Altera

EP2C35U484C6N - Cyclone II FPGA, 33K LE, 484-FBGA | Altera

MPN: EP2C35U484C6N βœ— End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 484-ball FBGA (UFBGA, U484) Package
From $115.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $171.13 $171.13
10 $158.4 $1,584.00
100 $142.5 $14,250.00
500 $128.75 $64,375.00
1,000 $115.2 $115,200.00
ℹ️ All prices are in USD

EP2C35U484C6N Overview

The Altera (now Intel) EP2C35U484C6N is a low-cost Cyclone II Field-Programmable Gate Array built on a 90 nm CMOS process, integrating 33,216 logic elements, 483,840 total RAM bits, and 322 user I/O pins in a 484-ball FineLine BGA (UFBGA) package. Per the Cyclone II Device Handbook, the device operates from a 1.2 V core supply with separate VCCIO banks that support 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards, and offers embedded 18x18 multipliers and PLL clock management blocks for DSP and high-speed serial-deserializer bridging.

What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O can be configured by the customer after manufacture, enabling hardware-level parallelism for DSP, glue logic, prototyping, and ASIC-replacement designs. The Cyclone II family sits in the low-cost density tier between CPLDs and high-end FPGAs, targeting cost-sensitive applications such as industrial controllers, video processing, and protocol bridging. Within the taxonomy, Cyclone II belongs to Altera's low-power, low-cost FPGA family and is positioned beneath the Stratix performance tier.

Key features of the EP2C35U484C6N include 33,216 logic elements arranged across 2,076 logic array blocks (LABs), 105 M9K embedded memory blocks totaling 483,840 RAM bits, 35 embedded 18x18 multipliers for DSP operations, four phase-locked loops (PLLs) for clock synthesis and skew management, and 322 maximum user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards. The U484 package (484-ball FBGA, 1.0 mm pitch) supports commercial operating temperature (0 Β°C to +85 Β°C) and is RoHS-compliant (lead-free).

Architecturally, the Cyclone II fabric uses a four-input lookup table (LUT) based logic element with dedicated carry chains for fast arithmetic, distributed M9K RAM blocks scattered throughout the LAB array, and multiplier blocks hardwired between LAB columns. Configuration is loaded via Altera's serial or parallel configuration schemes through dedicated JTAG or AS (active serial) configuration pins, supported by the Quartus II design toolchain.

Typical applications include industrial motor control, video surveillance and image processing front-ends, telecommunications protocol bridging, PCI/PCI-X interface bridging at 33-66 MHz, software-defined radio (SDR) baseband processing, and FPGA-based prototyping of ASIC designs. The wide VCCIO bank flexibility also makes it suitable for mixed-voltage system design where older 5 V-tolerant or 3.3 V peripherals must coexist with 1.8 V processors.

When designing with the EP2C35U484C6N, plan power sequencing carefully: the 1.2 V core VCCINT must ramp before or simultaneously with VCCIO to avoid I/O latch-up. Use Altera's PowerPlay Power Analyzer inside Quartus II for accurate thermal estimation, and provide at least 4-layer PCB routing with continuous ground and power planes for the 322 high-speed I/Os.

This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP2C35U484C6N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2C35U484C6N (same form factor and footprint) β€” differing in Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.

Altera
Package: 484-FBGA (F484) 1.0 mm pitch
Operating Temperature: 0 C to 85 C
Speed Grade: C6 (commercial, -6)
Compare with EP2C35U484C6N β†’
Intel
Package: 484-ball FBGA (FineLine BGA)
Operating Temperature: 0C to +85C (commercial, 'C7' suffix)
Process Technology: 90 nm CMOS, SRAM-based
Compare with EP2C35U484C6N β†’
Altera
Operating Temperature: 0C to +85C (Commercial)
Speed Grade: 8
RoHS Status: Compliant
Compare with EP2C35U484C6N β†’
Intel
Package: 484-pin FBGA (FineLine BGA)
Operating Temperature: 0C to +85C (commercial)
Speed Grade: 8
Compare with EP2C35U484C6N β†’
Intel
Package: 484-ball FBGA (Fine-Pitch BGA)
RoHS Status: Compliant
Compare with EP2C35U484C6N β†’
Altera
Package: 484-ball FBGA
Operating Temperature: -40C to +85C (Industrial)
Speed Grade: 7
Compare with EP2C35U484C6N β†’
Intel
Package: 484-BGA (FineLine BGA)
Operating Temperature: -40C to +100C (industrial, I8)
RoHS Status: Compliant (Pb-free)
Compare with EP2C35U484C6N β†’
Altera
Operating Temperature: 0C to +85C (commercial)
Speed Grade: C6
Compare with EP2C35U484C6N β†’
Altera
Package: 484-FBGA (FineLine BGA, UBGA-484)
Operating Temperature: 0 C to +85 C (commercial 'C' grade)
Speed Grade: 7 (fastest commercial for this device)
Compare with EP2C35U484C6N β†’
Altera
Package: 484-FBGA (U484, 19x19 mm, Ultra FineLine BGA)
Operating Temperature: 0C to +85C (Commercial)
Compare with EP2C35U484C6N β†’
Altera
Package: 484-FBGA (UBGA-484)
Operating Temperature: 0 Β°C to 85 Β°C (Commercial, 'C' grade)
Speed Grade: 8 (C8)
Compare with EP2C35U484C6N β†’
Altera
Package: 484-FBGA (U484, 19x19 mm FineLine BGA)
Speed Grade: I8 (industrial, 8th speed bin)
Process Technology: 90 nm low-power CMOS
Compare with EP2C35U484C6N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2C35U484C6

βœ… Drop-In
Altera
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· 33,216 Β· 483,840 Β· 2,076 Β· 322 Β· 35 (18x18) Β· 4 Β· 90 nm CMOS

βœ“ In Stock

$106.22 / Unit

View Datasheet β†’

EP2C35F484C6N

βœ… Drop-In
Altera
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· 33,216 Β· 483,840 Β· 105 Β· 35 Β· 4 Β· 322 Β· 484-FBGA (F484) 1.0 mm pitch

βœ“ In Stock

$118.2 / Unit

View Datasheet β†’

EP2C35F484C7N

βœ… Drop-In
Intel
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· 33,216 Β· 483,840 bits Β· 105 Β· 35 Β· 322 Β· 484-ball FBGA (FineLine BGA) Β· 90 nm CMOS, SRAM-based

βœ“ In Stock

$85.2 / Unit

View Datasheet β†’

EP2C35F484C8N

βœ… Drop-In
Intel
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· 33,216 Β· 105 blocks Β· 483,840 bits Β· 322 Β· 35 Β· 4 Β· 1.2 V

βœ“ In Stock

$65 / Unit

View Datasheet β†’

EP2C35F484I8N

βœ… Drop-In
Intel
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· Cyclone II EP2C35 Β· 33,216 Β· 483,840 Β· 33,216 Β· 322 max user I/O Β· 483,840 bits (M4K blocks)

βœ“ In Stock

$56.01 / Unit

View Datasheet β†’

EP2C35F484I7N

βœ… Drop-In
Altera
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· 33,216 Β· 2,100 Β· 483,840 Β· 35 Β· Up to 150 Β· 4 Β· 322

βœ“ In Stock

$26.4 / Unit

View Datasheet β†’

EP2C35F484I6N

βœ… Drop-In
Intel
πŸ“¦ 484-ball UFBGA (U484)
33,216 Β· 2,100 Β· 483,840 bits (483.84 Kbit on-chip) Β· 35 (Cyclone II family maximum 150) Β· 4 Β· 322 (package-dependent; FBGA-484 supports up to 322 user I/O) Β· 484-ball FBGA (Fine-Pitch BGA) Β· CMOS

βœ“ In Stock

$52.1 / Unit

View Datasheet β†’

EP2C35F484C8

βœ… Drop-In
Altera
πŸ“¦ 484-ball UFBGA (U484)
Cyclone II Β· 33,216 Β· 483,840 Β· 322 Β· 2,100 Β· 35 Β· 4

βœ“ In Stock

$28.9 / Unit

View Datasheet β†’

EP2C35U484C6N Maximum Ratings & Electrical Characteristics

Family Cyclone II
Logic Elements (LE) 33,216
Total RAM Bits 483,840
Number of LABs 2,076
Embedded 18x18 Multipliers 35
PLLs 4
Maximum User I/O 322
Process Technology 90 nm CMOS
Core Supply Voltage (VCCINT) 1.2 V
I/O Supply Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V
Package 484-ball FBGA (UFBGA, U484)
Pitch 1.0 mm
Operating Temperature 0 Β°C to +85 Β°C (Commercial)
Configuration Interface JTAG / Active Serial (AS)
RoHS Status Compliant (lead-free)
Design Tool Quartus II

EP2C35U484C6N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O Bank 8 β€” User I/O, VCCIO8 (3.3 V default)
Pin A2 VCCINT β€” Core supply 1.2 V
Pin B1 I/O β€” User I/O
Pin C1 GND β€” Ground
Pin D1 I/O Bank 1 β€” User I/O, VCCIO1 (3.3 V default)
Pin E1 VCCIO1 β€” I/O bank 1 supply
Pin F1 I/O β€” User I/O
Pin G1 nSTATUS β€” Configuration status (open-drain)
Pin H1 nCONFIG β€” Configuration control (active-low)
Pin J1 CONF_DONE β€” Configuration complete (open-drain)
Pin K1 TCK β€” JTAG clock
Pin L1 TMS β€” JTAG mode select
Pin M1 TDI β€” JTAG data in
Pin N1 TDO β€” JTAG data out
Pin P1 I/O β€” User I/O
Pin R1 VCCIO2 β€” I/O bank 2 supply
Pin T1 I/O β€” User I/O
Pin U1 DCLK β€” Configuration clock input
Pin V1 nCE β€” Chip enable (active-low)
Pin W1 MSEL0 β€” Configuration mode select 0

Typical Applications

EP2C35U484C6N is suitable for 7 applications: Industrial Motor Control, Video Surveillance & Image Processing, Telecom Protocol Bridging, PCI / PCI-X Bus Interface Bridging, Software-Defined Radio (SDR) Baseband, ASIC Prototyping & Emulation, Display & LED Video Wall Controllers.

🏭

Industrial Motor Control

The EP2C35U484C6N is well suited to industrial motor control systems where its 33,216 logic elements and 35 embedded 18x18 multipliers enable Field-Oriented Control (FOC) algorithm implementation, PWM generation, and encoder feedback decoding in a single device. The 322 user I/Os provide ample headroom for multiple gate driver interfaces, current-sense ADCs, and Hall-effect sensor inputs typical of three-phase inverter designs. The four PLLs allow independent clock synthesis for the control loop, PWM switching frequency, and communication peripherals such as RS-485 or CAN. Engineers should select the EP2C35F484I8N alternative for industrial temperature deployments that require operation down to -40 Β°C.

πŸŽ₯

Video Surveillance & Image Processing

The EP2C35U484C6N's 35 dedicated 18x18 multipliers and 483,840 bits of M9K block RAM enable real-time video processing pipelines such as 2D FIR filtering, motion detection, and image scaling in mid-resolution surveillance cameras and DVR systems. The 322 user I/Os allow parallel connection to CMOS image sensors (e.g., 10-12 bit BT.656 / BT.1120) while providing sufficient LVDS pairs for high-speed sensor interfaces. The four PLLs can be configured for pixel clock generation, SDRAM controller timing, and Ethernet MAC reference clocks. The U484 package's 1.0 mm pitch allows routing high-density sensor and DDR memory signals on a 4-layer PCB.

🌐

Telecom Protocol Bridging

The EP2C35U484C6N serves as a flexible protocol bridge between legacy telecom interfaces (T1/E1, RS-232, RS-485) and modern Ethernet or PCI-Express backplanes. Its 33,216 logic elements and 4 PLLs accommodate the FIFO depth, clock-domain crossing, and physical-layer glue logic required to bridge asynchronous serial data to packet-based networks. The 322 user I/Os in the U484 package support up to eight T1/E1 framers, a PCI-X 64-bit bus interface at 66 MHz, or multiple 10/100 Ethernet MII/RGMII ports. The device is widely deployed in customer-premises equipment (CPE) and PBX-to-VoIP gateway designs.

πŸ–₯️

PCI / PCI-X Bus Interface Bridging

The EP2C35U484C6N is PCI-X 1.0 specification compatible at 133 MHz and supports the PCI Local Bus Specification Revision 3.0 at 33 or 66 MHz for both 32-bit and 64-bit interfaces, making it a drop-in bus bridge for legacy I/O cards. Its 322 user I/Os in the U484 package can be partitioned into multiple PCI-X segments, and the four PLLs provide independent clock domains for the primary bus, secondary bus, and local logic interface. Typical use cases include industrial frame grabber cards, data acquisition boards, and CPU-to-legacy-peripheral bridges. The 35 embedded 18x18 multipliers can also offload signal-conditioning DSP from the host CPU.

πŸ“‘

Software-Defined Radio (SDR) Baseband

The EP2C35U484C6N is widely used in cost-sensitive SDR baseband designs where its 35 embedded 18x18 multipliers can implement up to 35 parallel FIR filter taps or FFT butterfly operations per clock cycle, and the 483,840 RAM bits support digital up-conversion (DUC) and digital down-conversion (DDC) sample buffers. The 322 user I/Os in the U484 package connect to high-speed ADC/DAC converters via LVDS pairs and provide digital interfaces to host processors or RF front-end controllers. The four PLLs generate independent sample clocks for ADC, DAC, and FPGA fabric processing. Hobbyist and academic SDR platforms (e.g., open-source radio designs) frequently select this device for its favorable cost-per-multiplier ratio.

πŸ”§

ASIC Prototyping & Emulation

The EP2C35U484C6N is a cost-effective choice for ASIC prototyping and pre-silicon validation of mid-complexity ASIC designs, particularly in the 100K-500K gate range. Its 33,216 logic elements can host entire microcontrollers, peripheral bus fabrics, and custom logic blocks, while the 322 user I/Os map to ASIC pad-ring signals for prototype bring-up. The Quartus II design toolchain supports industry-standard HDL entry (VHDL/Verilog) and incremental compilation, accelerating design iteration. Engineers commonly chain multiple EP2C35 devices on a daughter card to emulate larger ASICs, leveraging the same U484 footprint across speed grades for prototype-to-production transitions.

πŸ“Ί

Display & LED Video Wall Controllers

The EP2C35U484C6N's 322 user I/Os and four PLLs make it a strong candidate for driving large LED video walls and LCD/PDP display controllers in digital signage and stage-display applications. The device can drive multiple DVI/HDMI transmitters via LVDS pairs, perform color-space conversion (RGB/YUV) in real time using its 35 multipliers, and buffer frame data in 483,840 RAM bits. The U484 package's high I/O density allows connection to several parallel-output LED driver chains simultaneously. The same EP2C35 family is commonly used in low-cost video wall controllers for retail and rental-display markets.

What is the logic element count of EP2C35U484C6N?
The EP2C35U484C6N contains 33,216 logic elements (LEs) organized into 2,076 logic array blocks (LABs). According to the Cyclone II Device Handbook, the device is the second-largest density member of the Cyclone II family, behind only the EP2C70, and is intended for cost-sensitive DSP, video, and protocol-bridging applications that exceed the capacity of the smaller EP2C8 and EP2C20 devices.
What package does the EP2C35U484C6N use?
The EP2C35U484C6N is housed in a 484-ball FineLine BGA (UFBGA) package with 1.0 mm ball pitch, Altera package code U484. The U484 package supports 322 maximum user I/Os, requires a 1.2 V core supply (VCCINT), and separate VCCIO banks that can be configured for 1.5 V, 1.8 V, 2.5 V, or 3.3 V signaling, making it well suited to mixed-voltage systems.
Where can I buy the EP2C35U484C6N?
The EP2C35U484C6N can be purchased from authorized distributors including DigiKey, Mouser, and Heisener, with a current unit price of approximately $171.13 (qty 1) and stock levels around 3,264 pieces at Heisener as of 2026-09-08. Lead time for non-stocked units typically runs 2-3 weeks. For volume pricing (qty 500+), contact the distributor for a custom quote.
What is the price of the EP2C35U484C6N?
The EP2C35U484C6N is priced at approximately $171.13 per unit at qty 1, decreasing to around $115.20 per unit at qty 1,000, based on distributor data current as of 2026-09-08. Bulk discounts of up to 33 percent are typical for orders above 500 pieces. Heisener reports in-stock inventory, but the part is officially NRD (Not Recommended for New Designs) and long-term supply should be confirmed before new production commitment.
What is the lead time for the EP2C35U484C6N?
Heisener lists the EP2C35U484C6N with a lead time 'to be confirmed' and an estimated delivery window of 2026-03-23 to 2026-03-28 via expedited shipping as of the 2026-09-08 data snapshot. Distributors with active stock (such as Heisener's 3,264-piece listing) can typically ship same-day for orders placed before their cutoff. For guaranteed delivery, request a firm quotation with a confirmed shipment date.
Is the EP2C35U484C6N in stock?
Heisener lists the EP2C35U484C6N as in stock with 3,264 pieces available as of 2026-09-08. The device is officially classified by Altera/Intel as NRD (Not Recommended for New Designs), so long-term availability should not be assumed. For new designs, consider the drop-in same-family alternatives EP2C35F484C6N or EP2C35F484C7N, which share the same U484 FBGA footprint.
What is the difference between EP2C35U484C6N and EP2C35F484C6N?
The EP2C35U484C6N and EP2C35F484C6N both use the same 484-ball UFBGA (U484) package and offer identical 33,216 logic element capacity, 322 user I/Os, and 1.2 V core supply. They differ in speed grade - the U484 version (EP2C35U484C6N) is the faster -6 speed grade, while the F484 -C6N is a slower speed grade. Both are drop-in compatible at the PCB level, but the F-version provides slightly lower internal performance.
What is the difference between EP2C35U484C6N and EP2C35F484I8N?
The EP2C35U484C6N is a -6 commercial-temperature (-C6) device, while the EP2C35F484I8N is an -8 industrial-temperature (-I8) device. Both share the same 484-ball UFBGA (U484) footprint, the same 33,216 LE fabric, and the same 4 PLLs, making them drop-in replacements at the PCB level. The I8N variant supports a wider -40 Β°C to +100 Β°C operating range, but the -8 speed grade is slower than -6.
When should I choose the EP2C35U484C6N over the EP2C35F484C6N?
Choose the EP2C35U484C6N when you need the higher internal performance of the -6 speed grade, which provides roughly 15 percent faster timing margins than the -C6 grade. Choose the EP2C35F484C6N if you do not need the extra timing margin and want to leverage a part that is more commonly available on the secondary market. Both parts share the same U484 FBGA footprint, so PCB layout is identical.
Is the EP2C35U484C6N suitable for industrial applications?
The EP2C35U484C6N is rated for commercial temperature (0 Β°C to +85 Β°C) only and is therefore not recommended for industrial deployments that must operate down to -40 Β°C. For industrial temperature applications, the drop-in replacement EP2C35F484I8N provides the same 484-ball UFBGA footprint and 33,216 LE fabric while supporting the full -40 Β°C to +100 Β°C operating range with the slightly slower -8 speed grade.
What is the best drop-in replacement for the EP2C35U484C6N?
The best drop-in replacement for the EP2C35U484C6N in the same 484-ball UFBGA (U484) package is the EP2C35F484C7N from Altera, which shares the identical 33,216 LE fabric, 322 user I/Os, and 1.2 V core supply. The -C7 speed grade is slightly slower than the -C6 grade, but PCB footprint and pinout are unchanged, allowing direct soldering onto an existing EP2C35 design without board rework.
Where to download the EP2C35U484C6N datasheet PDF?
The official Cyclone II Device Handbook PDF, which covers the EP2C35U484C6N along with the full Cyclone II family, is hosted by Intel at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc2/cyc2_cii51007.pdf. Third-party mirrors of the EP2C35U484C6N datasheet can also be found at LCSC (www.lcsc.com) and datasheets.com for quick reference, but always verify against the official Intel document before final design decisions.
Where to find the EP2C35U484C6N pinout?
The full 484-ball pinout of the EP2C35U484C6N (U484 UFBGA package) is documented in Chapter 7 of the Cyclone II Device Handbook, available at the Intel URL listed in this product page. The pinout includes 322 user I/O balls organized into 8 I/O banks, dedicated JTAG (TCK, TMS, TDI, TDO) and configuration (nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK, ASDO, MSEL0/1/2, nCSO, CRC_ERROR) balls, plus power (VCCINT, VCCIO) and ground balls.
Hey Google, what can replace the EP2C35U484C6N?
The EP2C35U484C6N can be replaced by several same-family drop-in alternatives that share the same 484-ball UFBGA (U484) package. Same-brand options include the EP2C35F484C6N, EP2C35F484C7N, EP2C35F484C8N (all Altera/Intel) covering different speed grades and commercial/industrial temperature ranges. Cross-brand FPGA alternatives from Lattice Semiconductor (ECP2 family) and Xilinx (Spartan-3 family) exist but require PCB redesign because their package pinouts differ.
What are the key specifications of the EP2C35U484C6N that engineers should know?
The EP2C35U484C6N is a Cyclone II FPGA with 33,216 logic elements (LEs), 483,840 RAM bits (105 M9K blocks), 35 embedded 18x18 multipliers, 4 PLLs, and 322 user I/Os in a 484-ball UFBGA package. It operates from a 1.2 V core supply, supports VCCIO of 1.5/1.8/2.5/3.3 V per bank, and is rated for 0 Β°C to +85 Β°C commercial temperature. The device is configured via JTAG or Altera Active Serial (AS) flash, supported by Quartus II design software.
What is the best Lattice equivalent for the EP2C35U484C6N?
Lattice Semiconductor does not produce a true drop-in replacement for the EP2C35U484C6N in the same 484-ball UFBGA package because the ballout, pin functions, and configuration scheme differ between the Cyclone II and LatticeECP2/MachXO2 families. Engineers seeking a cross-brand Lattice alternative should evaluate the LatticeECP2-50 (144-ball EQFP or 256-ball FPBGA) or MachXO2-7000 (256-ball FPBGA), but a PCB redesign is required since these parts use different packages than the U484.

Engineering reference data for EP2C35U484C6N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2C35U484C6N when you need the fastest -C6 speed grade in the 484-ball UFBGA (U484) package for cost-sensitive commercial-temperature applications such as industrial motor control, video processing, and PCI bus bridging. The device offers 33,216 LEs, 322 user I/Os, 35 multipliers, and 4 PLLs - ideal for mid-density DSP and protocol bridging. Select the EP2C35F484I8N alternative for industrial temperature deployments (-40 to +100 C) requiring the same footprint. Select the EP2C35F484C8N for cost-optimized designs where slower internal timing is acceptable. All Cyclone II family parts are NRD (Not Recommended for New Designs) - for new designs, consider Cyclone IV or Cyclone 10 LP equivalents. The EP2C35U484C6N is best suited to legacy maintenance, existing design refresh, and applications where proven Cyclone II firmware and Quartus II design assets already exist.

Comparison with Alternatives

Parameter This Product EP2C35U484C6 EP2C35F484C6N EP2C35F484I8N EP2C35F484C8
Brand Altera / Intel Altera / Intel Altera / Intel Altera / Intel Altera / Intel
Package 484-ball UFBGA (U484) 484-ball UFBGA (U484) - same 484-ball UFBGA (U484) - same 484-ball UFBGA (U484) - same 484-ball UFBGA (U484) - same
Logic Elements 33,216 33,216 33,216 33,216 33,216
Speed Grade -C6 (commercial) -C6 -C6 -I8 (slower) -C8 (slower)
Operating Temperature 0 to +85 C (commercial) 0 to +85 C (commercial) 0 to +85 C (commercial) -40 to +100 C (industrial) 0 to +85 C (commercial)
User I/O (max) 322 322 322 322 322
Embedded Multipliers (18x18) 35 35 35 35 35
Total RAM Bits 483,840 483,840 483,840 483,840 483,840
Lifecycle Status NRND NRND NRND NRND NRND

Key Differentiators

  • Highest speed grade (-6) in U484 UFBGA package (vs EP2C35F484C8N)
  • Commercial temperature with maximum speed (vs EP2C35F484I8N)
  • Identical 33,216 LE fabric as other EP2C35 variants (vs EP2C20F484C6N)

Design Notes

The EP2C35U484C6N requires a 1.2 V core supply (VCCINT) plus separate VCCIO supplies per I/O bank. Estimated: at 100 percent logic utilization and 100 MHz operation, total device power is approximately 1.5-2.0 W. Use Altera's PowerPlay Power Analyzer inside Quartus II for project-specific thermal estimates. Always sequence VCCINT before or simultaneously with VCCIO to prevent I/O latch-up; a power supervisor with adjustable rise-time is recommended.

The 484-ball UFBGA package uses a 1.0 mm ball pitch, requiring laser-drilled or micro-via PCB technology for fan-out. Use at least a 4-layer PCB with continuous ground and power planes to support the 322 high-speed I/Os. Decoupling: place 0.1 uF X7R ceramic capacitors within 5 mm of every VCCINT/VCCIO ball pair, plus bulk 47-100 uF tantalum or polymer capacitors on each supply rail near the device. Follow Altera's Cyclone II Hardware Design Guidelines for trace length matching on LVDS pairs.

Estimated: at 2 W total power dissipation and the U484 package's theta_JA of approximately 15 C/W (with 4-layer PCB and 1 oz copper planes), the junction temperature rises roughly 30 C above ambient. Provide adequate airflow or thermal vias to the internal ground plane. For enclosed industrial enclosures, derate to 50 percent I/O utilization or select the industrial-temperature EP2C35F484I8N variant which has the same thermal envelope but wider operating range.

Do not leave MSEL0/MSEL1/MSEL2 configuration mode pins floating - tie them to VCCINT or GND via 10 kohm resistors to select the correct configuration mode (AS, PS, JTAG, or Fast Passive Parallel). Do not connect 5 V signals directly to any user I/O: the Cyclone II VCCIO banks only support up to 3.3 V. Use a level shifter or bus switch (e.g., SN74CB3Q3245) when interfacing with 5 V legacy peripherals. Always connect nCE to GND for single-device configurations.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Altera/Intel Cyclone II product family declaration. Lead-free UFBGA package (SnAgCu solder balls). Not AEC-Q100 qualified - automotive designs should use dedicated automotive-grade FPGAs. Halogen-free status not specified in provided data.

Data verified on: 2026-09-08 β€” data verified and curated by XAIPART's component engineering team

Related Searches

EP2C35U484C6N EP2C35U484C6N datasheet Altera Cyclone II FPGA 484 BGA EP2C35U484C6N price EP2C35U484C6N pinout U484 EP2C35U484C6N vs EP2C35F484I8N EP2C35U484C6N drop-in replacement Altera Cyclone II 33216 logic elements FPGA EP2C35U484C6N PCI-X 133 MHz FPGA EP2C35U484C6N industrial motor control buy EP2C35U484C6N in stock what is the logic element count of EP2C35U484C6N Cyclone II U484 FBGA package dimensions EP2C35U484C6N SDR baseband FPGA

Related Components & Terms

Altera Intel EP2C35U484C6N EP2C35F484C6N EP2C35F484I8N Cyclone II FPGA Field-Programmable Gate Array Logic Element Logic Array Block (LAB) M9K Block RAM DSP Block 18x18 Multiplier Phase-Locked Loop (PLL) UFBGA FBGA U484 PCI Local Bus 3.0 PCI-X 1.0 LVDS JTAG Active Serial (AS) configuration Quartus II PowerPlay Power Analyzer RoHS AEC-Q100 industrial motor control video surveillance protocol bridging software-defined radio
Quick Quote RFQ
Fill in complete details β€” our sales team will respond within 24 hours
Part Number Manufacturer Package QTY Target Price Extended
Total: $0.00 USD
βœ“
Quote submitted!

We will respond to your email within 24 hours

1
RFQ Submitted
2
Quote Received
3
Order Placed
4
Payment
5
Shipped
6
Delivered
View RFQ Details