ350FH29C3N - Arria II GZ FPGA, 350K LE, 780-BGA | Intel
MPN: EP2AGZ350FH29C3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2380 | $238,000.00 |
| 500 | $2150 | $1,075,000.00 |
| 1,000 | $1920 | $1,920,000.00 |
EP2AGZ350FH29C3N Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and dedicated silicon blocks such as transceivers and DSP slices. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable-logic category and above microcontrollers for raw parallel data-path throughput. The Arria II GZ family is positioned as a transceiver-rich mid-range FPGA bridging the gap between Cyclone (low cost) and Stratix (high performance).
Key features of the EP2AGZ350FH29C3N include 16 full-duplex multi-gigabit transceivers supporting data rates up to 6.375 Gbps, dedicated on-chip hard memory controllers for DDR3/DDR2/LPDDR2 with ECC, and a fine-grained logic fabric built around 8-input adaptive logic modules (ALMs). The -C3 speed grade and industrial-grade temperature suffix in the part number reflect the standard speed bin with commercial operating temperature. The 780-BGA FCBGA package supports the highest pin count in the family and exposes all 281 user I/Os alongside dedicated transceiver, clock, and configuration pins.
Typical applications for this device include wireline backhaul line cards, military secure-radio baseband, ASIC prototyping, broadcast video processing, and high-performance PCIe Gen2 endpoint designs. The integrated transceivers remove the need for external SERDES in multi-gigabit links, reducing BOM cost and simplifying PCB layout.
When designing with this FPGA, allocate at least four PCB layers for power, ground, and signal routing. Heat dissipation must be assessed - the FCBGA package requires thermal vias and an attached heatsink for sustained high utilization. Designers should use the latest Quartus II (Arria II GZ) or Quartus Prime software for bitstream generation and timing closure.
This page consolidates distributor pricing, drop-in Altera/Intel alternatives, and practical design considerations drawn from public datasheets and reference manuals - information not assembled in a single place on the manufacturer product page.
Drop-in alternatives for EP2AGZ350FH29C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350FH29C3N (same form factor and footprint) β differing in Package, Speed Grade, Transceivers, Operating Temperature, Embedded Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ350FH29C3G
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2AGZ350FH29I3N
β Drop-Inβ In Stock
$3550 / Unit
View Datasheet βEP2AGZ300FH29C3N
β Drop-Inβ In Stock
$1925 / Unit
View Datasheet βEP2AGZ300FH29C3G
β Drop-Inβ In Stock
$1545 / Unit
View Datasheet βEP2AGZ300FH29I3N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2AGZ225FF35I3N
β Drop-Inβ In Stock
$2655 / Unit
View Datasheet βEP2AGZ350FH29C3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Series | Arria II GZ |
| Logic Elements (LE) | 348,500 |
| Embedded Memory (bits) | 21,270,528 |
| Number of LABs/CLBs | 13,940 |
| User I/O Count | 281 |
| Package | 780-BBGA, FCBGA (FH29) |
| Number of Pins / Terminals | 780 |
| Speed Grade | C3 |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free Status | Lead free |
| Process Node | 40 nm |
EP2AGZ350FH29C3N 780-bbga, fcbga (fh29) Pin Configuration Guide
Pin configuration for EP2AGZ350FH29C3N (780-bbga, fcbga (fh29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350FH29C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350FH29C3N is suitable for 6 applications: ASIC Prototyping, Wireline Backhaul / Telecom Line Cards, Broadcast Video Processing, Military Secure Radio Baseband, High-Performance PCIe Gen2 Endpoint, Industrial Motor Control and Drive.
ASIC Prototyping
The EP2AGZ350FH29C3N's 348,500 logic elements and 281 user I/Os make it a strong candidate for ASIC prototyping. It allows engineers to map RTL from a target ASIC onto a proven Intel FPGA fabric, accelerating verification by 3-5x vs simulation alone. With 16 multi-gigabit transceivers at up to 6.375 Gbps, it supports prototyping of high-speed serial interfaces like PCIe Gen2, XAUI, and Serial RapidIO without external SERDES.
Recommended
Wireline Backhaul / Telecom Line Cards
Telecom line cards for 4G/5G fronthaul and CPRI backhaul benefit from the EP2AGZ350FH29C3N's 16 transceivers, hard memory controller, and abundant logic. The integrated 6.375 Gbps SERDES eliminates external PHY ICs, reducing BOM cost by ~$30 per board. With 21 Mbit embedded memory and DDR3 controller, the device handles protocol stacks (CPRI, OBSAI, Ethernet MAC) plus baseband DSP preprocessing.
Recommended
Broadcast Video Processing
Broadcast video routers, format converters, and multi-channel video processors leverage the EP2AGZ350FH29C3N's parallel DSP throughput and 281 I/Os. The 21 Mbit embedded block memory supports multi-line video line buffers without external SRAM, while 348K LEs implement SDI de-embedders, color-space converters, and scalers. The FCBGA package's thermal headroom is adequate for sustained 3G-SDI processing at full utilization.
Recommended
Military Secure Radio Baseband
Defense radio systems use the EP2AGZ350FH29C3N for cryptographic baseband processing, channel coding, and waveform generation. The industrial-temperature EP2AGZ350FH29I3N variant operates from -40C to +100C, satisfying MIL-STD-810 shock/vibration profiles. Its reconfigurable logic enables one hardware platform to host multiple waveforms (SINCGARS, HAVE QUICK, Link 16) via firmware updates, reducing SWaP-C.
Recommended
High-Performance PCIe Gen2 Endpoint
The EP2AGZ350FH29C3N's hard PCIe Gen2 IP core (x8 lane capable) implements a high-throughput endpoint for storage controllers, DSP accelerators, and test equipment. With 16 transceivers, designers can pair PCIe with additional 10 GbE or SATA links on the same device. Quartus II provides validated PCIe soft IP and example designs that reduce development time from months to weeks.
Recommended
Industrial Motor Control and Drive
Multi-axis servo drives and industrial robots use the EP2AGZ350FH29C3N to implement field-oriented control (FOC), space-vector PWM, and EtherCAT master protocols. The 281 I/Os handle multiple encoder inputs (incremental, SSI, BiSS), PWM outputs (up to 24 three-phase pairs), and communication peripherals in one device. Industrial-temperature variants tolerate factory floor conditions.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350FH29C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350FH29C3G | EP2AGZ350FH29I3N | EP2AGZ300FH29C3N | EP2AGZ300FH29C3G | EP2AGZ300FH29I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA FCBGA (FH29) | 780-BBGA FCBGA (FH29) | 780-BBGA FCBGA (FH29) | 780-BBGA FCBGA (FH29) | 780-BBGA FCBGA (FH29) | 780-BBGA FCBGA (FH29) |
| Logic Elements | 348,500 | 348,500 | 348,500 | ~300,000 | ~300,000 | ~300,000 |
| User I/O Count | 281 | 281 | 281 | 281 | 281 | 281 |
| Speed Grade | C3 | C3 | I3 | C3 | C3 | I3 |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | -40C to +100C |
| Transceivers | 16 x 6.375 Gbps | 16 x 6.375 Gbps | 16 x 6.375 Gbps | 16 x 6.375 Gbps | 16 x 6.375 Gbps | 16 x 6.375 Gbps |
Key Differentiators
- Highest logic density in the 780-BGA FH29 package option (vs EP2AGZ300FH29C3N)
- Available industrial-temperature variant in same footprint (vs EP2AGZ350FH29C3N (commercial only))
- Integrated 16 transceivers eliminate external SERDES (vs Cyclone V GX FPGAs)
Design Notes
Estimated: The 780-BGA FCBGA package has theta_JA around 12-15 C/W with a properly attached heatsink. At full utilization with 16 transceivers active and ~85% logic utilization, the device can dissipate 8-12W. A thermal pad, heatsink with thermal interface material, and 200+ thermal vias in the PCB land pattern are recommended. Without active cooling, derate utilization above 70% in commercial temperature range.
Route at least 4 PCB layers for the Arria II GZ FPGA: top signal + component, internal ground plane, internal power plane, bottom signal. Place decoupling capacitors (100nF, 10uF bulk) within 5mm of each power pin. The 780-BGA uses 1mm pitch - use microvia or staggered via stack-up for breakout. Series resistors on transceiver reference clocks improve signal integrity.
The Arria II GZ requires multiple supply rails: VCC (core, ~0.9V), VCCAUX (~2.5V), VCCD_PLL (~1.1V), VCCPT (~1.5V), and transceiver supplies VCCHIP (~1.5V) and VCCEHT (~1.5V). Use a multi-rail power sequencer (e.g., LM3880, UCD90120A) to enforce proper power-up order. Estimate: a fully utilized EP2AGZ350 draws 8-15W total across all rails.
Do not exceed 1.0V on VCC core voltage (1.1V absolute maximum). Configuration mode pins (MSEL) must be tied to known logic levels at power-up or the device will fail to configure. For JTAG programming, include a 10k pull-up on TCK and a 1k pull-down on TMS to prevent spurious configuration. Always verify the configuration clock source (CLKUSR vs internal oscillator) matches your EPCQ flash programming.
Compliance Information
RoHS compliant and lead-free per Altera/Intel product page. Not AEC-Q100 qualified (FPGA, not automotive-grade IC). Always request latest Material Declaration Sheet (MDS) for full substance confirmation.
