EP2AGZ350FH29I4G - 281-I/O Arria II GZ FPGA | Altera
MPN: EP2AGZ350FH29I4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2AGZ350FH29I4G Overview
A field-programmable gate array, or FPGA, is a semiconductor device built from programmable logic blocks, configurable routing, memory resources, and programmable I/O. Within the hierarchy FPGA β programmable logic device β integrated circuit, an FPGA bridges application-specific integrated circuits and software-controlled processors: the designer implements digital functions in configuration data while retaining the ability to revise hardware behavior. BGA packaging supports dense interconnect through many solder balls beneath the package.
The principal verified product facts are 281 user I/O and a 780HBGA package. The device is listed as an Intel/Altera embedded FPGA, and distributor listings indicate real-time inventory and ordering availability. The MPN suffix identifies an industrial-temperature, lead-free, tray-oriented ordering option according to the supplied part-number convention context, while exact electrical ratings, logic-element count, transceiver count, operating voltage, and temperature limits require the manufacturer datasheet for confirmation.
The part is designed for digital systems in which parallel datapaths, interface bridging, protocol termination, signal processing, or control logic must operate deterministically. Its 281-I/O capacity allows numerous board-level interfaces to share one programmable device. Because the available verified data does not state internal resource counts or timing figures, those values are intentionally not inferred here.
Typical uses include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and defense or aerospace electronics. It can consolidate glue logic, interface adaptation, state machines, and high-speed control into one programmable device.
Board implementation should use the manufacturer package ball map and signal-integrity guidance, provide complete power distribution and decoupling, and verify every high-speed interface against the relevant FPGA bank rules. The exact BGA land pattern and pin assignments must be obtained from the official Arria II GZ documentation.
This page consolidates verified distributor availability, package and I/O facts, sourcing links, and same-family site candidates while clearly identifying technical data that still requires manufacturer-datasheet confirmation. Pricing is reported only as supplied by the verified distributor sources and remains subject to change.
Drop-in alternatives for EP2AGZ350FH29I4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350FH29I4G (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Mounting Type, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ350FH29I3N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3550 / Unit
View Datasheet βEP2AGZ350FH29I3G
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$1450 / Unit
View Datasheet βEP2AGZ350FH29C4N
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$1245 / Unit
View Datasheet βEP2AGZ350FH29C4G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2205 / Unit
View Datasheet βEP2AGZ350FH29C3N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1920 / Unit
View Datasheet βEP2AGZ350FH29C3G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1350 / Unit
View Datasheet βEP2AGZ350FH29I4G Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Arria II GZ |
| User I/O Count | 281 I/O |
| Package | 780HBGA |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_qualified |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
EP2AGZ350FH29I4G 780hbga Pin Configuration Guide
Pin configuration for EP2AGZ350FH29I4G (780hbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350FH29I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350FH29I4G is suitable for 6 applications: Industrial Automation Controllers, Communications Infrastructure, Video and Imaging Processing, Test and Measurement Equipment, Aerospace and Defense Electronics, High-Speed Data Acquisition.
Industrial Automation Controllers
EP2AGZ350FH29I4G fits industrial automation systems that need deterministic parallel control, multiple machine interfaces, and hardware-level protocol adaptation. Its verified 281 user I/O and 780HBGA package provide a dense connection platform for sensors, actuators, encoders, motor-control peripherals, and industrial communication links. The FPGA can consolidate control state machines, timing generation, data formatting, and supervisory logic that would otherwise require several connected devices. This reduces inter-chip latency and simplifies synchronized system behavior, especially when control decisions must occur within fixed machine cycles. The 780HBGA package supports dense routing but requires careful escape planning, impedance control, and thermal analysis. The supplied data does not state operating temperature, I/O voltage standards, or transceiver count, so industrial qualification must be confirmed from the manufacturer datasheet before deployment.
Recommended
Communications Infrastructure
EP2AGZ350FH29I4G can serve as a programmable aggregation and protocol-conversion device in communications equipment where many digital channels and deterministic processing are required. The verified 281 user I/O count allows line-side control, status monitoring, framing, clock distribution, and management interfaces to be connected around a central programmable datapath. Its Arria II GZ architecture can implement parallel packet processing, interface adaptation, error handling, and traffic management without relying solely on software scheduling. The 780HBGA package is appropriate for dense infrastructure boards, but high-speed channels require verified bank rules, differential-pair routing, return-path continuity, and signal-integrity simulation. Transceiver count, supported protocols, maximum data rate, and I/O voltage are not included in the supplied evidence. Engineers should therefore confirm those parameters and the exact configuration interface in the official Arria II GZ documentation before selecting the device for a line-card or network-appliance design.
Recommended
Video and Imaging Processing
EP2AGZ350FH29I4G is a plausible platform for video and imaging systems that require parallel pixel processing, frame buffering control, synchronization, and multiple camera or display interfaces. The verified 281 user I/O count gives a board designer a large set of available external connections, while the FPGA configuration supports custom datapaths and real-time control that can be tuned for a specific image format or sensor timing. The 780HBGA package enables high connection density on a compact footprint, although it places greater demands on PCB escape routing, power distribution, and manufacturing inspection. The supplied snippets do not provide internal memory, DSP, transceiver, or clock specifications, so designers must verify those resources against the required resolution, frame rate, color depth, and processing architecture. Use manufacturer timing models and development-board examples to confirm that the selected device can meet the target pipeline before committing to the 780HBGA implementation.
Recommended
Test and Measurement Equipment
EP2AGZ350FH29I4G can support test and measurement equipment that needs simultaneous acquisition control, waveform sequencing, protocol analysis, and deterministic stimulus generation. Its verified 281 user I/O and 780HBGA package are useful when a measurement instrument must interface with many sensors, converters, triggers, and calibration paths. The programmable logic can align channels, correlate events, format data, and perform real-time preprocessing while a host processor handles configuration and higher-level analysis. The device can also consolidate timing and glue logic into a single configurable platform, reducing component count and improving repeatability. However, analog performance depends on companion converters, clocks, power integrity, and board layout; the FPGA itself does not determine measurement accuracy. Because the supplied data omits logic resources, I/O standards, and operating limits, engineers should verify the exact device resources and use the official pin and power documentation before designing a precision instrument.
Recommended
Aerospace and Defense Electronics
EP2AGZ350FH29I4G can be considered for aerospace and defense electronics when a programmable platform is needed for sensor fusion, navigation data handling, secure interface bridging, or deterministic mission-control logic. The verified 281 user I/O and 780HBGA package provide a high-density hardware integration point, while the FPGA can implement parallel processing and interface functions that must remain independent of host-software loading. This architecture is useful for combining multiple data formats, applying real-time filtering, and generating precisely timed control outputs. Qualification for these applications cannot be inferred from the commercial distributor listings. The supplied evidence does not state temperature range, radiation performance, package reliability, or AEC-Q100 status, and AEC-Q100 is generally not the correct standard for broad aerospace or defense qualification. Obtain the exact manufacturer qualification data, reliability reports, and derating guidance before using the part in flight or mission-critical hardware.
Recommended
High-Speed Data Acquisition
EP2AGZ350FH29I4G is suited to a high-speed data-acquisition architecture in which multiple digital sources must be timestamped, aligned, buffered, and transformed before transfer to a host system. The verified 281 user I/O count can connect converters, trigger networks, clock monitors, and control interfaces, while the programmable datapath can perform channel formatting and first-stage processing in hardware. A 780HBGA package provides dense interconnect but requires a power-aware PCB stack-up, short escape routes, and controlled impedance for sensitive clock and data paths. The supplied data does not provide transceiver count, maximum data rate, logic-element count, or I/O voltage, so the device cannot yet be qualified for a specific acquisition rate. Confirm the official device resources, supported I/O standards, clocking architecture, and thermal limits, then use simulation and measured test data to close the signal-integrity budget before production.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350FH29I4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350FH29I3N | EP2AGZ350FH29I3G | EP2AGZ350FH29C4N | EP2AGZ350FH29C4G | EP2AGZ350FH29C3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780HBGA | 780HBGA | 780HBGA | 780HBGA | 780HBGA | 780HBGA |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Device Density | 350 family | 350 family | 350 family | 350 family | 350 family | 350 family |
Key Differentiators
- Verified 281-user-I/O density (vs EP2AGZ350FH29I3N)
- 780HBGA package confirmation (vs EP2AGZ350FH29I3G)
- Arria II GZ 350 device positioning (vs EP2AGZ350FF35I4G)
Design Notes
Treat EP2AGZ350FH29I4G as a multi-rail FPGA design, not a single-supply logic IC. Before layout release, obtain the exact 780HBGA ball map and identify every core, I/O bank, auxiliary, ground, and configuration-related power connection. The supplied verified data does not state voltage, current, or power limits, so no numerical power estimate is supportable. Use the manufacturer power-supply sequencing requirements, select regulator transient capability for the measured load, and validate droop with simulation and oscilloscope measurements. Keep local decoupling adjacent to the relevant supply balls, provide a continuous reference plane, and separate noisy high-current paths from sensitive clock and analog sections. Recheck thermal margin using the actual configuration, clock rate, I/O toggle load, and airflow because family-level assumptions are not a substitute for device-specific power data.
The 780HBGA package requires an escape-routing plan developed from the exact ball map. Start with the official package drawing and board stack-up, then identify the shortest available fan-out for power, ground, clock, configuration, and high-speed differential pairs. Avoid routing sensitive clocks across discontinuous reference planes or through dense power-via regions. Use the manufacturer's recommended via, trace, clearance, and impedance guidance where available, and check BGA pad fabrication capability with the assembly house. The verified source confirms the package and 281 user I/O count but does not expose the complete ball assignment, so a fabricated or remembered pinout would be unsafe. Confirm the FH29 package code, pin orientation, bank assignments, and decoupling locations in the current Intel/Altera device documentation before Gerber release.
High-speed I/O performance depends on controlled impedance, continuous return paths, termination, and correct FPGA I/O-bank configuration. EP2AGZ350FH29I4G provides 281 user I/O, but the supplied snippets do not state supported I/O standards, transceiver count, maximum data rate, or timing limits. Therefore, do not select termination values or data-rate targets from the family name. After obtaining the official pin and I/O-bank tables, calculate pair geometry from the selected stack-up, minimize via transitions, maintain reference-plane continuity, and reserve clock and configuration signals from noisy regions. Simulate the worst-case channel and validate with eye diagrams, jitter measurements, and margin testing. Also verify whether the selected configuration mode requires a separate flash device, clock source, or reset strategy before freezing the interface schematic.
The most common procurement and design error is treating every Arria II GZ ordering suffix as interchangeable. EP2AGZ350FH29I4G, EP2AGZ350FH29I3N, EP2AGZ350FH29C4N, and related site-list entries may differ in speed grade, temperature designation, lead finish, or commercial ordering details that are not present in the supplied snippets. Likewise, FH29 and FF35 package codes must not be assumed to share a land pattern. Before substitution, compare the exact ordering-code decoding, package ball map, voltage requirements, temperature range, configuration database, and firmware compatibility. Maintain a controlled BOM with approved alternatives and obtain an authorized distributor cross-reference. No verified cross-brand drop-in equivalent was found in the supplied web results, so unrelated FPGA families should be treated as design migrations rather than drop-in parts.
Compliance Information
The supplied verified snippets do not state RoHS, REACH, halogen-free, lead-free, or conflict-minerals status. AEC-Q100 is not claimed for this target; obtain the exact manufacturer declaration and qualification record for the selected ordering code.
